化学镀Ni-Cu-P工艺及镀层性能研究

研究了化学镀Ni－Cu－P工艺及镀层性能。当温度控制在70～75℃、pH值控制在7．0～8．0、添加剂B的含量为2．0g／1、CuSO4含量1～2g／1时，所得镀层性能最好。镀层经热处理后，组织和性能将发生变化。发现Ni－Cu－P镀层出现最高硬度的热处理温度为500℃，超过Ni－P化学镀层出现最高硬度的热处理温度。经过正确的热处理后，镀层硬度和耐磨性优于Ni－P化学镀层，且应用温度范围较宽。

Processes and Properties of Electfoless Plating of Ni- Cu- P

The processes and propenies of electroless plating of Ni - Cu - P were investigated. It has been found out that the hest coating can be obtained when temperature and pH are controlled tvithin 70 ~ 75. and pH 7. 0 ~ 8. 0 respectively and ingredient B and CuSO4 are 2.0g/l respectively. Heat trcatment induces changes in structule and properties ofthe coating. The telnpelatule for nmimal hathess of Ni - P coating. With proper heat treatment, Ni - Cu - P coating issuperior to Ni - P coating in hardness and abrasion resistance and applicable in a wider range of temperature.