| 防渗碳刷镀镀铜的工艺参数及镀层厚度选择 |
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| 引用本文： | 谢辅洲,王桂芳,郑玉丽. 防渗碳刷镀镀铜的工艺参数及镀层厚度选择[J]. 应用科技, 2001, 28(1): 1-3 |
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| 作者姓名： | 谢辅洲 王桂芳 郑玉丽 |
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| 作者单位： | 哈尔滨工程大学 机电工程学院，黑龙江 哈尔滨 150001 |
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| 摘 要： | 研究了用刷镀镀铜防渗碳时的工艺参数对镀层防渗碳效果的影响。及渗碳时间与防渗碳所需的最小镀层厚度之间的关系。
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| 关 键 词： | 刷镀 镀铜 防渗碳 工艺参数 镀层厚度选择 |
| 文章编号： | 1009-671X(2001)01-0001-03 |
| 修稿时间： | 2000-11-08 |
The Proper ProcessParameter of Brush Copperplating and the Minimun Thickness of Copper Film for Preventionof Carburization |
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| XIE Fu-zhou,WANG Gui-fang,ZHENG Yu-li. The Proper ProcessParameter of Brush Copperplating and the Minimun Thickness of Copper Film for Preventionof Carburization[J]. Applied Science and Technology, 2001, 28(1): 1-3 |
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| Authors: | XIE Fu-zhou WANG Gui-fang ZHENG Yu-li |
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| Abstract: | In this paper, the effects of process parameter of brush copperplating on the copper film for prevention of carburization were studied; the relation between the time of carburization and the minimun thickness of copper film for prevention of carburization was established. |
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| Keywords: | brush copperplating prevention of carburization process parameter thickness of copper film |
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