| F007模拟集成电路的铝腐蚀失效及改进前后的分析对比 |
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| 引用本文： | 茅有福,张蓓榕,忻佩胜,刘耀民,卢炽宝. F007模拟集成电路的铝腐蚀失效及改进前后的分析对比[J]. 上海师范大学学报(自然科学版), 1990, 0(3) |
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| 作者姓名： | 茅有福 张蓓榕 忻佩胜 刘耀民 卢炽宝 |
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| 作者单位： | 华东师大电子系，华东师大电子系，华东师大电子系，上海元件五厂，上海元件五厂 |
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| 摘 要： | 在对铝腐蚀失效因素分析的基础上,针对工艺、材料、钝化、封装气氛等几方面提出措施,并在单项试验取得成效后,再应用于F007模拟集成电路的生产过程。经过加速寿命对比试验和对试验后样品的观察分析,表明铝腐蚀失效得到了有效防止,改进后产品的中位寿命比原产品约有一个数量级的提高。
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| 关 键 词： | 铝腐蚀失效 芯片粘接剂 表面钝化 封装环境 加速寿命试验 |
Aluminum Corrosion Failure of F007 Analog IC and Analytical Comparison Between Devices Before and After Improvement |
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| MAO YOUFU ZHANG BEIRONG XIN PEISHENG. Aluminum Corrosion Failure of F007 Analog IC and Analytical Comparison Between Devices Before and After Improvement[J]. Journal of Shanghai Normal University(Natural Sciences), 1990, 0(3) |
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| Authors: | MAO YOUFU ZHANG BEIRONG XIN PEISHENG |
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| Affiliation: | MAO YOUFU ZHANG BEIRONG XIN PEISHENG (Department of Electronic Science and Technology) LIU YUEMIN LU CHIBAO (Shanghai No.5 Component Factory) |
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| Abstract: | Based on studies of the aluminum corrosion failure, special steps were taken and aimed at the problems existed in processes, materials, passivation and encapsulation environment. After each step was examined and succeeded preliminarily, they were used into the fabrication processes of F007 IC. The results of accelerated life test have shown that aluminum corrosion failure was prevented effectively. The median life of the improved devices was increased by 9.2 times. |
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| Keywords: | aluminum corrosion failure die adhesive surface passivation encapsulation environment accelerated life test |
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