| Sn-Zn基无铅焊接材料的界面反应和润湿性能 |
| |
| 引用本文： | 梁建烈,谢世标,唐轶媛.Sn-Zn基无铅焊接材料的界面反应和润湿性能[J].广西民族大学学报,2007,13(2):83-86,101. |
| |
| 作者姓名： | 梁建烈 谢世标 唐轶媛 |
| |
| 作者单位： | 广西民族大学,物理与电子工程学院,广西,南宁,530006;广西民族大学,物理与电子工程学院,广西,南宁,530006;广西民族大学,物理与电子工程学院,广西,南宁,530006 |
| |
| 摘 要： | 总结了近年来Sn-Zn基与不同成分基板的界面反应的研究现状,概括了界面反映的主要生成物是Cu6Sn5和Cu5(Zn,Sn)两种化合物.同时总结了提高Sn-Zn基无铅焊料润湿性能所作的工作,指出在添加剂中加入金属有机物可能会成为提高焊料润湿性能的一个途径.
|
| 关 键 词： | Sn-Zn基合金 无铅焊料 润湿性能 |
| 文章编号： | 1673-8462（2007）02-0083-04 |
| 修稿时间： | 2007-04-02 |
Interface reaction and wettability of the Sn-Zn based lead-free solder alloys |
| |
| LIANG jian-lie,XIE shi-biao,TANG yi-yuan.Interface reaction and wettability of the Sn-Zn based lead-free solder alloys[J].Journal of Guangxi University For Nationalities(Natural Science Edition),2007,13(2):83-86,101. |
| |
| Authors: | LIANG jian-lie XIE shi-biao TANG yi-yuan |
| |
| Institution: | Institute of Physics and Electronic Engineering, Guangxi University for nationalities, Nanning 530006, China |
| |
| Abstract: | Interface reaction between Sn-Zn based lead-free solders and Cu substrate was Discussed,Cu6Sn5 and Cu5(Zn,Sn)compound was revealed to formed in the Interface for most Sn-Zn based lead-free solders.Work on the improving the wettability of the Sn-Zn based lead-free solders was summary,and that flux adding metal-organic addition was addressed to be a way improving the wettability of the solder. |
| |
| Keywords: | Sn-Zn based alloy interface reaction wettability |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
