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聚酰胺1010/Ag复合薄膜的制备与微结构
引用本文:程晓敏,丁利,李万里,张小明.聚酰胺1010/Ag复合薄膜的制备与微结构[J].应用科技,2007,34(5):61-64.
作者姓名:程晓敏  丁利  李万里  张小明
作者单位:安徽大学,化学化工学院,安徽,合肥,230039
基金项目:安徽省教育厅自然科学基金
摘    要:用原位化学还原法制得了聚酰胺1010表面金属(Ag)化薄膜材料,用X-射线衍射仪和傅里叶变换红外光谱仪对复合薄膜的非键合相互作用与表面结构进行了研究.金属银以纳米晶粒分散于聚合物基体中,该薄膜可用于反射和导电材料.

关 键 词:聚酰胺1010  还原  表面金属化  导电性
文章编号:1009-671X(2007)05-0061-04
收稿时间:2006-01-10
修稿时间:2006年1月10日

Studies on the preparation and micro structure of metallized(Ag) films of polyamide1010
CHENG Xiao-min,DING Li,LI Wan-li,ZHANG Xiao-ming.Studies on the preparation and micro structure of metallized(Ag) films of polyamide1010[J].Applied Science and Technology,2007,34(5):61-64.
Authors:CHENG Xiao-min  DING Li  LI Wan-li  ZHANG Xiao-ming
Abstract:Metallized(Ag) films of Ag/Polyamide1010 were obtained with in-situ chemical reductin.The non-bonded interaction and surficial structure of composite film were studied by means of FTIR and XRD.Sliver exists as nanoscale particles on the surface of polyamide,and therefore silver layer is bonded strongly on the polyamide matrix without peeling off.The film can be used as reflective and conductive materials.
Keywords:polyamidel010  reduction  suface-metallization  conductivity
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