CMP润滑方程的多重网格法求解

化学机械抛光(chemical mechanical polishing,CMP)是用于获取全局和局部高级别平面度的技术,其作用机理包含流体动力作用.求解CMP的润滑方程有助于对其作用机理的了解和认识.文中利用线松弛技术和多重网格技术进行求解,并考察了不同输入参数下的载荷与转矩等的变化情况.     

YAG基片的机械抛光研究

通过对机械抛光后的YAG表面进行了研究,结果表明:合理优化工艺参数,可获得较好的面形和较低的粗糙度,影响抛光效率的因素为磨粒、正压力和转速。采用较大粒度的磨粒,合理的增加压力和转速,有利于提高抛光效率。     

磨粒和抛光垫对铝合金化学机械抛光性能

磨粒和抛光垫为化学机械抛光(CMP)提供了重要的机械磨削作用。为了探讨磨粒和抛光垫对铝合金化学机械抛光的磨削作用,研究了不同种类磨粒和抛光垫对材料去除率和表面形貌的影响。结果表明：在pH=12-13时,氧化铝抛光液去除率(MRR)为910nm/min,远大于二氧化硅与氧化铈抛光液,且获得较为理想光滑表面。3种不同抛光垫抛光后的铝合金表面,呢子抛光垫表面将不会出现划痕与腐蚀点,表面粗糙度较低为10.9nm。随着氧化铝浓度的增加,材料去除率(MRR)和表面粗糙度(Ra)均增加。当氧化铝含量为4wt%时,抛光垫使用呢子抛光垫适宜铝合金化学机械抛光,在获得高去除率的同时铝合金表面精度高。     

单晶硅片化学机械抛光材料去除特性

根据化学机械抛光(CMP)过程中硅片表面材料的磨损行为,建立了硅片CMP时的材料去除率模型,设计了不同成分的抛光液并进行了材料去除率实验,得出了机械、化学及其交互作用所引起的材料去除率.结果表明,磨粒的机械作用是化学机械抛光中的主要机械作用,磨粒的机械作用与抛光液的化学作用交互引起的材料去除率是主要的材料去除率.     

Automatic patent document summarization for collaborative knowledge systems and services

Engineering and research teams often develop new products and technologies by referring to inventions described in patent databases. Efficient patent analysis builds R&D knowledge, reduces new product development time, increases market success, and reduces potential patent infringement. Thus, it is beneficial to automatically and systematically extract information from patent documents in order to improve knowledge sharing and collaboration among R&D team members. In this research, patents are summarized using a combined ontology based and TF-IDF concept clustering approach. The ontology captures the general knowledge and core meaning of patents in a given domain. Then, the proposed methodology extracts, clusters, and integrates the content of a patent to derive a summary and a cluster tree diagram of key terms. Patents from the International Patent Classification (IPC) codes B25C, B25D, B25F (categories for power hand tools) and B24B, C09G and H011 (categories for chemical mechanical polishing) are used as case studies to evaluate the compression ratio, retention ratio, and classification accuracy of the summarization results. The evaluation uses statistics to represent the summary generation and its compression ratio, the ontology based keyword extraction retention ratio, and the summary classification accuracy. The results show that the ontology based approach yields about the same compression ratio as previous non-ontology based research but yields on average an 11% improvement for the retention ratio and a 14% improvement for classification accuracy.     

非接触化学机械抛光的材料去除模型

探讨了化学机械抛光中抛光垫和晶片处于非接触状态下的材料去除机理, 认为磨粒对材料的去除贡献主要是通过犁削作用而实现的. 并在此基础上发展了一个用来预测抛光垫和晶片处于非接触状态下材料去除率(MRR)的新模型. 通过与实验数据的比较, 该模型对非接触状态下MRR的变化有较好的预测效果. 模型的数值模拟表明: 晶片的相对速度u与流体黏度h是影响非接触状态下MRR的最主要的两个因素; 晶片所受载荷w_z的变化对MRR也有影响, 但影响的效果和相对速度与流体黏度相比不明显; 当磨粒半径r≤50 nm时, 可以忽略磨粒尺寸的变化对MRR的影响.     

化学机械抛光多区压力系统解耦逆控制研究

针对化学机械抛光(CMP)中多区压力腔室之间的耦合、时变和非线性现象,提出一种基于模型的离线辨识十神经元在线解耦十逆控制的策略.该策略通过神经元在线实时动态解耦各区压力,离线辨识对象模型并将模型带人逆控制器中,使得系统具有快速响应能力且鲁棒性好.实验结果表明该方案具有响应速度快、超调量少、稳定性好等特点.     

Modeling Chemical Mechanical Polishing with Couple Stress Fluids

Chemical mechanical polishing (CMP) is a manufacturing process used to achieve high levels of global and local planarity. Currently, the slurries used in CMP usually contain nanoscale particles to accelerate the removal ratio and to optimize the planarity, whose rheological properties can no longer be accurately modeled with Newtonian fluids. The Reynolds equation, including the couple stress effects, was derived in this paper. The equation describes the mechanism to solve the CMP lubrication equation with the couple stress effects. The effects on load and moments resulting from the various parameters, such as pivot height, roll angle, and pitch angle, were subsequently simulated. The results show that the couple stress can provide higher load and angular moments. This study sheds some lights into the mechanism of the CMP process.     

电化学机械抛光设备与操作技术研究

本文主要介绍了电化学模具抛光设备及其原理,以及它的操作技术和技巧要点。     

纺织钢领的化学机械抛光试验

探讨了化学机械抛光(CMP)技术在细纱机的钢领后续加工中的应用.通过采用CMP与传统磨料流抛光技术的对比试验, 表明应用CMP技术后提高了钢领的加工效率和工作表面质量,证明CMP应用于钢领抛光是完全可行的.同时,对CMP抛光钢领的机理及影响因素进行了分析.试验表明,采用CMP技术抛光钢领时,钢领的表面在抛光液的作用下形成了软质层,由于该软质层的形成, 提高了抛光效率,也改善了钢领的表面质量.