Additional Polishing Process and the Pin-Up Speed Optimization for the Prevention of Linear Crack of BOC Chip

Introduction Chip crack,as shownin Fig.1,is one of fail-ures in many processes and it frequently happensafter Die-Attach process especiallyfor the thin die,such as BOC chip.With the development of semi-conductor package technologies,chip becomesthinner and thinner thus crack happens more andmore easily.As the volume of BOC product growsup,it is veryi mportant to find out howto preventchip against crack because a great deal devices arelost every month.Fig.1 I mages of chip crack1 Experi me…