Microstructure-based multiphysics modeling for semiconductor integration and packaging

Semiconductor technology and packaging is advancing rapidly toward system integration where the packaging is co-designed and co-manufactured along with the wafer fabrication. However, materials issues, in par- ticular the mesoscale microstructure, have to date been excluded from the integrated product design cycle of electronic packaging due to the myriad of materials used and the complex nature of the material phenomena that require a multiphysics approach to describe. In the context of the materials genome initiative, we present an overview of a series of studies that aim to establish the linkages between the material microstructure and its responses by considering the multiple perspectives of the various mul- tiphysics fields. The microstructure was predicted using thermodynamic calculations, sharp interface kinetic models, phase field, and phase field crystal modeling techniques. Based on the predicted mesoscale microstruc- ture, linear elastic mechanical analyses and electromigra- tion simulations on the ultrafine interconnects were performed. The microstructural index extracted by a method based on singular value decomposition exhibits a monotonous decrease with an increase in the interconnect size. An artificial neural network-based fitting revealed a nonlinear relationship between the microstructure index and the average yon Mises stress in the ultrafine interconnects. Future work to address the randomness of microstructure and the resulting scatter in the reliability is discussed in this study.     

手性药物拆分方法的研究

本通过对几种拆分手性药物的方法的列举，比较几种方法，详细介绍了几种方法的特点，以及它们的不同作用。各个方法中又列出了不同的线索，根据这些线索来研究这几种拆分的方法，它们的优缺点以及针对这些缺点的解决方法，最后给出了几个典型的用该方法的实验，以辨别它们的效用。     

平板模型表面反射以获得应力等和线的激光干涉法

本文阐述了一种利用透明平板模型前后表面反射的两束激光相干涉以获得应力等和线的方法。文中对两束表面反射激光束的相干作用作了数学解释,并给出了实验结果。这种等和线图案与传统方法所得到的等和线有所不同。除了主应力和条纹外,还有许多细栅格线,因此利用富氏光学系统可使应力条纹得到倍增。