Sn-Ag-Cu和Sn-Ag-Bi焊料在Ni-P基板上焊点剪切强度的分析

采用改进的剪切强度测试方法,对Sn-Ag-Cu,Sn-Ag-Bi无铅焊料在Ni-P基板上的焊点,经0~1 000 h热时效后的剪切强度进行了测量,并对断裂面的微观结构进行了观察分析.结果表明焊点的剪切断裂位置与焊接界面金属间化合物(intermetallic compound,IMC)的厚度有关,随着IMC的增厚,前切断列的位置将逐渐接近于IMC与基板的界面;Sn-Ag-Bi焊点的剪切强度明显高于Sn-Ag-Cu,剪切断裂则更易于发生在IMC层中.     

无铅BGA封装可靠性的跌落试验及焊接界面微区分析

通过进行BGA封装的可靠性力学试验(高加速度跌落试验),研究了机械冲击和应力对无铅BGA封装焊点的可靠性的影响,并通过对失效BGA封装焊点的微观结构和成分的SEM/EDX分析,寻找影响焊点可靠性的主要因素,研究结果表明,焊点的失效模式较为复杂,而在多数情况下,焊点的疲劳失效与焊接界面处的金属间化合物IMC层断裂有关,并对无铅焊料IMC的性质也作了研究.     

添加CeO2,Li2O和ZrO2对无铅熔块性能的改善

采用熔融法制备了无铅熔块,应用高温显微镜、热膨胀分析仪、XRD、SEM等方法研究了在无铅熔块中添加CeO2,Li2O和ZrO2等对熔块熔融温度范围、热膨胀系数、弯曲强度以及化学稳定性的影响。结果表明：CeO2可降低熔块始熔温度,提高熔融温度;添加1．5％（质量分数）Li2O后,熔块始熔温度和熔融温度都降低30～50℃;添加ZrO2可提高熔块的化学稳定性;复合使用CeO2和ZrO2等能显著提高熔块的弯曲强度．最后制得了熔融温度为850～900℃、弯曲强度大于70MPa、化学溶解失重小于100μg／cm^2的熔块。     

钎焊工艺对InAg低温焊料结构及剪切性能的影响

针对不同回流工艺曲线对In3Ag焊膏焊点表面形貌、界面IMC(Intermetallic compound)层和剪切强度的影响进行研究.采用扫描电镜(SEM)和能量色散谱仪(EDS)分别对IMC层的微观结构和焊点的组织成分进行观察和分析,采用力学试验机测试焊点的剪切强度,并通过SEM观察其断口形貌.研究结果表明:IMC层厚度随钎焊曲线峰值温度升高而增加,焊点剪切强度随峰值温度升高而降低,断裂模式为韧性断裂.其合适的钎焊工艺为峰值温度160℃,并在150℃保温1min,可得到表面光亮、润湿性能好、助焊剂残留少的焊点,其基体为富In相,在基体上弥散分布着AgIn2颗粒,IMC层是均匀、致密的扇贝状结构,厚度约为3μm,成分约为(Ag0.sCu0.2)In2;在此条件下,焊点剪切强度最高,为7.24 MPa.     

回收废弃印刷电路板焊锡的新技术

提出一种回收废弃印刷电路板焊锡的有效方法.其步骤为:在整个回收过程中不会对环境造成二次污染:用油加热废弃印刷电路板至焊锡熔化,在离心力的作用下将焊锡分离和回收.实验结果表明:当油温为240℃,转鼓转速为1 400r/min,采用间歇式的方式旋转6min,废弃印刷电路板焊锡即可回收完全.     

Isothermal section of ternary Sn-Zn-Ni phase equilibria at 250℃

Ternary Sn-Zn-Ni alloys were prepared and equilibrated at 250℃for 4-15 weeks.The phases formed in these equilibrated alloys were determined experimentally.The isothermal section of Sn-Zn-Ni system was constructed,based on the phase diagrams of the three constituent binary systems and the ternary phase equilibria data,determined in this study and referenced in literatures.12 single-phase regions were identified in the Sn-Zn-Ni ternary system at 250℃,including the three ternary compounds,δ,τ_1 andτ_2.There...     

Abnormal growth of Ag3Sn intermetalUc compounds in Sn-Ag lead-free solder

The abnormal growth of Ag3Sn intermetallic compounds in eutectic Sn-3.5% Ag solder was investigated through high-temperature aging treatment. Microstructural evolutions of this solder before and after the aging treatment were observed by optical microscopy and scanning electron microscopy. Precise differential thermal analysis was made to study the changes in enthalpies of the solder under different conditions. The results reveal that the water-cooled solder is in metastable thermodynamic state due to the high free energy of Ag3Sn nanoparticles, which sporadically distribute in the matrix as second-phase. The second-phase Ag3Sn nanoparticles aggregate rapidly and grow to form bulk intermetallic compounds due to the migration of grain boundary between primary Sn-rich phase and the Ag3Sn nanoparticles during high temperature aging treatment.     

基于统计建模的电子元件焊点图像匹配算法

为了减少现有的基于特征提取的自动光学检测系统的用户编程时间以及对用户经验的依赖,提出了一种基于统计建模的图像匹配算法.该算法首先对学习训练的焊点图片进行合格或者不合格区分;然后对合格的样本图片进行灰度级别的统计建模,获得一个标准的学习模板;再将待测元件图片经定位操作后与训练好的标准模板进行匹配,通过计算两者像素点灰度值的差值来对待测元件图片进行合格与否的判定.实验结果表明:基于统计建模的图像匹配算法的误报率小于2%,漏报率为0,且可在满足自动光学检测较高检测精度的前提下,大大减少用户对检测程序的编程时间.     

Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate

The reactive wetting kinetics of a Sn-30Bi-0.5Cu Pb-free solder alloy on a Cu substrate was investigated by the sessile drop method from 493 to 623 K.The triple line frontier,characterized by the drop base radius R was recorded dynamically with a high resolution CCD using different spreading processes in an Ar-H 2 flow.We found a good agreement with the De Gennes model for the relationship between ln(dR/dt) and lnR for the spreading processes at 493 and 523 K.However,a significant deviation from the De Gennes model was found for the spreading processes at 548 and 623 K.Our experimental results show a complicated temperature effect on the spreading kinetics.Intermetallics at the Sn-30Bi-0.5Cu/Cu interface were identified as Cu 6 Sn 5 adjacent to the solder and Cu 3 Sn adjacent to the Cu substrate.The intermetallic compounds effectively enhanced the triple line mobility because of reaction product formation at the diffusion frontier.     

BNBKT系无铅压电陶瓷的组成设计与性能研究

文章运用准同型相界线性叠加原理,设计了无铅压电陶瓷三元体系(1-x)(0.968Bi0.5Na0.5TiO3-0.032BaTiO3)-xBi0.5K0.5TiO3(简称BNBKT100x),采用传统压电陶瓷固相合成法制备BNBKT100x样品,XRD结果表明,所制备的陶瓷样品为纯的钙钛矿相,其准同型相界在0.08x0.10范围内;详细研究了BNBKT100x样品在准同型相界附近的介电、压电性能和介电弛豫特性。BNBKT100x三元体系无铅压电陶瓷在整个实验组分范围内均为弛豫铁电体,最好的电性能出现在准同型相界附近的组成BNBKT9,其介电和压电性能参数为d33=162 pC/N,kp=31%,3Tε3=2 080,tanδ=4%,Qm=119。