钢/铝回填式搅拌摩擦点焊接头界面形貌和组织研究

采用回填式搅拌摩擦点焊实现了钢和铝合金板的连接。利用光学显微镜、扫描电子显微镜和电子探针X射线显微分析仪等设备观察了钢/铝点焊接头的界面形貌,并分析了钢/铝点焊接头的力学性能与界面形貌的关联机制。结果显示,钢/铝点焊接头的断裂类型为钮扣断裂,力学性能较好。钢/铝点焊接头结合良好,未见明显的焊接缺陷。在钢/铝点焊接头界面处可以观察到钩状结构和漩涡结构,这些结构提供机械互锁效果,有利于母材的结合。钢/铝点焊接头界面处形成了主要元素为Al、Fe和Si的金属间化合物层。有效的冶金结合和机械结合是钢/铝点焊接头性能良好的主要原因。     

超细氧化物颗粒对Sn\|58Bi钎料组织及性能影响

研究了分别添加1%Al2 O3 、Fe2 O3 、SiO2 、TiO2 超细粉末对Sn-58Bi共晶钎料的润湿性、钎焊接头微观组织及力学性能影响.结果表明,氧化物粉末的添加对钎料熔点影响不大,但钎料润湿性及钎焊接头剪切强度明显提高;明显细化钎焊接头基体组织及界面金属间化合物颗粒大小,并且界面金属间化合物层厚度也有一定减薄;另外,可抑制钎焊时焊点表面Bi的氧化,因此焊点表面光亮度也有明显提高.     

Microstructural evolutions of Cu(Ni)/AuSn/Ni joints during reflow

Interfacial reactions of the Ni/AuSn/Ni and Cu/AuSn/Ni joints are experimentally studied at 330 °C for various reflow times. The microstructures and mechanical properties of the as-solidified solder joints are exam ined. The as-solidified solder matrix of Ni/AuSn/Ni presents a typical eutectic ζ ′-(Au,Ni)5Sn+ δ -(Au,Ni)Sn lamellar microstructure after reflow at 330 °C for 30 s. After reflow for 60 s, a thin and flat (Ni,Au)3Sn2 intermetallic compound (IMC) layer is formed, and some needle-like (Ni,Au)3Sn2 phases grow from the IMC layer into the solder matrix. On the other hand, a cellular-type ζ (Cu) layer is found at the upper AuSn/Cu interface in the Cu/AuSn/Ni joint after reflow for 30 s, and a (Ni,Au,Cu)3Sn2 IMC layer is also formed at the lower AuSn/Ni interface. For both joints the IMC layer grows significantly with the increase of reflow time, but the growth rate of (Ni,Au,Cu)3Sn2 IMC in the Cu/AuSn/Ni joint is smaller than that of the (Ni,Au)3Sn2 layer in the Ni/AuSn/Ni joint. The comparisons of the shear strength and fracture surface between the Ni/AuSn/Ni and Cu /AuSn/Ni joints suggest that the coupling effect of the Cu/AuSn/Ni sandwich joint is helpful to prevent the excessive growth of (Ni,Au)3Sn2, which in turn enhances the mechanic al reliability of the solder joint.     

Abnormal growth of Ag_3Sn intermetallic compounds in Sn-Ag lead-free solder

Tin-lead solders have been used for some 2000 years and applied widely in the assembly of modern elec-tronic circuits. However, Pb is harmful to the nervous system of human beings and hazardous to the environ-ment. The European Union directive on waste el…     

镍对TiAl合金层片状组织分解的影响

对镍原子百分数分别为０％,０．２％和０．５％的ＴｉＡｌ合金试样在１０５０℃和１１５０℃进行了层片组织分解退火实验。并对ＴｉＡｌ合金的铸态组织和不同条件下退火的组织进行了金相分析。结果表明：镍的加入细化了合金的铸态组织,促进了层片组织分解,显著缩短了分解退火时间。镍原子百分数为０．５％的ＴｉＡｌ合金在１１５０℃下退火１６８ ｈ即可获得均匀细小的等轴近γ组织。     

MD simulation of asymmetric nucleation and motion of h011] superdislocations in TiAl

The nucleation and propagation of h011]superdislocations in intermetallic TiAl were investigated using molecular dynamics simulations and static energetics calculation,as part of our systematic effort to understand the twining and dislocation behavior of alloys based on c-TiAl.It was found that compared to ordinary dislocations in disordered crystals,superdislocations in ordered TiAl lattice behave differently when sheared in the two opposite senses along[011]direction.This difference is due to the lower L10lattice symmetry compared with the face-centered cubic(fcc)lattice that it based on,with different yield stress and strain,and dislocation core dissociation and motion.Superdislocations nucleated in the form of loops dissociated in a planar manner into four Shockley partials separated by three kinds of faults:superlattice intrinsic stacking fault(SISF),anti-phase domain boundary(APB)and complex stacking fault(CSF),with partial separations depending on the sense of shearing and dislocation character.During loop expansion,the dislocation core changes both in width and dissociation manner depending on the character of the segment in the loop.The core contains four partials close to edge orientation,gradually changing to three fold near 60°,and finally into twofold dissociationaround 30°character.Superdislocations may have multiple critical resolved shear stresses(CRSS)for motion depending on dissociation and shearing sense even for the same slip system,with lower critical stress for the motion when SISF is in leading position.     

TbFe10.5-xMnxMo1.5化合物的结构和磁性

用X射线和磁性测量研究了Mn替代Fe对TbFe10.5-xMnxMo1.5型金属间化合物的结构和磁性的影响。X射线衍射表明：TbFe10.5-xMnxMo1.5(x=1．5，2．0，3．0，4．0，5．0)化合物均为TnMn12型四方结构，晶格常数和单胞体积均随Mn含量增加而增大。磁性测量表明：TbFe10.5-xMnxMo1.5（x=1．5，2．0，3．0，4．0，5．0)化合物的居里温度和过渡金属次晶格磁矩随Mn含量的增加而逐渐降低；x=3．0化合物的热磁曲线上出现一个非零磁矩的类似补偿点；在4．5K温度下，化合物的饱和磁矩随Mn含量的增加而缓慢减小；x=3．0时达到最小值，然后又随Mn含量的增加而迅速增大。     

SnAgCu无铅钎料对接接头时效过程中IMC的生长

无铅钎料和铜基板间金属间化合物(Intermetallic Compounds,IMC)的生长对元器件的可靠性有重要影响.使用Sn3.8Ag0.7Cu无铅钎料焊接Cu对接接头,并对对接头进行了125、150和175℃时效试验,时效时间分别为0、24、72、144、256、400 h.采用金相显微镜、扫描电镜(SEM)和能谱X射线(EDX)观察了Sn3.8Ag0.7Cu/Cu界面IMC的生长及形貌变化,并对Sn3.8Ag0.7Cu/Cu界面扩散常数和生长激活能进行了拟合.此外,研究了时效对钎焊接头抗拉强度的影响,发现在时效条件下接头的抗拉强度呈先上升后下降的变化,且时效会对断裂形式造成影响.     

纳米CuAl2-A1复合微粉热稳定性的研究

作者根据惯性约束聚变（ICF）靶材料研究的需要，采用自悬浮定向流法制备了金属间化合物CuAl2-A1纳米复合微粉．经TEM和XRD检测表明所制备的纳米颗粒基本呈球形，粒径分布在30-50nm之间，颗粒的主要组成相为CuAl2，并有少量的Cu9Al4和Al．CuAl2复合纳米微粒热稳定研究所采用的退火方案基于DTA实验数据，实验表明在DTA曲线中的548℃和769℃处的吸热峰对应着Cu9Al4向CuAl2的相转变，并伴随着一定程度的晶粒尺寸长大，并且热处理前后样品的相结构和晶粒尺寸变化的结果表明，所制备的CuAl2纳米复合微粒具有良好的热稳定性，可以用于780℃甚至更高温度下进行加工．     

非当量成分Ni_3Al基合金的有序─无序转变

利用建立在EAM（EmbeddedAtomMethod）势基础上的等效原子模型，计算了模拟非当量成分的Ni3Al基合金结构稳定性与长程有序（LRO）度的关系，结果说明：非当量成分下，Ni3Al基合金有序无序转变温度随Al含量的增加而上升；其有序无序转变为形核长大的非均匀转变过程，理论上不存在稳定的均匀部分有序结构；其介稳的部分状态组织为完全有序区和完全无序区的混合组织．该结果能解释实验中所观察到的Ni3Al基合金有序无序转变。