镍和锡金属粉末烧结特性的研究

对镍粉和锡粉烧结形成金属间化合物的过程、结构特征以及烧结体的性能特点进行了研究。结果表明，镍和锡混合粉经混合、100kN预压、300kN温压成型后，于100℃烧结、保温15h工艺条件下，形成了Ni3Sn2，Ni3Sn，NigSn4和NiSn金属间化合物；随着烧结温度的提高和保温时间的延长，镍和锡混合粉烧结体的密度和硬度都呈上升的趋势。     

Effect of the microstructure of Al 7050-T7451 on anodic oxide formation in sulfuric acid

The effect of the microstructure of an Al 7050-T7451 substrate on the anodic oxide formation in sulfuric acid was studied in this article. The microstructure of the substrate was assessed by optical microscope (OM) and transmission electron microscope (TEM). The surface and cross-section morphologies of the oxide films were examined by scanning electron microscope (SEM). The chemical composition of intermetallic particles in the alloys and films was investigated using energy dispersive spectroscope (EDS). The roles of intermetallic phases and grain or subgrain boundaries on the oxide film formation were researched using the potentiodynamic and potentiostatic polarization technique in sulfuric acid solution. The results show that the transition of coarse intermetallic particles or grain (subgrain) boundaries at the surface of Al alloys can be characterized by potentiodynamic polarization curves. The surface and cross-section micrographs of the anodic layer seem to preserve the microstructure of the substrate. Large cavities in the anodic films are caused by the preferential dissolution of coarse AItCuMg particles and the entrance of Cu-rich remnants into the electrolyte during anodizing. The Al₇Cu₂Fe particles tend to be occluded in the oxide layer or lose from the oxide surface because of peripheral trenching. Small pores in the films are induced by the dissolution of precipitates in grain or subgrain boundaries. The film surface of recrystallized grain bodies is smooth and homogeneous.     

TiB_2粒子增强Ti-Al基复合材料的合成机理

采用Ti、Al和B元素粉末,经燃烧反应合成了TiB_2粒子增强的Ti Al金属间化合物基复合材料,并用DSC、EMPA和XRD等方法研究了其合成机理。结果发现,Ti和Al粉末间的放热反应促进了 TiB_2粒子的形成,所形成的 TiB_2粒子的尺寸约为2μm。将所得复合材料重熔后,TiB_2粒子的尺寸、相对含量和形貌没有明显变化,并且其显微组织比铸态Ti Al基合金组织明显细化。     

使用金属蒸汽真空弧离子源的金属离子注入

用金属蒸汽真空弧离子(MEVVA)源注入金属离子,能以较低的离子能量而获得较厚的注层.掺杂浓度高,容易诱生金属间化物沉淀,是一种有工业应用价值的强流离子源.讨论了注入原子的状态和分布特征,说明了 MEVVA 源可能的使用前景.     

机械合金化制备MoSi_2和Mo_5Si_3

用机械合金化方法制得了ＭｏＳｉ２粉末和Ｍｏ５Ｓｉ４非晶粉末，Ｍｏ５Ｓｉ３非晶经１０００℃真空退火后晶化成Ｍｏ５Ｓｉ３晶体，用ｘ射线衍射研究了机械合金化过程中粉末结构变化规律。     

强流金属离子注入分布计算中的几个参数

利用强束流离子注入过程中杂质扩散的数学模型,研究了部分对浓度分布影响较大的参数、试图分析和理解用MEVVA源注入金属的复杂过程。发现靶温是影响杂质分布及穿透深度的主要因素,化学反应有正效应和负效应之分;相关系数是一个重要的物理量,它跟原子-靶材料的组合有关。     

SnBi/Cu焊接接头的剪切性能及界面微观组织分析

通过对断口形貌和界面微观组织的观察分析,研究了3种Sn-Bi/Cu焊接接头的剪切断裂机理.结果表明:3种Sn-Bi/Cu焊接接头均在弹性变形阶段断裂,并且均沿Sn-Bi焊料/Cu基板界面处断裂.孔洞降低了3种Sn-Bi/Cu焊接接头的有效连接面积,从而降低了其剪切强度.根据3种Sn-Bi/Cu焊接接头断口形貌,Sn59.9Bi40Cu 0.1/Cu和Sn57.9Bi40Zn2Cu 0.1/Cu焊接接头剪切断裂机制属于准解理、沿晶脆性断裂和韧窝的混合型断裂,而Sn42Bi58/Cu焊接接头剪切断裂机制属于准解理断裂.微观组织分析显示,3种焊料合金焊接接头界面处的金属间化合物层均为连续的Cu₆Sn₅相.     

激光熔覆Ni-Si基复合涂层组织与性能

利用激光熔覆技术在Ni基高温合金表面制备(Ti,W)C陶瓷增强Ni-Si金属间化合物基复合涂层.通过SEM、XRD、EDS等方法研究涂层相及组织,并测量其显微硬度.结果表明,熔覆层与基体呈冶金结合,结合质量良好;熔覆层主要由Ni固溶体、Ni3(Si,Ti)金属间化合物和(Ti,W)C复相陶瓷组成;熔覆层组织均匀,硬度较高.     

Abnormal growth of Ag3Sn intermetalUc compounds in Sn-Ag lead-free solder

The abnormal growth of Ag3Sn intermetallic compounds in eutectic Sn-3.5% Ag solder was investigated through high-temperature aging treatment. Microstructural evolutions of this solder before and after the aging treatment were observed by optical microscopy and scanning electron microscopy. Precise differential thermal analysis was made to study the changes in enthalpies of the solder under different conditions. The results reveal that the water-cooled solder is in metastable thermodynamic state due to the high free energy of Ag3Sn nanoparticles, which sporadically distribute in the matrix as second-phase. The second-phase Ag3Sn nanoparticles aggregate rapidly and grow to form bulk intermetallic compounds due to the migration of grain boundary between primary Sn-rich phase and the Ag3Sn nanoparticles during high temperature aging treatment.     

Theoretical study on Fe-Al clusters: geometric structure, bonding law and electronic structures

Structures of the small Fe-Al clusters with different atom proportion are calculated using the B3LYP method in density functional theory (DFT). Calculated results show that the Al atoms lose electrons easily while the Fe atoms capture electrons easily. The most stable geometry is the bonding between Fe and Fe atoms and between Fe and Al atoms with the largest possibility, and the cluster stability law with the same atom proportion accords with the change of the highest occupied molecular orbital (HOMO) energy and the entropy of cluster system. Moreover, the electronic structure study of the ground-state Fe3Al and Fe2CrAl clusters shows that the substitution of Cr atom for the Fe atom located at the next neighboring site of Al atom reduces localized electrons not only between Al atom and the next neighboring Cr atom, but also between Al atom and the nearest neighboring Fe atom. Although the substitution increases the plasticity and the magnetism of intermetallic compound, the stability of the system slightly decreases. Our theoretical results agree well with the experimental results.