GaN基量子阱激光器交叉饱和特性的计算与分析

通过分析GaN能带结构和跃迁矩阵元,对GaN基量子阱激光器的交叉饱和特性作了理论上的计算与分析．并给出了TE和TM模自身交叉与相互交叉的交叉饱和系数的曲线,分析了能带结构和载流子面密度对交叉饱和特性的影响。发现相互作用的两光场频率相等时,两光场的交叉饱和系数出现峰值,两光场频率不等时相应的交叉饱和系数远小于峰值;同时发现在交叉饱和系数峰值处,不同载流子面密度将对交叉饱和系数产生不同的影响,因此,载流子面密度的改变可影响交叉饱和系数。     

GaN-based substrates and optoelectronic materials and devices

In order to solve the problems of GaN heteroepitaxy on sapphire substrate,some techniques were explored.Freestanding GaN substrates have been made by hydride vapor phase epitaxy(HVPE),laser lift-off(LLO),and chemical mechanical polishing techniques.Wafer bending and cracking in the HVPE growth were partly settled by pulsed flow modulation method.High-crystal quality was established for 1.2 mm thick GaN substrate by X-ray diffraction measurement,in which the full width of half maximum values were 72,110 arcsec for(102),(002)peaks.A novel micro-size patterned sapphire substrate(PSS)and a nano PSS were also fabricated.High-power vertical structure light emitting diodes(VSLEDs)have been developed by Au–Sn eutectic wafer bonding,homemade micro-area LLO,and light extraction structure preparation.The high-injection-level active region with low temperature GaN sandwiched layers was used for lowefficiency droop.The light output power of VSLED was achieved as 400 mW driven at 350 mA,and the dominant wavelength is about 460 nm.The structures and properties of strain modulated superlattices(SLs)and quantum wells as well as advanced simulation of carriers transport across the electron blocking layer were investigated in laser diodes.The hole concentration was achieved as high as1.6 9 1018cm-3in AlGaN/GaN SLs:Mg by inserting an AlN layer.High-quality AlGaN epilayers and structures were grown by MOCVD.Some device structures of UV LEDs and detectors were demonstrated.The emission wavelength of 262 nm UV LED has been successfully fabricated.At last,high-quality InN and InGaN materials for solar cell were grown by boundary-temperature-controlled epitaxy and growth-temperature-controlled epitaxy.Hall-effect measurement showed a recorded electron mobility of 3,280 cm2/(V s)and a residual electron concentration of 1.47 9 1017cm-3at 300 K.     

不同掺杂元素对GaN基材料发光性能影响研究进展

由于GaN材料本身具有的极大优越性,如大禁带宽度、高临界场强、高热导率、高载流子饱和速率、高异质结界面二维电子气浓度等,决定了GaN基材料及其器件在发光半导体材料领域中的重要地位,而高质量GaN的掺杂制备一直是研究者关注的热点.本文根据近几年国内外对掺杂GaN基材料的研究成果,总结概括了IIA族、过渡族以及稀土族元素对GaN的掺杂,分析讨论了不同掺杂元素对GaN基材料发光性能的影响,并以Mg掺杂GaN为例,对比了各种掺杂技术的优缺点.     

CdS纳米棒的合成及硫源的影响

溶剂热法合成CdS纳米棒,分别考察了反应介质尤其是硫源对CdS生成的影响.采用X射线衍射(XRD)、扫描电子显微镜(SEM)、紫外-可见吸收光谱(UV-Vis)等对合成的CdS纳米棒的形貌和结构进行分析、表征.结果表明,以乙二胺为溶剂可以合成出CdS纳米棒,不同硫源合成的CdS纳米棒长度明显不同,这可能与硫源的水解释放S2-机理有关.     

GaAs衬底生长的立方GaN晶片键合技术

利用晶片键合技术通过多层金属膜成功地把立方相GaN LED结构键合到新衬底Si上, 并且利用湿法腐蚀技术去掉了原GaAs衬底. SEM和PL观察表明, 利用键合技术可以完整地把立方相GaN外延薄膜转移到新的衬底上而不改变外延层的物理和光学性质. XRD(S射线衍射)结果分析显示, 键合后的样品中出现了新的合金和化合物: AuGa₂, Ni₄N, 意味着用来作为黏附层和形成Ohm接触的Ni/Au膜与p-GaN形成了紧密的结合, 保证了金属膜与GaN层的牢固度和界面的小接触电阻, 成功地完成了键合, 为下一步以GaAs吸收衬底生长的GaN基器件的研制打下了基础.     

GaN(110)表面原子及电子结构的第一性原理研究

用缀加平面波加局域轨道方法计算了立方GaN及其非极性 ( 1 1 0 )表面的原子结构和电子结构 ,得到的GaN晶格常数及体积弹性模量与实验值符合得很好 .用层晶超原胞模型计算立方GaN ( 1 1 0 )表面的原子和电子结构 ,发现表面顶层原子发生键长收缩并旋转的弛豫特性 ,表面阳离子向体内移动 ,与周围阴离子形成sp2 杂化 ,而表面阴离子则形成p3 型锥形结构 .其面旋角为 1 4 .1°,比传统的Ⅲ V族半导体 ( 1 1 0 )表面面旋角 ( 30°± 2°)小得多 ,这主要与材料的离子性有关 .此外 ,在带隙附近还发现了两个表面态 ,一个是占据的表面态 ,主要是由N的p电子构成的 ;另一个是空态 ,主要由阳离子的轨道构成 .在驰豫后 ,这两个表面能带都移出带隙 ,分别进入导带和价带 ,形成共振表面态     

不同形貌氧化锌纳米棒的CVD法制备及生长机制讨论

采用CVD技术制备了不同形貌的ZnO纳米棒.并利用XRD、SEM、能谱仪、荧光光谱仪对比研究了其表面结构、成份、相结构及光致发光特性.结果表明,样品形貌随着沉积位置的变化而变化,其生长遵循金属自催化机制.并且表明离子化氧空位的存在有利于ZnO的绿光发射.     

包含Kink效应的改进型GaN HEMTs模型

提出了一种GaN高电子迁移率晶体管（HEMTs）建模方法.该模型以ADS（advanced design system）中的符号定义器件SDD（symbolically defined device）为基础,结合宽带S-参数与脉冲直流测试数据,对GaN器件进行精确建模.本文所用晶体管为双指AlGaN/GaN HEMT器件,其栅长为90 nm,单指栅宽为40 μm.数据测试采用在片测试方法,在常规S参数测试和直流测试基础上,增加了脉冲直流测试,并针对测试数据体现的Kink效应和阈值电压漂移现象进行建模.研究结果表明,该模型可以准确拟合器件0~110 GHz S参数及直流特性,谐波平衡仿真显示该模型具有良好的收敛特性,可用于GaN HEMTs器件电路仿真.      

前驱物中温固相法合成硼酸镍纳米棒

以草酸为结构导向剂,硝酸镍、硼酸为原料,室温同相反应得到前驱物,将前驱物于750℃焙烧得到硼酸镍纳米棒．采用x射线衍射（XRD）、扫描电镜（SEM）、透射电镜（TEM）和红外光谱（FT～IR）对产物结构和形貌进行表征．结果表明产物为分布均匀的Ni3（BO3）。纳米棒,纳米棒长度受硝酸镍和硼酸的物质的量之比影响,比例越小,长度越大．当n（H3BO3）／n（Ni（NO3）2）为4：1时,纳米棒直径为300-400nm,长度为3～4μm     

Fabrication and photoluminescence of GaN nanowires prepared by ammoniating GaeO3/BN films on Si substrate

GaN nanowires were successfully prepared on Si（111） substrate through ammoniating Ga203/BN films deposited by radio frequency magnetron sputtering system. The synthesized nanowires were confirmed as hexagonal wurtzite GaN by X-ray diffraction, selected-area electron diffraction and Fourier transform infrared spectra. Scanning electron microscopy and transmission electron microscopy revealed that the grown GaN nanowires have a smooth and clean surface with diameters ranging from 40 to 160 nm and lengths typically up to several tens of micrometers. The representative photoluminescence spectrum at room temperature exhibited a strong UV light emission band centered at 363 nm and a relative weak purple light emission peak at 422 nm. The growth mechanism is discussed briefly.