对象持久层的设计

描述了面向对象应用与关系数据库之间对象持久层的设计，提出了针对基本维护性数据的改进持久层性能的方案，并分析了这种方案的可行性。     

可见光响应的Ag3VO4/TiO2制备及其催化活性的研究

采用微波辅助溶胶-凝胶方法制备了对可见光响应的Ag₃VO₄/TiO₂纳米光催化剂,并对制备的样品进行XRD、UV-Vis DRS、N₂吸附-脱附、SEM等表征。结果表明,Ag₃VO₄掺杂量的不同,对光催化降解效果有不同的影响。Ag₃VO₄掺杂量为1 %时,Ag₃VO₄/TiO₂复合光催化剂具有较强的催化性能,而随着Ag₃VO₄掺杂量的增加,催化剂的活性逐渐降低。用500 ℃煅烧的掺杂量为1 %的Ag₃VO₄/TiO₂复合光催化剂降解罗丹明B,4 h后降解率可以达到80 %。     

X射线聚焦望远镜镜片装配一体化建模和仿真

针对圆锥嵌套式Wolter-I型X射线聚焦望远镜镜片装配过程,基于Abaqus有限元软件建立了三维自适应一体化建模和仿真算法流程。利用Python语言结合Abaqus脚本接口进行二次开发,提出自适应建模仿真算法,并可精确获取不同工况下镜片的应力分布、面形偏差分布等结果。同时,在此基础上进行图形用户界面(GUI)二次开发,形成了可操作性更好的插件,大大提高了仿真效率和精度,节约了实验和人工成本。仿真结果给出了理想的镜片厚度及最佳装配载荷,并给出了更合理的面形偏差的评估方法,为光路分析以及指导实际装配过程提供了重要的理论依据。     

孤独症谱系障碍儿童的动作模仿能力：基于行为和脑科学的视角

 从行为科学和脑科学的视角综述了孤独症谱系障碍（autism spectrum disorder，ASD）儿童动作模仿障碍的研究现状，分析了有关模仿障碍行为表现和脑机制的研究结果，回顾并评价了现有动作模仿障碍的测评工具和干预方法。     

Optimization of mechanical properties of Sn-3.8Ag-0.7Cu alloys by the additions of Bi,In and Ti

Bi, In and Ti were added to Sn-3.8Ag-0.7Cu (SAC387) solder alloy to optimize the mechanical performance. The alloying effects of Bi, In and Ti on the microstructure, thermal and mechanical properties of SAC387 based solder alloys were investigated. The results demonstrate that adding 3.5 ?wt % of Bi could refine the microstructure, optimize the thermal properties, and improve the tensile strength. Meanwhile, the ductility of the solder alloys reduced evidently. Adding 2.8 ?wt % of In into SAC387–3.5 ?wt %Bi alloy could increase both the strength and ductility, which is attributed to the beneficial effect of In addition, as adding In could improve the solubility of Bi in the β-Sn matrix. Meanwhile, the melting point was reduced, and the wettability improved with the addition of In. Introducing amounts of Ti into SAC387–3.5 ?wt % Bi-2.8 ?wt % In alloy could further increase the strength. However, the ductility was significantly reduced when 0.8 ?wt % of Ti was added due to the formation of the coarse Ti₂Sn₃ phase. The undercooling was remarkably reduced with the addition of Ti. The nanoindentation tests demonstrate that the hardness increased mainly due to the hardening effect of the Bi addition. Among all the samples prepared, alloy SAC387–3.5 ?wt % Bi exhibited the highest creep resistance at the ambient temperature. Further adding In and Ti into SAC387–3.5 ?wt % Bi alloys reduced the creep resistance of the solder alloys. The mechanism associated with the different mechanical responses is also discussed in this study.