Ni2MnGa铁磁形状记忆材料

铁磁形状记忆合金 (FSMA)是在一定温度范围马氏体相稳定同时又具铁磁性的一类特殊的形状记忆合金。Ni2MnGa铁磁形状记忆合金近年来成为呈现磁场驱动大应变的新型驱动材料 ,这些应变来自磁场诱发马氏体孪晶的重排 ,而不是磁场对奥氏体至马氏体相变的作用。孪晶变体的重排在宏观上呈现为正或切应变 ,一非化学计量比Ni2 MnGa单晶于室温加 0 .4T磁场能产生6 %的应变 ,Ni Mn Ga单晶在高至 15 0Hz的交变磁场仍可得到 2 .5 %的应变。本文阐述了与这种磁控形状记忆效应相关的孪晶界迁动的磁学和晶体学理论。马氏体相的大磁晶各向异性能使磁化沿c轴方向有利 ,穿过孪晶界c轴刚好转动 90度 ,同时 ,这个孪晶界也构成了约 90度的畴界。在各向异性的情况下 ,孪晶界的迁动仅有相邻孪晶变体的Zeeman能差驱动 ,μ0 ΔMis·Hi。磁场和外应力对应变的影响通过对一简单的自由能表达式取极小值来表示 ,自由能表达式包括Zeeman能、磁晶各向异性能和外应力以及在某些情况下需考虑的内部弹性能 ,模型的所有参数可通过应力 应变曲线和磁化曲线测量得到。铁磁形状记忆合金的磁场诱发应变可类比传统热弹性形状记忆效应 ,与更为人们所熟知的磁致伸缩现象不同。     

Simulation of mode conversion at the magnetopause

Two-dimensional(2-D)and three-dimensional(3-D)hybrid simulations are carried out for mode conversion from fast mode compressional wave to kinetic Alfvn waves(KAWs)at the inhomogeneous magnetopause boundary.For cases in which the incident fast wave propagates in the xz plane,with the magnetopause normal along x and the background magnetic field pointing along z,the 2-D (xz)simulation shows that KAWs with large wave number kxρi～1 are generated near the Alfve′n resonance surface,whereρi is the ion Larmor radius.Several nonlinear wave properties are manifest in the mode conversion process.Harmonics of the driver frequency are generated.As a result of nonlinear wave interaction,the mode conversion region and its spectral width are broadened.In the 3-D simulation,after this first stage of the mode conversion to KAWs with large kx,a subsequent generation of KAW modes of finite ky is observed in the later stage,through a nonlinear parametric decay process.Since the nonlinear cascade to ky can lead to massive transport at the magnetopause,the simulation results provide an effective transport mechanism at the plasma boundaries in space as well as laboratory plasmas.     

High-performance thin-film transistors using semiconductor nanowires and nanoribbons

Thin-film transistors (TFTs) are the fundamental building blocks for the rapidly growing field of macroelectronics. The use of plastic substrates is also increasing in importance owing to their light weight, flexibility, shock resistance and low cost. Current polycrystalline-Si TFT technology is difficult to implement on plastics because of the high process temperatures required. Amorphous-Si and organic semiconductor TFTs, which can be processed at lower temperatures, but are limited by poor carrier mobility. As a result, applications that require even modest computation, control or communication functions on plastics cannot be addressed by existing TFT technology. Alternative semiconductor materials that could form TFTs with performance comparable to or better than polycrystalline or single-crystal Si, and which can be processed at low temperatures over large-area plastic substrates, should not only improve the existing technologies, but also enable new applications in flexible, wearable and disposable electronics. Here we report the fabrication of TFTs using oriented Si nanowire thin films or CdS nanoribbons as semiconducting channels. We show that high-performance TFTs can be produced on various substrates, including plastics, using a low-temperature assembly process. Our approach is general to a broad range of materials including high-mobility materials (such as InAs or InP).