聚氨酯／双酚A环氧树脂互穿网络体系力学性能研究

用同步法合成了聚酯型聚氨酯／双酚Ａ环氧树脂互穿网络聚合物ＩＰＮ，测定了产物的力学性能，探讨了ＩＰＮ中聚氨酯对环氧树脂增韧过程，结果表明，当ＩＰＮ中聚氨酯／环氧树脂＝１５／１００（质量比）时，增韧效果较为理想，产物的综合力学性能最佳，而且通过ＩＰＮ增韧法与半－ＩＰＮ增韧法对比，发现ＩＰＮ的综合合增韧效果优于半－ＩＰＮ。     

关于一类无限群——SC—群（Ⅱ）

若群Ｇ的同阶元均在Ｇ中共轭，则称群Ｇ为ＳＣ－群。本文给出了可解ＳＣ－群，剩余有限ＳＣ－群的剩余中心ＳＣ－群的刻划。并对所为奇阶元ＳＣ－群进行了探讨。     

可溶性淀粉还原性研究

普通淀粉被制为可溶性淀粉时能显现还原性．其强度可用Somogyi比色法测定．进而可换算其平均分子量和聚合度．     

科技奖励中评审结果的可信度研究

本文运用社会统计学的相关分析和回归分析等方法，研究科技奖励过程中的越轨行为。研究发现，在同行评议专家的选择、同行评议过程和对获奖成果的评价等科技奖励全过程中都存在着不同程度的越轨，从而影响了科技奖励的公正性和客观性     

关于余作用交叉积的顺从性

设δ为局部紧群G在C*代数A上的余作用，证明了对任一C*代数B有一G在AB上的余作用δ使得（A×δG）B≈（AB）×δG，因此得到若A顺从，则A×δG顺从．     

新型乙醇气敏半导体材料CdFe_2O_4

采用化学共沉淀和固相反应相结合的方法制备出单相ＣｄＦｅ２Ｏ４，实验表明，ＣｄＦｅ２Ｏ４作为一种尖晶石型结构的复合氧化物，是电子导电型半导体，具有良好的酒敏性能．且有较好的化学稳定性和气敏稳定性     

Synthesis of glucoside compounds of ferrocenyl phenols and their antianemic activity

Six glucoside compounds have been synthesized by means of phase-transfer catalytic method and deacetylation from the starting material ferrocene. Their structures have been confirmed by elementary analysis, IR,¹HNMR and MS. The antianemic activities of some compounds have also been tested. Results indicate that these glucoside compounds possess the antianemic activities and therefore, the further study is well worth making. Supported by the foundation of Wuhan Metropolis Commission of Science and Technology Liu Huiying: born in 1937, Professor     

Collaborative applications based on the internet

The basic concepts of collaborative applications and some relevant aspects about network communications are introduced. With the examples of some collaborative applications developed by us, several technical problems about collaborative applications, such as loss of data packets, unknown IP address and timedelay, are discussed in detail. And the methods of solving these problems are also provided. Supported by International Cooperation Project (Japan, Jincheng Co. Ltd) Fang Rui: born in 1975, Graduate student     

陶瓷与金属的氧化物封接料制备及其封接工艺

用混合熔烧的方法，制备出一种氧化物封接料．该封接料能在７００℃下对氧化铝瓷与铜及铜合金进行气密性封接．在封接中，只需将封接料涂在陶瓷体的封接面，套上金属件，在马弗炉中以５℃／ｍｉｎ升温到７００℃后保温１０ｍｉｎ即可．对封接体所作的拉伸强度和气密性质量检测表明，封接界面的抗拉强度高于陶瓷本体强度，界面对空气的漏率小于１．４×１０－９Ｐａｍ３／ｈ，满足工业部门对封接质量的要求．