高校图书馆知识管理浅谈

知识管理是知识经济时代的一种全新的管理思想。阐述了高校图书馆在对自身实施知识管理时应注意的环节、存在的问题以及所要避免陷入的几个误区，并对未来的知识管理进行了展望。     

Research Frontiers of Agricultural Economics and Management

The focus of research on Agricultural Economics and Management (AEM) has been switching from de-veloped countries to developing countries. In important international journals on AEM such as ““American Jour-nal of Agricultural Economics““ and ““Agricultural Eco-nomics““, the research objectives mainly focus on AEM problems in developing countries, e.g. the effects ofglobalization and liberalization on agricultural produc-tion in developing countries, and problems in agricul-tural resources and environmental protections in devel-oping countries.     

Fabrication and Properties of CoSm-Based Multilayer Thin Films

In recent years, SmCo series thin films have been found to be good candidates for fabricating integrated electromagnetic components and ultrahigh density magnetic recording media[1,2]. Up to now,intensive studies of such films have been carried out in order to obtain appropriate microstructure, crystallographic orientation and other properties. Substitution of Cu or Ni for Co in SmCo/Cr series films leads to a decrease of the saturation magnetization, magnetic switching volume, and to an increase of uniaxial anisotropy and coercivity[3-5].Various deposition conditions have also been investigated[6]. The large increase in coercivity for the annealed SmCo/Cr films is due to the growth of crystallitest[7,8]. In this article, we report a study of the deposition process,structure, and magnetic behavior of sputtered Sm (Co,Cu, Ti)/Cr series thin films.     

A Theoretical Approach for Estimating Fracture Toughness of Ductile Metals

Fracture toughness is very important when applying Damage Tolerance Design and Assessment Techniques. The traditional testing approach for obtaining fracture toughness values is costly and time consuming. In order to estimate the fracture toughness of ductile metals, the fracture mechanics theory, materials plastic deformation theory and materials constructive relationships are employed here. A series of formulae and a theoretical approach are presented to calculate fracture toughness values of different materials in the plane stress and plane strain conditions. Compared with test results, evaluated values have a good agreement.     

Collaborative Project Management: A Systemic Approach to Heavy Equipment Manufacturing Project Management

Quite often over the last decade, heavy equipment manufacturers are trying to improve their project management performance with the use of effective project management methods. However, the challenges encountered aren’t isolated problems and a systemic approach is required. This paper exemplifies how a systemic approach can be applied to heavy equipment manufacturing project (HEMP) management, through of a multifaceted vision. The findings present in the paper are based on a two-year case study in a metallurgic equipment manufacturing enterprise in China. Based on the analysis of HEMP management problems and the contributions on systemic approach application in project management, the paper enriches existing theory by: (1) interpreting the HEMP management system with the top-down disassembly method; (2) developing the collaborative project management approach with a systems view highlighting the project characteristics management and inter-departmental collaboration; (3) making suggestions for systemic approach application in project management. For practitioners and researchers, the findings are particularly meaningful for manufacturing project management and systemic approach application.     

On-chip natural assembly of silicon photonic bandgap crystals.

Photonic bandgap crystals can reflect light for any direction of propagation in specific wavelength ranges. This property, which can be used to confine, manipulate and guide photons, should allow the creation of all-optical integrated circuits. To achieve this goal, conventional semiconductor nanofabrication techniques have been adapted to make photonic crystals. A potentially simpler and cheaper approach for creating three-dimensional periodic structures is the natural assembly of colloidal microspheres. However, this approach yields irregular, polycrystalline photonic crystals that are difficult to incorporate into a device. More importantly, it leads to many structural defects that can destroy the photonic bandgap. Here we show that by assembling a thin layer of colloidal spheres on a silicon substrate, we can obtain planar, single-crystalline silicon photonic crystals that have defect densities sufficiently low that the bandgap survives. As expected from theory, we observe unity reflectance in two crystalline directions of our photonic crystals around a wavelength of 1.3 micrometres. We also show that additional fabrication steps, intentional doping and patterning, can be performed, so demonstrating the potential for specific device applications.     

Superconductivity in CaCuO2 as a result of field-effect doping.

Understanding the doping mechanisms in the simplest superconducting copper oxide-the infinite-layer compound ACuO2 (where A is an alkaline earth metal)-is an excellent way of investigating the pairing mechanism in high-transition-temperature (high-Tc) superconductors more generally. Gate-induced modulation of the carrier concentration to obtain superconductivity is a powerful means of achieving such understanding: it minimizes the effects of potential scattering by impurities, and of structural modifications arising from chemical dopants. Here we report the transport properties of thin films of the infinite-layer compound CaCuO2 using field-effect doping. At high hole- and electron-doping levels, superconductivity is induced in the nominally insulating material. Maximum values of Tc of 89 K and 34 K are observed respectively for hole- and electron-type doping of around 0.15 charge carriers per CuO2. We can explore the whole doping diagram of the CuO2 plane while changing only a single electric parameter, the gate voltage.     

基于OBB层次结构碰撞检测的改进算法

方向包围盒（Oriented bounding box：OBB）的构造以及包围盒的相交测试的计算量都比较大，严重影响了在模拟、仿真的应用，尤其是有变形物体的场景。引入近似凸包的思想提出一种快速构造方向包围盒算法，很大程度上减少了构造方向包围盒（0BB）层次结构的顶点数，改进后的算法在降低构造层次结构时间的同时，对方向包围盒的紧密性代价几乎没有影响，在有些时候还提高了包围盒的紧密性。在包围盒相交测试方面，提留了一种基于筒单羽以爱的相交须刿方击，该算法在检测过程中省去了大量包围盒的相交测试计算，提高了相交测试的速度。最后将两种改进算法联合的碰撞检测框架与常用的基于均值和协方差矩阵的包围盒构造和基于分裂轴的算法进行比较，证明了算法具有高效性。