A planar parallel manipulator based novel MEMS device bonding system

A novel MEMS device boning system is presented. Aiming at the high velocity, high precision and high flexibility requirements, a novel manipulator of planar parallel structure is developed to substitute ordinary X-Y table. In addition, the machine vision is implemented to improve the system＇ s flexibility. The initial angular positions of the joints are estimated by the extended Kalman filter algorithm. As a resuh, the manipulator＇s absolute locating accuracy in its workspace is guaranteed indirectly. For any MEMS device, the bonding system itself can be used as measurement equipment to create the device＇ s geometry model, which is the base to do off-line programming. A quite ideal trade-off between the system＇ s flexibility and efficiency is got. Finally, some verified motion specification of the manipulator, the bonding experimental results and the verified qualities of the bonded devices are provided.