NiFe/Cu多层膜巨磁电阻与界面结构的研究

采用磁控测射方法制备的ＮｉＦｅ／Ｃｕ多层膜，在室温下测量到巨磁电阻随Ｃｕ层厚度振荡的第三峰，讨论了ＮｉＦｅ／Ｃｕ多层膜界面结构对巨磁电阻的影响     

低饱和场巨磁电阻金属多层膜Ni80Fe20／Cu的结构与磁电阻

采用磁控溅射方法，获得了具有低饱和场巨磁电阻的Ｎｉ８０Ｆｅ２０／Ｃｕ金属多层膜，在室温下，其磁电阻和层间耦合状态随Ｃｕ层厚度的增加呈振荡变化，在Ｃｕ层厚度ｔＣｕ＝１．０ｎｍ，２．２ｎｍ时磁电阻出现２个峰值分别为１９．４％和１１．７％，饱和场约为６．４×１０＾４Ａ／ｍ和８×１０＾３Ａ／ｍ低温下（７７Ｋ）磁电阻为３３．２％和２７．６％，系统地研究了ＮｉＦｅ层厚度和周期数对多层膜磁电阻的影响，用真空退火     

制备条件和退火对Co／Cu多层膜的巨磁电阻及结构的影响

用射频磁控溅射方法在不同条件下制备了数个系列的Ｃｏ／Ｃｕ多层膜样品，成功地观察到巨磁电阻随Ｃｕ层厚度的振荡行为。对比不同制备条件，发现清洁、较好的背景真空是获得巨磁电阻的关键。真空退火显著地降低了巨磁电阻第一峰的数值，其原因是退火引起的界面状态的微观变化导致相邻Ｃｏ层间的铁磁耦合。然而，对第二峰而言，退火后巨磁电阻值变化较小。用Ｘ－光衍射分析了样品退火后结构的变化     

NiFe／Cu多层膜的巨磁电阻效应

采用磁控溅射方法在玻璃基片上沉积NiFe／Cu多层膜．在室温下测量到其巨磁电阻随cu层厚度振茴的第一峰和第二峰，相应的峰值分别为19%和11%．研究了巨磁电阻隧NiFe层厚度及多层膜总周期数Ⅳ的变化规律。     

The influence of the nonmagnetic metal spacer Bi, Ag and Cu on the properties of the multilayer films

When a ferromagnetic (FM)/antiferromagnetic (AFM) bilayer is field-cooled below the Neel temperature (TN) of the AF layer, a unidirectional anisotropy is induced in the FM. Exchange bias is one of the phenomena as- sociated with the exchange anisotorpy cr…     

Magnetic property and interface structure of Ta/NiO/NiFe/Ta

Ta/NiO/NiFe/Ta multilayers, utilizing Ta as buffer layer, were prepared by rf reactive and dc magnetron sputtering. The exchange coupling field between NiO and NiFe reached a maximum value of 9.6×10³ A/m at a NiO film thickness of 50 nm. The composition and chemical states at interface region of Ta/NiO/Ta were studied by using the X-ray photoelectron spectroscopy (XPS) and peak decomp- osition technique. The results show that there is an “inter- mixing layer” at the Ta/NiO (and NiO/Ta) interface due to a thermodynamically favorable reaction 2Ta + 5NiO = 5Ni + Ta₂O₅. This interface reaction has a great effect on exchange coupling. The thickness of Ni+NiO estimated by XPS depth- profiles is about 8—10 nm.     

巨磁电阻自旋阀多层膜的结构和磁性

用磁控溅射镀膜方法，制成了巨磁电阻自旋阀多层膜Ｔａ／ＮｉＦｅ／Ｃｕ／ＮｉＦｅ／ＦｅＭｎ／Ｔａ。它具有优良的特性。其室温磁电阻比率ＭＲ〉２％，自由层矫元力Ｈｃｌ〈１６０Ａ／ｍ，自由层零磁场漂Ｈｆ〈８００Ａ／ｍ和钉 扎层交换场Ｈｅｘ≈２０×１０＾３Ａ／Ｍ。     

快速热退火对a-Si:H/SiO2多层膜光致发光的影响

采用在等离子体增强化学气相沉积(PFCVD)系统中沉积a-Si：H和原位等离子体逐层氧化的方法制备a-Si：H／SO2多层膜．用快速热退火对a-Si：H／SiO2多层膜进行处理，制备nc—Si/SiO2多层膜，研究了这种方法对a-Si：H／SiO2多层膜发光特性的影响．研究发现对a-Si：H／SiO2多层膜作快速热退火处理，可获得位于绿光和红光两个波段的发光峰．研究了不同退火条件下发光峰的变化．通过对样品的TEM、Raman散射谱和红外吸收谱的分析，探讨了a-Si：H／SiO2多层膜在不同退火温度下的光致发光机理．     

Structure of Ag/Bi multilayers

Conclusion The structure of Ag/Bi prepared by the ion beam sputtering technique is studied by using X-ray diffraction. The longer the modulation period, the more the modulation peaks. This is because a deposition layer can “heal” the roughness of the previous layer, and by lengthening the modulation period, the ability of ”healing” may be reinforced. The internal structures in Ag/Bi multilayers whose substrate is cooled by liquid nitrogen are found to consist of nanocrystalline Ag and Bi; however, the internal structure in multilayers cooled by cooling water is composed of polycrystalline sublayers. The deposition temperature has no effect on interfacial roughness.     

Effect of Cu surface segregation on the exchange coupling field of NiFe/FeMn bilayers

The NiFe/FeMn bilayers with different buffer layers (Ta or Ta/Cu) were prepared by magnetron sputtering. Results show that the exchange coupling field of NiFe/FeMn films with Ta buffer is higher than that of the films with Ta/ Cu buffer. We analysed the reasons by investigating the crystallographic texture, surface roughness and surface segregation of both films, respectively. We found that the decrease of the exchange coupling fields of NiFe/FeMn films with Ta/ Cu buffer layers was mainly caused by the Cu surface segregation on NiFe surface.     

Chemical states of the atoms in magnetic multilayersTa/NiOx/Ni81Fe19/Ta and Co/AlOx/Co

Ta/NiOx/Ni81Fe19/Ta and Co/AiOx/Co multilayers were prepared by rf reactive and dc magnetron sputtering. The exchange coupling field (Hex) and the coercivity (Hc)of NiOx/Ni81Fe19 as a function of the ratio of Ar to O2 during the deposition process were studied. The composition and chemical states at the interface region of NiOx/NiFe were also investigated using the X-ray photoelectron spectroscopy (XPS) and peak decomposition technique. The results show that when the ratio of Ar to O2 is equal to 7 and the argon sputtering pressure is 0.57 Pa, the x value is approximately 1and the valence of nickel is +2. At this point, NiOx is antiferromagnetic NiO and the corresponding Hex is the largest.As the ratio of Ar/O2 deviates from 7, the Hex will decrease due to the presence of magnetic impurities such as Ni+3 or metallic Ni at the interface region of NiOx /NiFe, while the Hc will increase due to the metallic Ni. Al layers in Co/AIOx/Co multilayers were also studied by angle-resolved XPS. Our finding is that the bottom Co could be completely covered by depositing an Al layer about 1.8 nm. The thickness of AIOx was 1.2 nm.     

Electric transmission behavior of self-assembled Cu–W nano multilayers

Metallic nano multilayers were usually prepared by dual targets alternating deposition method. In this paper, a series of self-assembled Cu–W nano multilayers with different modulation periods were deposited on single crystal silicon substrate by dual targets confocal magnetron sputtering technique. The self-assembled film presented an alternation of W-rich layer and Cu-rich layer. The degree of coherence of the layered interface can be adjusted by controlling both the solid solubility of W-rich and Cu-rich layers. The film resistance increment of the self-assembled Cu–W multilayers is only 14% when the modulation period decreases from 68.2 nm to 5.3 nm,having less size effect compared to the film prepared by alternating deposition method. It noticed that the film resistance even decreased slightly when the modulation period decreased to below 5.3 nm. These results suggested that the coherence could weak the interface scattering ability to electrons, so the self-assembled Cu–W multilayers have lower resistance than the multilayer prepared by alternating deposition technique. This study presented a new pathway to enhance the conductivity of the multilayers.     

磁性多层膜Ta/NiO/NiFe/Ta角分辨XPS

磁性多层膜Ta/NiO/NiFe/Ta由磁控溅射方法制备.采用角分辨X射线光电子能谱(XPS)研究了反铁磁(NiO)/铁磁(NiFe)界面.结果表明,在NiO/NiFe界面发生了化学反应: NiO+Fe = Ni+FeO和3NiO+2Fe =3Ni+Fe2O3,此反应深度约为1～1.5 nm.反应产物将影响NiO对NiFe的交换耦合.     

Dependence of Magnetic Properties and Microstructure of Ni81Fe19 Film on Base Vacuum and Sputtering Pressure

The Ni81Fe19 / Ta films with different NiFe thickness were prepared at different base vacuums and sputtering pressures. The results of magnetic measurement and atomic force microscope (AFM) showed that the films prepared at higher base vacuum and lower sputtering pressure had larger R/R. The reason should be that higher base vacuum and lower sputtering pressure introduce larger grain-size and lower surface roughness, which will weaken the scattering of electrons, reduce the resistance R, and increase R/R.     

膜厚对NiO/NiFe/Cu/NiFe磁阻效应的影响

用射频磁控溅射方法制备多层膜,研究了双层膜ＮｉＯ／ＮｉＦｅ的矫顽力Ｈｃ和交换耦合场Ｈｅｘ与反铁磁层ＮｉＯ、铁磁层ＮｉＦｅ厚度的关系,结果表明：ＮｉＯ厚度为７０ｎｍ时,Ｈｅｘ最大;Ｈｃ随ＮｉＯ厚度增大而增大．当ＮｉＦｅ厚度增加时,Ｈｅｘ近似线性减小;而Ｈｃ则随ＮｉＦｅ厚度增大开始有缓慢增加,然后才减小．对于ＮｉＯ（７０ｎｍ）／ＮｉＦｅ（ｔ１）／Ｃｕ（２．２ｎｍ）／ＮｉＦｅ（ｔ２）自旋阀多层膜材料（括号内的量表示厚度）,研究了ＮｉＦｅ膜厚度对磁阻效应的影响,结果表明：被钉扎层ＮｉＦｅ的厚度为３ｎｍ,自由层ＮｉＦｅ的厚度为５ｎｍ时,ＭＲ值最大,约为１．６％．     

Blue emission from hydrogen-containing a-Si：H／SiO2 multilayers and the investigation of its mechanism

A series of hydrogen-containing a-Si:H/SiO2 multilayers with different a-Si:H sublayer thickness were fabricated by layer-by-layer deposition and in situ plasma oxidation in a plasma-enhanced chemical vapor deposition system (PECVD). Optical induced blue emission from the samples was observed by the naked eye at room temperature, which has never been reported in the luminescence study of Si/SiO2 multilayers up to now. Both the photoluminescence (PL) peak and the absorption edge show a blue shift as the a-Si:H sublayer thickness decreases. The origin of the blue emission and the effect of hydrogen are discussed.     

Chemical states of the atoms in magnetic multilayers Ta/NiO x /Ni81Fe19/Ta and Co/AlO x /Co

Ta/NiO _x /Ni₈₁Fe₁₉/Ta and Co/AlO _x /Co multilayers were prepared by rf reactive and dc magnetron sputtering. The exchange coupling field (H _ex) and the coercivity (H _c) of NiO _x /Ni₈₁Fe₁₉ as a function of the ratio of Ar to O₂ during the deposition process were studied. The composition and chemical states at the interface region of NiO _x /NiFe were also investigated using the X-ray photoelectron spectroscopy (XPS) and peak decomposition technique. The results show that when the ratio of Ar to O₂ is equal to 7 and the argon sputtering pressure is 0.57 Pa, the x value is approximately 1 and the valence of nickel is +2. At this point, NiO _x is antiferromagnetic NiO and the corresponding H_ex is the largest. As the ratio of Ar/O₂ deviates from 7, the H _ex will decrease due to the presence of magnetic impurities such as Ni⁺³ or metallic Ni at the interface region of NiO _x /NiFe, while the H _c will increase due to the metallic Ni. Al layers in Co/AlO _x /Co multilayers were also studied by angle-resolved XPS. Our finding is that the bottom Co could be completely covered by depositing an Al layer about 1.8 nm. The thickness of AlO _x was 1.2 nm.     

表面活性剂Bi对自旋阀多层膜交换耦合场的影响及其微结构分析

采用磁控溅射方法制备了Ta(10nm)/NiFe(8nm)/Cu(2.6nm)/NiFe(3.6nm)/FeMn(9nm)/Ta(10nm)自旋阀多层膜.在Cu/NiFe界面沉积适量厚度的Bi原子能够有效地提高交换耦合场,沉积过量的Bi原子会导致交换耦合场下降.X射线光电子能谱分析结果表明:沉积在Cu/NiFe界面的Bi原子可以有效地抑制Cu原子在NiFe层表面的偏聚;当沉积过量的Bi原子时,Bi原子会进一步迁移到FeMn中,形成杂质,从而破坏了FeMn的反铁磁性,使交换耦合场降低.     

NiO钉扎的自旋阀的结构和磁性

利用反应溅射的方法制备了ＮｉＯ薄膜,并研究了ＮｉＯ对ＮｉＦｅ薄膜的钉扎作用结果表明钉扎场与反应溅射的Ａｒ／Ｏ２比例,总的溅射气压、基底的粗糙度等有很大关系,利用光电子能谱（ＸＰＳ）分析了ＮｉＯ２中的Ｎｉ２Ｏ离子的价态,并制备了ＮｉＯ钉扎的自旋阀Ｔａ／ＮｉＯ／ＮｉＦｅ／Ｃｕ／ＮｉＦｅ／Ｔａ,其磁电阻（ＭＲ）可达到２．２％,忆场为１０．４８ｋＡ／ｍ。     

SiO2/Ta interface reaction in magnetic multilayers and its influence on Ta buffer layers

Ta is often used as a buffer layer in magnetic multilayers. In this study, Ta/Ni81Fe19/Ta multilayers were deposited by magnetron sputtering on sing-crystal Si with a 300-nm-thick SiO2 film. The composition and chemical states at the interface region of SiO2/Ta were studied using the X-ray photoelectron spectroscopy (XPS) and peak decomposition technique. The results show that there is an "intermixing layer" at the SiO2/Ta interface due to a thermodynamically favorable reaction: 15 SiO2 + 37 Ta = 6 Ta2O5 + 5 Ta5Si3. Therefore, the Ta buffer layer thickness used to induce NiFe (111) texture increases.