Approaches for improving the performance of filament-type resistive switching memory

Resistive random access memory (RRAM) has received significant research interest because of its promising potential in terms of down-scaling,high density,high speed and low power. However,its endurance,retention and uniformity are still imperfect. In this article,the physical mechanisms of filament-type RRAM and the approaches for improving the switching performance,including doping,process optimization and interface engineering,are introduced.     

Approaches for improving the performance of filament-type resistive switching memory

Resistive random access memory (RRAM) has received significant research interest because of its promising potential in terms of down-scaling, high density, high speed and low power. However, its endurance, retention and uniformity are still imperfect. In this article, the physical mechanisms of filament-type RRAM and the approaches for improving the switching performance, including doping, process optimization and interface engineering, are introduced.     

An overview of the switching parameter variation of RRAM

Resistive random access memory（RRAM） has been considered as one of the most promising candidates for next-generation nonvolatile memory, due to its advantages of simple device structure, excellent scalability, fast operation speed and low power consumption. Deeply understanding the physical mechanism and effectively controlling the statistical variation of switching parameters are the basis of fostering RRAM into commercial application. In this paper, based on the deep understanding on the mechanism of the formation and rupture of conductive filament, we summarize the methods of analyzing and modeling the statistics of switching parameters such as SET/RESET voltage, current, speed or time. Then, we analyze the distributions of switching parameters and the influencing factors. Additionally, we also sum up the analytical model of resistive switching statistics composed of the cell-based percolation model and SET/RESET switching dynamics. The results of the model can successfully explain the experimental distributions of switching parameters of the Ni O- and Hf O2-based RRAM devices. The model also provides theoretical guide on how to improve the uniformity and reliability such as disturb immunity. Finally, some experimental approaches to improve the uniformity of switching parameters are discussed.     

An overview of resistive random access memory devices

With recent progress in material science, resistive random access memory (RRAM) devices have attracted interest for nonvolatile, low-power, nondestructive readout, and high-density memories. Relevant performance parameters of RRAM devices include operating voltage, operation speed, resistance ratio, endurance, retention time, device yield, and multilevel storage. Numerous resistive-switching mechanisms, such as conductive filament, space-charge-limited conduction, trap charging and discharging, Schottky Emission, and Pool-Frenkel emission, have been proposed to explain the resistive switching of RRAM devices. In addition to a discussion of these mechanisms, the effects of electrode materials, doped oxide materials, and different configuration devices on the resistive-switching characteristics in nonvolatile memory applications, are reviewed. Finally, suggestions for future research, as well as the challenges awaiting RRAM devices, are given.     

新一代存储技术:阻变存储器

阻变存储器具有存储单元结构简单、工作速度快、功耗低、有利于提高集成密度等诸多优点,受到广泛的关注。作者论述了 RRAM 的基本结构和工作原理, 并介绍了三维集成和多值存储等 RRAM 新型技术。     

An overview of resistive random access memory devices

With recent progress in material science, resistive random access memory (RRAM) devices have attracted interest for nonvolatile, low-power, nondestructive readout, and high-density memories. Relevant performance parameters of RRAM devices include operating voltage, operation speed, resistance ratio, endurance, retention time, device yield, and multilevel storage. Numerous resistive-switching mechanisms, such as conductive filament, space-charge-limited conduction, trap charging and discharging, Schottky Emission, and Pool-Frenkel emission, have been proposed to explain the resistive switching of RRAM devices. In addition to a discussion of these mechanisms, the effects of electrode materials, doped oxide materials, and different configuration devices on the resistive-switching characteristics in nonvolatile memory applications, are reviewed. Finally, suggestions for future research, as well as the challenges awaiting RRAM devices, are given.     

NiO_x阻变存储器性能增强方法及相关机理研究

通过精确控制在Pt衬底上制备NiOx薄膜的工艺过程,制备出阻值窗口增大5倍以上,高低阻态稳定的TiN/NiOx/Pt结构阻变存储器.研究发现,NiOx薄膜的多晶态结晶结构和化学组分,尤其是Ni元素的化学态,是影响NiOx阻变存储器阻值窗口和稳定性的主要因素.X射线光电子能谱和X射线多晶体衍射测试结果表明,当NiOx薄膜中间隙氧或Ni2+空位增多时,Ni2+会被氧化成为Ni3+以保持电中性,Ni3+离子在材料中引入空穴导致P型氧化物NiO的漏电流增大.基于此机理,提出通过提高淀积温度、降低氧气分压的方法抑制NiOx薄膜中间隙氧或Ni2+空位的产生,降低TiN/NiOx/Pt结构阻变存储器关态漏电流,增大阻值窗口.这种基于工艺的性能增强方法,在NiOx阻变存储器实际应用中有良好前景.     

自旋梯状化合物Sr14(Cu1-xZnx)24O41的电输运及磁学性质

采用标准固相反应法制备了Sr14(Cu1-xZnx)24O41(x=0, 0. 01, 0. 02, 0. 03)系列多晶样品. X射线衍射谱表明所有样品均呈单相,且样品晶格常数大小随Zn掺杂量x的变化存在微弱波动. X射线光电子能谱表明Sr14Cu24O41中Cu离子以+2价形式存在,Zn掺杂对体系中Cu离子化合价不造成影响. 磁化率测量结果表明在10~300 K温度范围内Zn掺杂使体系磁化率降低,拟合结果表明随着Zn掺杂量x的增大,居里-外斯项对体系磁化率贡献逐渐减弱,二聚体耦合能JD 逐渐降低,每个分子中CuO2 自旋链内二聚体个数ND 与自由Cu2+离子自旋数NF 均逐渐减少,进一步分析显示替换二聚体内Cu2+离子的Zn2+离子数少于替换自由Cu2+离子的Zn2+离子数. 电阻率测量结果表明Sr14Cu24O41体系具有半导体特性,并且Zn掺杂会使体系电阻率降低,降低程度随掺杂量x增大而增大,但并未使体系发生金属- 绝缘体转变. 认为电阻率降低可能是由于Zn2+离子掺杂使体系内CuO2 自旋链中二聚体发生退耦,破坏了电荷有序超结构,从而使更多的空穴释放出来并转移到导电性好的Cu2O3自旋梯子中所致.     

ZnO whiskers growth on the surface of Sn9 Zn/Cu solder joints in concentrator silicon solar cells solder layer

ZnO whiskers observation on the surface of SnZn/Cu solder joints in concentrator silicon solar cells solder layer is reported.In the experiment, SnZn/Cu samples are left in laboratory after reflow soldering for two years before an examination by SEM, then ZnO whiskers can be observed obvious-ly, which grows out from the rich-Zn phase of the samples and causes electrical short circuit in the electronics appliances, which demonstrates that the SnZn solder shows a risk for the short circuiting failure of an electronic device.Moreover, the growth mechanism of ZnO whiskers is researched based on cracked oxide theory, which provides the reference support for SnZn solders application.     

Cu_2O薄膜的电化学制备及EPIR效应

以FTO玻片为基底,在不同pH值下采用恒电位电化学沉积法制备了Cu2O薄膜样品和Cu/Cu2O/Cu/FTO器件.通过XRD、SEM、EDS对样品的相组成、晶体结构、微观形貌和化学成分进行了表征和分析,并对Cu/Cu2O/Cu/FTO器件的电脉冲诱导电阻转变(EPIR)效应进行了测量.结果表明室温下Cu/Cu2O/Cu/FTO中存在明显的EPIR效应和忆阻器行为且与溶液酸碱性有关.在酸性和中性条件下,即pH=5、6、7时,Cu/Cu2O/Cu/FTO存在显著的EPIR效应,随着pH值的增加效应趋于减弱,当脉冲电压为6 V,脉冲宽度为0.001 s时,样品具有最大EPIR值.随pH进一步增加,在pH=8、9、10的碱性条件下,Cu/Cu2O/Cu/FTO的EPIR效应消失.     

Ag,Er,Cu双掺杂对Ca3Co2O6热电性能的影响

采用溶胶 凝胶法和常压烧结技术, 制备一系列钴基氧化物热电材料Ca₃Co₂O₆和Ca_2.85M_0.15Co_2-yCu_yO₆(M=Ag,Er; y=0,0.1,0.2), 并通过X射线衍射(XRD)和扫描电子显微镜(SEM)考察样品的物相组成和微观形貌, 在300~1 000 K测定样品的电导率和Seebeck系数, 分析掺杂不同元素对复合物热电性能的影响. 结果表明: 制备的所有材料均为单一物相, 结构致密; 不同双掺杂元素对材料的热电性能均有提升作用; 当Ag⁺和Cu²⁺的掺杂量分别为0.15,0.2时, 可获得最优的热电性能, Ca_2.85Ag_0.15Co_1.8Cu_0.2O₆在965 K时的功率因子为71 μW/(K₂·m).     

一种阻变存储单元Hspice模型设计

提出一种满足新型双通道阻变存储器读写操作要求的Hspice模型.这种模型基于新的机理,即通过改变一块1 Mb阻变存储阵列的一个单元中2种可重配置的稳定电阻存储模式实现＂RESET态＂和＂SET态＂之间的转换,它可以通过一个模拟电流-电压特性的分立器件模型来验证.与传统阻变存储器模型相比,利用这种模型,可以用较少的器件准...     

聚苯胺-二氧化锰涂层的电化学合成及其对神经微电极界面性能的影响

提出了一种简易、低成本的方法进行神经微电极的性能改进,以改善神经电极/神经组织的界面特性.采用电化学方法合成导电聚合物聚苯胺PANI和PANI-MnO2复合涂层,对神经微电极位点进行表面修饰;对修饰电极的表面形貌与电学性能进行测试,对比分析了MnO2掺杂对PANI涂层的影响.结果表明:MnO2掺杂改善了PANI涂层的表面形貌;与PANI修饰电极相比,PANI-MnO2修饰电极界面通过的电荷量提高了近7倍,电学性能稳定性更好,在神经信号相关的1kHz频率处阻抗降低到原来的1/6,PANI-MnO2复合涂层能更好地提高电极的电学性能.     

Cu/SiO2结构单元在阻变效应中形成导电通道的模型分析*

通过建立一个模型,简单地讨论了Cu/SiO_2结构单元在阻变效应中形成导电通道的临界电压特性。该模型考虑了Cu离子在SiO_2薄膜的迁移扩散和Cu离子在薄膜内引起的空间电荷效应,同时考虑了电子电导机制。模型的计算表明,薄膜的结构参数(厚度、电极功函数、掺杂等)对导电通道的形成过程有很大的影响,其临界电压随薄膜厚度和电极功函数的增加而增大,而随Cu离子掺杂浓度增大而减小。这一结果对未来存储器件的性能设计和制造具有一定的指导意义。     

超导储能系统的研究现状及应用前景

 超导磁储能系统将电磁能存储在超导储能线圈中,具有反应速度快、转换效率高、快速进行功率补偿等优点,在提高电能品质、改善供电可靠性及提高大电网的动态稳定性方面具有重要价值。概述了超导储能系统的工作原理、研究现状及优缺点,并展望了其未来应用可能性及发展方向。     

LED大型显示屏多功能扫描控制系统设计

对ＬＥＤ大型广告显示屏的扫描控制系统原理及硬件电路作了详细的阐述，探讨了单机与主－从机工作模式的多功能兼容性设计以及对提高显示亮度与稳定性而采取的措施。所用方案在提高８０３１ＣＰＵ工作效率、增强像素控制能力以及总线分时复用技术上都有较新颖的尝试。     

Ag掺杂对TiO_2性质影响的第一性原理研究

采用Ag原子对锐钛矿型TiO2半导体进行掺杂,利用基于密度泛函理论的第一性原理研究了Ag掺杂TiO2的晶体结构和能带结构.计算表明,Ag掺杂导致TiO2电子局域能级的出现及禁带变窄,从而导致吸收光谱红移.同时对Ag、Cu这两种同族原子进行掺杂比较,结果证明,用Ag原子对锐钛矿型TiO2进行掺杂在提高光催化性能方面效果更好.     

Enhanced resistive switching properties of HfAlOx/ZrO2- based RRAM devices

Resistive Random-Access Memory (RRAM) devices are recognized as potential candidates for next-generation memory devices, due to their smallest cell size, high write/erase speed, and endurance. Particularly, the resistive switching (RS) characteristics in oxide materials have offered new opportunities for developing CMOS-compatible high-density RRAM devices. In this study, the RS behavior of HfAlO_x/ZrO₂ thin films sandwiched structure between TiN bottom electrode and Au top electrodes were investigated. It was found that Au/HfAlO_x/ZrO₂/TiN stacks were superior in terms of RS performance when compare to Au/HfAlO_x/TiN memory stacks. The devices demonstrated a good resistance ratio of high resistance state and low resistance state ～10³ for Au/HfAlO_x/TiN and ～10⁵ for Au/HfAlO_x/ZrO₂/TiN stacks, respectively. Both stacks showed good retention characteristics (>10⁴ ?s) and endurance (>10³ cycles). The experimental current-voltage characteristics fitted with different conducting mechanisms, the linear lower bias region is dominated by ohmic conductivity, whereas the non-linear higher bias region was dominated by space-charge limited current conduction mechanism.     

基于非易失性存储器的存储系统技术研究进展

 非易失性存储器（NVM）主要包括两类,即适用于外存的、块寻址的闪存和适用于内存的、字节寻址的持久性内存。相比于传统磁盘,闪存具有性能高、能耗低和体积小等优势;相比于DRAM（动态随机存储器）,持久性内存如PCM（相变存储器）、RRAM（阻变存储器）等,具有非易失、存储密度高以及同等面积/内存插槽下能给多核环境的CPU 提供更多的数据等优点,这些都为存储系统的高效构建带来了巨大的机遇。然而,传统存储系统的构建方式不适用于非易失性存储器,阻碍了其优势的发挥。为此,分析了基于非易失性存储器构建存储系统的挑战,从闪存、持久性内存两个层次分别综述了它们在存储体系结构、系统软件以及分布式协议方面的变革,总结了基于非易失性存储器构建存储系统的主要研究方向。     

基于β辐射伏特效应的NPN结型换能结构研究

针对PN结型换能器件收集效率低,短路电流小等缺点,首次提出NPN结型核电池换能结构.用电子束对设计制作的NPN结型换能器件进行双面辐照实验,实验结果表明NPN结型换能结构能够通过降低P区掺杂浓度提高耗尽区宽度,减小换能器件厚度降低体电阻,增大短路电流,获得较大的能量转换效率.