微量元素对高纯铝箔立方织构的影响

采用晶体取向分布函数(ODF)研究和分析了在高纯铝中分别加入不同含量的微量稀土或铍对成品高纯铝箔立方织构的影响．研究结果表明添加微量稀土和铍,能改变高纯铝箔变形织构组分含量,单独加稀土时,形变织构变化不大;在单独加铍时,其S取向{123}<634>和Cu取向{112}<111>变化较大,随铍含量增加,其S取向密度f(g)减少,Bs{110}<112>取向密度增加．再结晶退火后,随稀土加入量增加,立方织构{100}<001>取向密度增加,R织构{124}<211>取向密度减少;铍添加较少时能增加成品箔材中立方织构{100}<001>强度,但随铍含量增加,立方织构含量急剧减少,R织构强度相应增加．稀土和铍在铝中溶解度都极小,与铁等微量杂质元素可能形成化合物析出后,能净化基体,减小铁对形成立方织构的阻碍作用,促进再结晶立方取向核心的形成与长大,增加立方织构比例．     

Cu对高压电解电容器阳极铝箔再结晶织构的影响

采用织构定量检测等方法研究了铜元素对高压电解电容器阳极铝箔立方织构的影响, 讨论了相关的影响原理.结果表明, 微量铜元素的变化会改变其在位错附近的偏聚状态, 进而影响轧制铝箔的塑性变形过程和取向分布状态, 因此铜元素会影响其再结晶行为和退火铝箔的立方织构量.较低的铜含量和较高的晶粒长大温度有利于立方织构占有率的提高.     

微量Ga对电容器阳极用铝箔组织及比电容的影响

采用X射线衍射定量检测含微量Ga高压电解电容器阳极用退火箔的立方织构,用金相显微镜及扫描电镜观察其显微组织,用图像分析软件分析腐蚀箔的腐蚀结构,研究了微量Ga对组织结构、腐蚀结构及比电容的影响.结果表明:Ga的质量分数由05×10-6提高至116×10-6时,铝箔的立方织构的体积分数略微下降,但在520V的比电容却由0662μF/cm2增加到0706μF/cm2;当Ga的质量分数增加至214×10-6时,显微组织及织构变化不明显,但比电容下降至0693μF/cm2.这是因为适当添加微量Ga能促进电化学腐蚀发孔,增加箔的表面积,提高其比电容;但Ga的质量分数高于116×10-6时,将增加箔的并孔数量,减少其表面积,导致比电容下降.     

最终退火处理对铝箔立方织构的影响

对铝纯度为99.79%和99.99%的两种铝箔进行了多种退火处理,利用蚀坑法分析统计了热处理后铝箔的立方织构含量.化学成分对铝箔立方织构度有决定性的影响,纯度高的Al99.99%铝箔通过热处理后可获得较高的立方织构含量,最高可达92%.铝箔退火时,随退火温度的升高、保温时间的延长,纯度为Al99.99%的铝箔中立方织构含量增加,但在高温(高于580℃)时,保温时间的延长对立方织构含量无明显影响;对铝纯度较低,Al99.79%的铝箔,立方织构含量增加不明显,高于550℃的退火温度会降低立方织构含量,并随着保温时间的延长,降低幅度加大.     

微量元素、织构和位错对低压(16V)电容器用阳极箔比电容的影响

本文研究了含微量 Mg—Nd、Cd 的低压(16V)电容器阳极铝箔比电容。实验表明:成份位于一定范围的退火 Al-Mg-Nd 和 Al-Cd 合金箔,与纯铝箔相比,有较高的比电容。其原因在于微量元素提高了铝箔表面(100)织构的含量;同时,也增加了正方形蚀坑的晶粒数目,这些晶粒分布在三角形或其他形状蚀坑的晶粒之间,且各种蚀坑的形状、大小适宜,分布均匀。由此所组成的位错蚀坑密度愈大,低压用铝箔的比电容也愈高。     

高纯电子铝箔立方织构形成的微观过程

采用EBSD微取向分析方法,通过分析高纯铝箔冷轧后退火的再结晶初期立方取向晶核的形成过程及立方取向晶粒的长大行为,探讨了高纯铝箔中立方织构形成的微观过程.结果表明,在高纯铝箔轧制基体上没有发现立方取向{001}<100>的晶核优先形成,但是再结晶完成以后却会出现较强的立方织构,因此高纯铝箔立方织构的形成主要是借助于立方取向晶粒的取向生长机制实现的.立方取向晶核容易在S取向{123}<634>的形变晶粒之间产生.     

组织结构对电容铝箔腐蚀形貌和比电容的影响

本文研究了最终退火对两种电容铝箔组织结构的影响,分析了组织结构、腐蚀坑形貌和比电容之间的关系。实验表明:在退火条件下,再结晶织构对腐蚀铝箔的电容量有重要影响。立方织构含量增加,比电容提高。通过对铝箔腐蚀形貌的观察证实:电容铝箔在含有氯离子溶液中的腐蚀具有明显的结晶学特征,在<001>方向具有最快的腐蚀速度。根据这种特征解释了立方织构对腐蚀形貌和比电容的影响。     

异步轧制对高压电解电容器用铝箔织构的影响

利用异步轧制技术对高压电解电容器用高纯铝进行冷轧,研究了异步轧制参数对铝箔冷轧织构的影响.结果表明:异步轧制的搓轧区效应,可使铝箔形成不同于同步轧制的6种主要织构的含量与分布.慢辊侧的织构总体含量高于快辊侧总体含量;S{123}(634)织构、C{112}(111)织构的变化趋势相同,立方织构{001}(100)、旋转...     

Al-Mg-Pb-Sn-Ga铝合金阳极材料组织对电化学性能的影响

研究了冷轧变形量为95%Al-Mg-Pb-Sn-Ga五元铝合金阳极板材不同温度退火处理后的织构和其在4 mol/L NaOH+10 g/L Na2 SnO3溶液中的静态析氢速率与电化学性能.结果表明:此五元铝合金阳极板材,随退火温度的升高、保温时间的延长,立方织构含量增多,在4 mol/L NaOH溶液中反应后,表面腐蚀空隙率增多、深度增加,阳极极化减弱;回复退火处理的五元铝合金板材,析氢速率降低,稳定工作电位负移;再结晶退火时,随退火温度的升高、时间的延长,稳定工作电位的负移程度减少,析氢速率稍有增大.AM0501铝合金阳极板材在250℃-10 h、300℃-3 h回复退火,其在4 mol/LNaOH+10 g/L Na2 SnO3溶液中,恒电流极化时,具有理想的低自腐蚀析氢速率,负的稳定工作电位等电化学综合性能.     

3004铝合金在轧制及退火过程中织构的演变

应用取向分布函数(ODF)研究和分析了热轧、冷轧及退火对3004铝合金织构的影响·结果表明,热轧后织构类型为(100)[uvw],且(100)[011]旋转立方织构为最强;在冷轧过程中,所有样品的冷轧织构表现为典型的铜式织构特征,随形变量的增加,织构由弱到强,最后稳定在铜织构、黄铜织构和S织构3个织构组分;冷轧样品退火后,退火织构主要由立方织构、退火R/S织构和铜织构组成,其中在300℃和400℃的退火样品中存在强度较高的再结晶立方织构{001}〈100〉,100℃和200℃的退火样品中再结晶立方织构{001}〈1...     

Mechanism of surface texture evolution in pure copper strips subjected to double rolling

Developing ultra-thin copper foils with different surface roughness and microstructure has important significance for improving the service performance and reducing the production cost of high-end circuit boards. In this paper,pure copper strips with initial cube texture were subjected to a double rolling process(deformation amount ranges from 50% to 95%),and the surface textures evolution law and mechanism of doublerolled strips were studied by an X-ray diffraction technique. The results show that when a deformation amount increased from 50% to 70%,the grains of two surfaces rotate away from the cube orientation,and the formed textures of two surfaces mainly consisted of C,S and B orientation components. The orientation density values for these three components on bright surface only had slight difference; the orientation density values for C and S components were much larger than that for B components on a matt surface. When the deformation amount increased to 90%,the increase extents of orientation density values for C and S components were obviously larger than that for B components on a bright surface; the increase extents of orientation density values for these three components were almost the same on the matt surface. It has been found that when deformation amount reaches 95%,the grains orientation of bright surface were relatively concentrated,and the orientation density value for C texture obviously increased to 11.68 and that for B texture was only 3.15; the grains orientation of matt surface were relatively dispersed,and the orientation density value for C texture increased to 9.26 and that for B texture obviously increased to 6.35,and the density values of these two textures had less difference. For the condition of strong compressive and shear stress on the bright surface,grains were mainly rotating to C texture orientation; compared with the bright surface,"semi-free" deformation condition on the matt surface is beneficial to promote much more grains to rotate to the B texture orientation.     

Cu-45%Ni合金基带强立方织构的形成研究简

采用X射线四环衍射技术研究了大应变量冷轧Cu-45％Ni （原子百分含量）合金基带冷轧织构的形成、低温回复以及再结晶过程中织构的演变行为。结果表明：Cu-45％Ni合金经大应变量冷轧后形成以S取向、Copper取向和Brass取向含量为主的Copper型轧制织构;在低温回复过程,仍为Copper型轧制织构,并且其轧制织构的强度有所增强;在再结晶过程,立方取向的含量迅速增加,各轧制取向含量均迅速减少,表明S取向、Copper取向和Brass取向在再结晶过程中均被逐渐长大的立方晶粒所吞并。在此基础上,采用背散射电子衍射技术表征其高温下强立方织构的形成过程,Cu-45％Ni合金基带经1000℃保温1 h后,其立方织构含量高达98．6％（＜10°）,大角度晶界的含量仅为13．6％,其中包含约5％的Σ3晶界。     

Influence of intermediate annealing on the microstructure and texture of Ni-9.3at%W substrates

The effects of intermediate annealing (IA) on the microstructure and texture of Ni-9.3at%W substrates have been investigated by using electron backscattering diffraction and X-ray diffraction. Results suggest that IA can optimize the homogeneity of deformation microstructure. Higher IA temperatures (without undergoing recrystallization during IA) will increase the copper-type components of deformation texture and improve the content of cube texture after recrystallization. Sharp cube texture (97.2%) can be obtained at the optimum IA temperature of 650℃. The mechanism underlying the transition of deformation texture can be interpreted as that IA increases the dislocation slipping ability and suppresses the twinning deformation of Copper orientation in the subsequent rolling process. The observed strengthening of cube texture as a result of IA treatment is presumably attributed to the reduction of noncube nucleation and the optimization of preferential growth surrounding the cube nuclei.     

Ta-7.5％W在退火过程中的组织和织构演变

通过金相组织观察、透射电子显微镜(TEM)及显微硬度测试,研究冷轧变形量为95％的Ta-7.5％W合金箔材在1 050,1 200和1 360℃退火时的组织和性能变化,并采用取向密度函数(ODF)分析在此过程中其织构演变规律.对其实验结果进行研究发现:冷轧态Ta-7.5％W合金硬度为HV 300,经1 360℃退火后硬度迅速减小,说明此时合金已发生回复再结晶.轧制后的Ta-7.5％W合金箔材具有各向异性,在轧面∥{111}取向上形成位错胞亚结构,在轧面∥{100}取向上形成了形变带,冷轧态的主要织构为{001}〈110〉,{112} 〈110〉和{110}〈110〉织构;在1 200℃退火时,在轧面∥{111}取向上,再结晶通过亚晶界迁移、亚晶长大形核,而在轧面∥{100}取向上,主要是通过亚晶转动、聚合形核;{001}〈110〉织构增强,{112}〈110〉织构减弱;在1 360℃退火时,{001}〈110〉织构急剧减弱,{111}〈112〉织构增强.     

2091铝锂合金织构

铝锂合金材料性能的各向异性主要是由于织构存在而形成的．因此，根据作者于１９９４年提出的从一张完整极图计算ＯＤＦ的最大熵技术，测算了２０９１铝锂合金，在冷轧和退火过程中织构变化．该技术的极图测算量小，精度较高，准确可靠．样品采用组合试样．实验研究结果表明：该合金冷轧时形成较强的（１２１）［２３４］织构；退火过程中，再结晶织构类型和漫散范围没有明显改变，只是随着退火温度的升高，织构的强度明显降低     

Microtextural evolution of different TRC AA8006 alloy sections with homogenization

Grain microtexture evolution in twin-roll cast AA8006 alloy sheets subjected to different treatments was investigated using electron backscatter diffraction. The textures of rolling-transverse and normal-transverse sections were characterized in original as-cast twin-roll casting and cold-rolled samples as well as samples homogenized at 500℃ for 8 h and at 580℃ for 4 h. It is found that grains on both the rolling-transverse and normal-transverse sections of cold-rolled samples are made finer by rolling deformation and coarsened after homogenization. Annealing temperature has a stronger effect on the microstructural evolution than annealing time. The grain growth direction is parallel to the normal-transverse section, while grain deformation is more stable on the rolling direction than on the normal direction. The rolling orientations display more obvious anisotropy on the normal-transverse sections than on the rolling-transverse sections. Grain recrystallization and growth occur much easier on the normal-transverse section than on the rolling-transverse section for samples homogenized at 500℃ for 8 h. A special misorientation relationship between cold deformation texture, such as S orientation {123}<634> and cube orientation <110>‖X_axis[cubic], and recrystallization texture after homogenization, such as R orientation {124}<211> and P orientation {011}<122>, is observed.