氧化钽/氧化铝薄膜的阻变特性和突触特性

通过微电子加工工艺,制备出具有ITO/TaO_x/AlO_x/Ti结构的双介质层阻变存储器.器件中引入的氧化铝介质层有效地减小了器件的运行电流,降低了高/低阻态间切换所需的功耗,并增大了高/低阻态电阻比值.研究表明,器件的高低态电阻与其切换电压均有良好的稳定性和均匀性,且器件表现出可靠的擦写性能与保持性能.进一步研究表明,器件高阻态导电受肖特基发射机制主导,低阻态导电受空间电荷限制机制主导.器件还具有连续可调的电阻渐变行为,利用反复电脉冲刺激下的器件电阻变化来表征突触的权值,可以模拟突触行为.     

氮氧化铝的原子层沉积制备及其阻变性能研究

以等离子体增强原子层沉积(PE-ALD)技术生长氮氧化铝(AlNxOy)薄膜,磁控溅射Ag上电极制备结构为Ag/AlNxOy/Pt的阻变存储器(RRAM).器件呈现双极性阻变特性,正向开启电压稳定且分布窄,变化幅度集中在0.5V的范围内.高阻态和低阻态电阻之比超过103,并具有免激活特性.低温测试表明,器件的低阻态电阻和温度正相关,说明了阻变的机制为银导电细丝的形成和断裂.     

阻变存储器的电阻态精准调控及功能集成

面向大数据时代对新型高密度和功能集成存储器的迫切需求,来自中国科学院宁波材料技术与工程研究所李润伟团队的项目——"阻变存储器的电阻态精准调控及功能集成",以新一代信息存储技术——阻变存储器为研究对象,针对限制其发展应用的阻变参数一致性差和单元存储及功能密度低的难题,重点围绕"阻变机理研究→电阻态精准调控→器件功能集成"开展研究,在高密度和存算一体新型信息存储技术方面取得了创新性成果,获得2020年度浙江省自然科学奖一等奖.     

过渡金属氧化物自旋和电荷相关信息存储

信息技术的快速发展在某种程度上要求有高速度和大容量的非易失存储器.然而,随着晶体管尺度达到其量子极限,传统硅半导体器件的继续集成化发展遇到了瓶颈.因此,人们提出了一系列有潜力成为下一代更具功能性的存储器原型器件,并引起了广泛而持续的研究热潮.本文介绍3种基于新材料和新结构的新型存储原型器件：阻变开关器件、有机自旋阀和多铁隧道结.我们发现通过改变界面态,可将阻变式开关器件的反应速度提高数个量级,达到5ns;在实验上确认了超精细相互作用对自旋阀效应的影响;利用多铁隧道结实现了室温下的四重阻态存储.基于自旋、电荷相关信息存储的原理和实验结果,我们对这3种过渡金属氧化物器件目前还存在的问题及未来的应用前景进行了分析和讨论.     

铜纳米颗粒对氧化铪/氧化锌双介质层阻变特性的影响

通过微电子加工工艺制备了具有Ti/HfO_x:Cu NPs/ZnO/ITO结构的阻变存储器,研究铜纳米颗粒对器件阻变性能的影响. 研究表明,铜纳米颗粒不仅使器件操作电压减小、并且更加均一,而且增大了器件高低阻态的电阻值比（开关比）,高、低阻态电阻值更加稳定,表现出优异的耐擦写特性. 纳米颗粒的引入还使低阻态的导电由普尔-法兰克发射机制主导转变为欧姆导电细丝主导. 进一步研究发现,纳米颗粒增强了局部电场,不仅保证了较小电压下可产生更多的氧空位,还限定了导电细丝的位置. 此外,铜纳米颗粒有利于降低器件操作电压并提高其均一性,有助于提高阻态电阻值的稳定性.     

NiO_x阻变存储器性能增强方法及相关机理研究

通过精确控制在Pt衬底上制备NiOx薄膜的工艺过程,制备出阻值窗口增大5倍以上,高低阻态稳定的TiN/NiOx/Pt结构阻变存储器.研究发现,NiOx薄膜的多晶态结晶结构和化学组分,尤其是Ni元素的化学态,是影响NiOx阻变存储器阻值窗口和稳定性的主要因素.X射线光电子能谱和X射线多晶体衍射测试结果表明,当NiOx薄膜中间隙氧或Ni2+空位增多时,Ni2+会被氧化成为Ni3+以保持电中性,Ni3+离子在材料中引入空穴导致P型氧化物NiO的漏电流增大.基于此机理,提出通过提高淀积温度、降低氧气分压的方法抑制NiOx薄膜中间隙氧或Ni2+空位的产生,降低TiN/NiOx/Pt结构阻变存储器关态漏电流,增大阻值窗口.这种基于工艺的性能增强方法,在NiOx阻变存储器实际应用中有良好前景.     

一种Cu_xSi_yO阻变存储器的温度特性与微观机制分析

应用有效控制温度偏置的方法对基于0.13μm CMOS工艺的Ta/TaN/CuxSiyO/Cu结构的1Mbit阻变存储芯片进行开关性能和高低阻态导电性能的测试,介于-40～125℃温度区间的统计结果表明：set成功过程所需加载电场能量随偏置温度升高而升高,reset成功过程所需加载电场能量随偏置温度升高而降低;高阻态和低阻态随不同偏置温度呈现相似变化趋势——在-40～25℃间阻值均随偏置温度升高而升高,在25～125℃间均随偏置温度升高而呈下降趋势.针对以上现象提出了电学与热学结合的基于filament的微观模型,由铜空位构成的filament局部的反复形成与断裂对应于阻变存储器从高阻态到低阻态的重复转换,分析了电学和热学各自在CuxSiyO系列的阻变存储器开关和导电微观机制中所起作用.     

AlOx(PI)/HfOx界面调控的阻变开关行为

为了改善阻变开关层在厚度小于10 nm下的氧化铪(HfOx)基阻变存储器的电学性能,提高器件开关均匀性并增大器件开关比,在开关层中加入聚酰亚胺(polyimide,PI)薄层,采用光刻工艺制备Ti/AlOx(PI)/HfOx/Pt和Ti/HfOx/Pt结构的阻变存储器.利用扫描电子显微镜表征分析器件的电极形貌,通过电学...     

具有低功耗和多值存储性能的双层WO_X/AlON阻变存储器的研究

针对当前阻变存储器(RRAM)面临的功耗和高密度存储的问题,介绍了一种降低功耗和形成多值存储能力的器件结构.相比单层结构的AlON RRAM,双层结构的WOX/AlON RRAM具有低至10μA的复位(reset)电流,1 000次以上的转换特性(endurance),较低的操作电压,以及多值存储等性能.针对WOX/AlONRRAM,提出了WOX介质层的等效电路模型为固定电阻与二极管串联模型.在直流置位(DC set)过程中,电路中存在一个较大的过冲电流,使得无法通过控制限流来获得不同大小的低阻态.在增加WOX介质层后,在WOX层和AlON层间形成了界面肖特基势垒,因此有效地抵抗了过冲电流,提高了低阻态的可控性.     

AlO_x/WO_y阻变存储结构的转换特性和机理研究

通过构造AlO_x/WO_y双层结构实现了阻变存储器的均匀性、低功耗等特性,该器件阻变层中的AlO_x为氧空位渐变的梯度膜,从而使得形成的导电细丝更加稳定,在反复擦写过程中导电细丝断开和接上的位置基本不变,对应器件电学性能参数分布集中.采用阶梯脉冲信号结合Verify算法的方法对基于0.18μm CMOS工艺的Al/AlO_x/WO_y/W结构的阻变存储单元进行转换特性、可靠性的测试,统计结果表明:器件电学性能参数R_(on)、R_(off)和_(sct)等具有良好的均匀性,且无需高电压的初始置位过程;复位过程中复位电流小于15μA,远远小于单层器件Reset电流,很好地满足了存储器件的低功耗要求;在小电压长时间作用下,高低阻态仍保持不变,能有效地防止误擦写操作;通过高温烘烤测试,验证了器件的数据保持能力.同时,分析了WO_y薄膜在器件高低阻态转换过程中作为串联电阻降低复位电流的作用.     

An overview of resistive random access memory devices

With recent progress in material science, resistive random access memory (RRAM) devices have attracted interest for nonvolatile, low-power, nondestructive readout, and high-density memories. Relevant performance parameters of RRAM devices include operating voltage, operation speed, resistance ratio, endurance, retention time, device yield, and multilevel storage. Numerous resistive-switching mechanisms, such as conductive filament, space-charge-limited conduction, trap charging and discharging, Schottky Emission, and Pool-Frenkel emission, have been proposed to explain the resistive switching of RRAM devices. In addition to a discussion of these mechanisms, the effects of electrode materials, doped oxide materials, and different configuration devices on the resistive-switching characteristics in nonvolatile memory applications, are reviewed. Finally, suggestions for future research, as well as the challenges awaiting RRAM devices, are given.     

过渡性金属氧化物薄膜阻变存储材料进展概况

随着半导体技术和集成电路的进步,器件的集成度也不断提高,器件的特征尺寸不断减小,基于电荷存储的传统非易失性随机存储器面临着物理和技术上极限的挑战。阻变式存储器（RRAM）作为新一代的存储器件,因其器件具有结构简单、制备简便、存储密度高、擦写速度快、写入电流小等优势引起了人们广泛的研究。本文就目前基于过度氧化物薄膜的RRAM研究概况,从RRAM的基本工作原理、材料体系、存储机理和器件应用所面临的各种困难等方面对RRAM进行了简要评述。     

An overview of the switching parameter variation of RRAM

Resistive random access memory（RRAM） has been considered as one of the most promising candidates for next-generation nonvolatile memory, due to its advantages of simple device structure, excellent scalability, fast operation speed and low power consumption. Deeply understanding the physical mechanism and effectively controlling the statistical variation of switching parameters are the basis of fostering RRAM into commercial application. In this paper, based on the deep understanding on the mechanism of the formation and rupture of conductive filament, we summarize the methods of analyzing and modeling the statistics of switching parameters such as SET/RESET voltage, current, speed or time. Then, we analyze the distributions of switching parameters and the influencing factors. Additionally, we also sum up the analytical model of resistive switching statistics composed of the cell-based percolation model and SET/RESET switching dynamics. The results of the model can successfully explain the experimental distributions of switching parameters of the Ni O- and Hf O2-based RRAM devices. The model also provides theoretical guide on how to improve the uniformity and reliability such as disturb immunity. Finally, some experimental approaches to improve the uniformity of switching parameters are discussed.     

基于带符号位的浮点数运算的多位宽3D RRAM设计

本文介绍了卷积神经网络（convolutional neutral network,CNN）系统中具有多位存储的三维阻变式存储器（three-dimensional resistive random-access memory,3D RRAM）的带符号位的浮点数运算. 与其他类型存储器相比,3D RRAM可以在存储器内部进行运算,且具有更高的读取速率和更低的能耗,为解决冯诺依曼架构的瓶颈问题提供新方案. 单个RRAM单元的最大和最小电阻分别达到10 GΩ和10 MΩ,可在多级电阻状态下稳定,以存储多比特位宽的数据. 测试结果表明,带符号位的浮点数的卷积运算系统的精度可以达到99.8%,测试中3D RRAM模型的峰值读取速度为0.529 MHz.      

Enhanced resistive switching properties of HfAlOx/ZrO2- based RRAM devices

Resistive Random-Access Memory (RRAM) devices are recognized as potential candidates for next-generation memory devices, due to their smallest cell size, high write/erase speed, and endurance. Particularly, the resistive switching (RS) characteristics in oxide materials have offered new opportunities for developing CMOS-compatible high-density RRAM devices. In this study, the RS behavior of HfAlO_x/ZrO₂ thin films sandwiched structure between TiN bottom electrode and Au top electrodes were investigated. It was found that Au/HfAlO_x/ZrO₂/TiN stacks were superior in terms of RS performance when compare to Au/HfAlO_x/TiN memory stacks. The devices demonstrated a good resistance ratio of high resistance state and low resistance state ～10³ for Au/HfAlO_x/TiN and ～10⁵ for Au/HfAlO_x/ZrO₂/TiN stacks, respectively. Both stacks showed good retention characteristics (>10⁴ ?s) and endurance (>10³ cycles). The experimental current-voltage characteristics fitted with different conducting mechanisms, the linear lower bias region is dominated by ohmic conductivity, whereas the non-linear higher bias region was dominated by space-charge limited current conduction mechanism.     

An overview of resistive random access memory devices

With recent progress in material science, resistive random access memory (RRAM) devices have attracted interest for nonvolatile, low-power, nondestructive readout, and high-density memories. Relevant performance parameters of RRAM devices include operating voltage, operation speed, resistance ratio, endurance, retention time, device yield, and multilevel storage. Numerous resistive-switching mechanisms, such as conductive filament, space-charge-limited conduction, trap charging and discharging, Schottky Emission, and Pool-Frenkel emission, have been proposed to explain the resistive switching of RRAM devices. In addition to a discussion of these mechanisms, the effects of electrode materials, doped oxide materials, and different configuration devices on the resistive-switching characteristics in nonvolatile memory applications, are reviewed. Finally, suggestions for future research, as well as the challenges awaiting RRAM devices, are given.     

Improving the electrical performance of resistive switching memory using doping technology

In this paper, improvements of resistive random access memory (RRAM) using doping technology are summarized and analyzed. Based on a Cu/ZrO2/Pt device, three doping technologies with Ti ions, Cu, and Cu nanocrystal, respectively, are adopted in the experiments. Compared to an undoped device, improvements focus on four points: eliminating the electroforming process, reducing operation voltage, improving electrical uniformity, and increasing device yield. In addition, thermal stability of the high resistance state and better retention are also achieved by the doping technology. We demonstrate that doping technology is an effective way of improving the electrical performance of RRAM.     

低压微电网逆变器并离网平滑切换控制

分布式能源通过电力电子变换器与本地负载、储能设备等相结合构成微电网;并实现在并网、离网及并离网相互切换模式下的稳定运行。采用下垂控制实现微电网离网运行时逆变器输出电压和频率的稳定、并网运行时输出功率的恒定,并且不改变控制方式实现并离网的平滑切换控制。由于传统下垂控制在离网运行时,逆变器输出电压与频率存在一定的偏差;并且为了使逆变器输出阻抗呈阻性以减小控制参数对输出阻抗的影响,采用一种改进的下垂控制策略;并在逆变器双闭环控制中加入虚拟阻抗。仿真结果验证了改进下垂控制策略在离网、并网以及并离网相互切换运行时的有效性,以及相比于传统下垂控制策略的优越性。     

Approaches for improving the performance of filament-type resistive switching memory

Resistive random access memory (RRAM) has received significant research interest because of its promising potential in terms of down-scaling,high density,high speed and low power. However,its endurance,retention and uniformity are still imperfect. In this article,the physical mechanisms of filament-type RRAM and the approaches for improving the switching performance,including doping,process optimization and interface engineering,are introduced.