ZnO whiskers growth on the surface of Sn9 Zn/Cu solder joints in concentrator silicon solar cells solder layer

ZnO whiskers observation on the surface of SnZn/Cu solder joints in concentrator silicon solar cells solder layer is reported.In the experiment, SnZn/Cu samples are left in laboratory after reflow soldering for two years before an examination by SEM, then ZnO whiskers can be observed obvious-ly, which grows out from the rich-Zn phase of the samples and causes electrical short circuit in the electronics appliances, which demonstrates that the SnZn solder shows a risk for the short circuiting failure of an electronic device.Moreover, the growth mechanism of ZnO whiskers is researched based on cracked oxide theory, which provides the reference support for SnZn solders application.     

Characterization of Cu3P phase in Sn3.0Ag0.5Cu0.5P/Cu solder joints

This article reports the effects of phosphorus addition on the melting behavior, microstructure, and mechanical properties of Sn3.0Ag0.SCu solder. The melting behavior of the solder alloys was determined by differential scanning calorimetry. The interracial micro- structure and phase composition of solder/Cu joints were studied by scanning electron microscopy and energy dispersive spectrometry. Thermodynamics of Cu-P phase formation at the interface between Sn3.0Ag0.5Cu0.5P solder and the Cu substrate was characterized. The results indicate that P addition into Sn3.0Ag0.5Cu solder can change the microstructure and cause the appearance of rod-like CuaP phase which is distributed randomly in the solder bulk. The Sn3.0Ag0.5Cu0.5P joint shows a mixture of ductile and brittle fracture after shear test- ing. Meanwhile, the solidus temperature of Sn3.0Ag0.5Cu solder is slightly enhanced with P addition.     

低银Sn1.0Ag0.5Cu焊点疲劳寿命预测

基于Garofalo-Arrhenius蠕变模型,采用有限元法模拟WLCSP 5×6器件低银Sn1.0Ag0.5Cu无铅焊点的应力-应变响应,并借助蠕变应变疲劳寿命预测模型计算Sn1.0Ag0.5Cu焊点疲劳寿命.结果表明:在交变的温度循环载荷作用下,整个电子器件出现明显的翘曲现象,中心焊点的应力-应变最小,从中心到拐角焊点应力-应变逐渐增加,拐角焊点应力-应变最大.随着服役时间的增加,焊点内部的蠕变应变显著增加.计算Sn3.0Ag0.5Cu,Sn1.0Ag0.5Cu和Sn37Pb三种焊点的疲劳寿命,发现Sn3.0Ag0.5Cu焊点疲劳寿命明显高于另外2种焊点,Sn1.0Ag0.5Cu和Sn37Pb焊点的疲劳寿命相当.证明了低银Sn1.0Ag0.5Cu无铅钎料可以代替Sn37Pb钎料应用于电子封装,研究结果为低银无铅钎料和焊点可靠性的研究提供了理论支撑.     

回流次数对Sn3.5Ag0.5Cu焊点特性的影响

研究了回流次数对Sn3．5Ag0．5Cu焊点特性的影响,采用扫描电镜SEM和光学显微镜对多次回流后Sn3．5Ag0．5Cu焊点界面金属间化合物（IMC）层的形貌和拉伸断裂断口形貌进行了分析．结果表明：随着回流次数的增加,焊点的宽度和金属间化合物的厚度增加;焊料和凸点下金属化层（UBM）之间界面上的IMC组织从针状逐渐粗化;焊料的拉伸强度有轻微变化;断裂面第一次回流焊后出现在焊料中,而多次回流焊后断裂面部分出现在焊料中,部分出现在UBM和焊料的界面中．     

Abnormal growth of Ag_3Sn intermetallic compounds in Sn-Ag lead-free solder

Tin-lead solders have been used for some 2000 years and applied widely in the assembly of modern elec-tronic circuits. However, Pb is harmful to the nervous system of human beings and hazardous to the environ-ment. The European Union directive on waste el…     

微量Ag对Sn0.7Cu力学性能影响

SnCu共晶钎料在波峰焊领域被公认为SnPb共晶及近共晶钎料的最佳替代合金之一,但其熔点高,力学性能不良。本文采用合金化原理,在Sn0.7Cu合金中添加微量的Ag形成SnCuAg三元合金来改善合金性能。结果表明:当Ag质量分数小于0.2%时,随Ag含量增加,SnCuAg钎料抗拉强度和剪切强度逐渐提高;当Ag质量分数为0.2%时,SnCuAg抗拉强度较基体提高35.5%,剪切强度较基体提高46.5%。当Ag质量分数大于0.2%时,钎料合金的力学性能有所下降,这主要与新相Ag3Sn弥散强化作用及母材界面金属间化合物有关。     

Electrochemical migration behaviors of lead-free 64Sn-35Bi-1Ag solder on FR-4 PCB board plated with Cu

Electrochemical migration (ECM) characteristic is a new reliability failure. A parallel surfacial electrode system coupling with scanning electron microscope (SEM), energy dispersive X-ray analysis (EDAX), and X-ray Diffraction (XRD) technologies is designed to research ECM behavior of 64Sn-35Bi-1Ag (SBA) solder in 3.5 g/L NaCl solution and compare to that of Sn37Pb and Sn-3.0Ag-0.5Cu (SAC) solders. Results show that SBA solder is more susceptible to ECM failure than Sn37Pb solder, which is more difficult than SAC solder. The affected factors of ECM are given as follows: the solder compositions, the loaded electric field, ECM time, etc. The electrochemical reaction mechanism of ECM process is achieved. EDAX and XRD analyses show that the main contents on dendrites of SBA solder after ECM test are Sn, hardly any Bi, a little Ag, which illustrates that the order of ion migration capacity is shown as follows: Sn Ag Bi.     

铝钎焊接头中Cu的腐蚀与扩散行为

应用X射线衍射仪、扫描电镜和能谱分析仪 ,研究了Al Si Cu钎料中Cu在真空钎焊接头中的腐蚀与扩散行为 .研究结果表明 ,真空钎焊后的接头仍然存在腐蚀问题 ,如点蚀和晶间腐蚀等 ,并且随着w(Cu)的增加腐蚀加重 .Cu在钎焊接头中以晶界扩散为主 ,且晶界扩散比晶内扩散快 .     

PbZr0.3Ti0.7O3/PbTiO3超晶格的热释电性研究

基于朗道-金兹堡格-德文希尔(Landau-Ginzburg-Devonshire)热力学理论,我们研究了由PbZr0.3Ti0.7O3(PZT)与PbTiO3(PT)两种组份组成的超晶格的热释电性,并且考虑了两组份之间的失配应变的影响.我们探讨了界面耦合强度、组分厚度比例以及失配应变等对超晶格的极化强度和热释电性的影响.计算结果表明,这种铁电超晶格材料具有巨大的热释电系数.因此,我们可以通过调节界面耦合强度、组份比例等方法达到调控热释电性的目的,为实验和应用研究提供一个可靠而有效的方法.     

Microstructural evolutions of Cu(Ni)/AuSn/Ni joints during reflow

Interfacial reactions of the Ni/AuSn/Ni and Cu/AuSn/Ni joints are experimentally studied at 330℃for various reflow times.The microstructures and mechanical properties of the as-solidified solder joints are examined.The as-solidified solder matrix of Ni/AuSn/Ni presents a typical eutecticξ-(Au,Ni)_5Sn+δ-(Au,Ni)Sn lamellar microstructure after reflow at 330℃for 30 s.After reflow for 60 s,a thin and flat(Ni,Au)_3Sn_2 intermetallic compound(IMC) layer is formed,and some needle-like(Ni,Au)_3Sn_2 phases grow f...     

装配对典型螺栓/螺母紧固件盐雾环境腐蚀行为的影响

海军航空装备的快速发展导致飞机必将面临更为严峻的海洋大气腐蚀问题,而军用飞机紧固件的腐蚀,尤其电偶腐蚀将严重影响飞机结构的安全性水平.因此,本文采用盐雾腐蚀模拟、扫描电镜观察与分析、电化学测试分析(自腐蚀电位测试、动电位极化测试、电偶腐蚀电流测试)等试验研究方法,将航空装备常用的30CrMnSiA镀镉钝化螺栓与三种不同螺母(30CrMnSiA镀镉钝化螺母、30CrMnSiA镀锌钝化螺母和0Cr16Ni6钝化螺母)偶接装配,研究由于装配导致的电偶腐蚀效应对典型螺栓/螺母紧固件腐蚀行为的影响.结果表明,在三种不同组合装配中,30CrMnSiA镀镉钝化螺栓与0Cr16Ni6钝化螺母之间电位差最大,电偶腐蚀电流密度最高,对应螺栓电偶腐蚀敏感性评级达到E级,电偶腐蚀作用促进了镀镉钝化螺栓基体表面点蚀的扩展,腐蚀进程被加速,加速系数AF达到3.4;30CrMnSiA镀镉钝化螺栓与30CrMnSiA镀锌钝化螺母之间电偶效应则较弱,且螺母为电偶腐蚀阳极,腐蚀进程被加速,加速系数AF为1.2,电偶腐蚀敏感性评级为D级;相比上述两种组合,30CrMnSiA镀镉钝化螺栓与30CrMnSiA镀镉钝化螺母之间电偶效应最不明显,对应电偶腐蚀敏感性评级为A级.     

Ag／Cu系的DIGM及迁移晶界扩散系数

用配有X－射线能谱的扫描电镜及光学显微镜观察了400，480度及580度，经不同时间，Ag膜／Cu块扩散对中Ag沿Cu晶界扩散诱发的晶界迁移（DIGM）现象，根据迁移晶界的特征，选用与其特征相适应的扩散方程数学解，计算了迁移晶界与一胸止晶界的扩散系数。     

纳米化对Ag-50Ni在H3PO4介质中腐蚀电化学行为影响

通过电化学极化曲线方法和电化学交流阻抗谱(EIS)技术对比研究了不同晶粒尺寸的Ag-50Ni合金在不同浓度的H3PO4介质中的耐腐蚀性能。结果表明:2种尺寸的Ag-50Ni合金在不同浓度的H3PO4介质中主要呈单容抗弧特征,其中纳米尺寸的Ag-50Ni合金在H3PO4浓度分别为0.0,0.1及0.5 mol/L中呈双容抗弧特征,表明电极表面腐蚀受电化学反应控制。随着H3PO4浓度的增加,合金的自腐蚀电位向负方向移动,传递电阻逐渐减小,腐蚀电流密度逐渐增大,表明腐蚀速度加快。在同一种浓度腐蚀介质中,常规尺寸Ag-50Ni合金的腐蚀电流密度低于纳米尺寸Ag-50Ni合金,表明晶粒细化后抗腐蚀性能降低。     

电阻法探测Al和Al-Cu合金形核与初始生长

用电阻法探测了 Al和 Al-Cu合金的凝固过程 ,研究了形核与初始生长对电阻率的影响 ;观察到结晶开始时总是伴有电阻率突然升高现象 (呈山峰状 ) ;而添加晶粒细化剂后凝固开始时电阻率突然升高的峰值减小     

Cu48Zr43Al9合金在0.05mol/L Na2SO4介质中腐蚀电化学行为研究

采用真空电弧熔炼法制备Cu48Zr43Al9晶态合金及铜模铸造法制备Cu48Zr43Al9非晶合金。通过极化曲线和交流阻抗谱技术研究了Cu48Zr43Al9晶态和非晶态合金在0.05 mol/LNa2SO4溶液中腐蚀电化学行为。结果表明,在0.05 mol/LNa2SO4溶液中,Cu48Zr43Al9晶态和非晶态合金的交流阻抗谱均呈单容抗弧,实验结果说明合金的腐蚀过程是由电化学控制。与非晶合金相比,腐蚀电位负移,晶态合金的电荷传递电阻减小,腐蚀电流密度变大,腐蚀速度加快。在0.05mol/LNa2SO4溶液中,Cu48Zr43Al9非晶态合金具有良好的耐腐蚀性能,这是因为非晶态合金不具有晶格缺陷,结构均一稳定。