萃取界面乳液的固体微粒稳定机理

对铜溶剂萃取时萃原液中固体微粒稳定界面乳化液的机理进行了研究.研究结果表明:固体微粒是促进界面乳液形成和稳定的关键因素,它通过3种机制稳定界面乳化液:一是减小乳化液滴粒度和粒度分布区间,当萃原液中固体微粒的质量浓度由0.138 g/L增加到2.918 g/L时,液滴平均粒径由346.7μm减小到25.5 μm,48 h后破乳率由84%降低到27%;二是在液滴界面形成固体复合界面膜对液滴起保护作用;三是以微粒絮团的方式填充于液滴间隙中,阻断液滴接触,防止液滴聚结破乳.     

超声波在Ni-Si3N4纳米复合电镀中的作用

采用超声波分散技术在纯铜板上制备了含有纳米Si3N4镍基复合镀层,研究了超声波对纳米颗粒含量、复合镀层显微硬度及组织结构的影响.用扫描电镜观察镀层表面显微组织,利用MM-200磨损实验机检测所得复合镀层的耐磨性能,结果表明,采用超声波分散技术可获得性能优良的复合镀层.     

Fe2O3-MoO3-Sb2O3体系中的固相反应

通过混合焙烧的方法制备Fe2O3MoO3Sb2O3复合氧化物.采用X射线衍射(XRD)、同步热重差示扫描量热(TGDSC)和穆斯堡尔(Mssbauer)谱研究Fe2O3MoO3Sb2O3三组分体系在不同温度下的固相反应,并分别与Fe2O3MoO3和Fe2O3Sb2O3双组分体系的结果加以对比.结果表明,Sb2O3加入到Fe2O3MoO3体系中抑制了Fe2(MoO4)3的形成,而MoO3加入到Fe2O3Sb2O3体系,则可显著促进FeSbO4的生成.     

K4Sn3Se8的固相合成、晶体结构和反射光谱研究

采用反应性熔盐法，通过中温固相反应在500℃下合成晶体K₄Sn₃Se₈。该晶体属正交晶系，空间群Ccca，晶胞参数：a=0.82115(6)nm，b=2.7790(2)nm，c=0.81865(6)nm，V=1.8682(2)nm³，Z=4。K₄Sn₃Se₈由[Sn₃Se₈]₄三聚体负离子和K⁺正离子组成。漫反射光谱研究表明该材料能隙(Eg)为2.6eV，属于半导体，对太阳能具有选择吸收的特性。     

SiC/M-Al金属间化合物界面固相反应研究进展

SiC/M(M=Ti,Ni,Fe)-Al金属间化合物界面固相反应的研究是材料科学领域内一个重要的理论研究课题。SiC/M-Al界面固相反应及界面状态决定着SiC/M-Al固相扩散焊接件及SiC/M-Al基复合材料的力学性能和使用性能。文章就近年来SiC/M-Al界面固相反应的研究成果进行综述,包括反应热力学与相平衡分析,反应层的组成与结构以及反应动力学与反应微观机制;并就目前研究的不足以及如何改进提出了一些看法。     

全固态碱性Cd/Ni二次电池的制备及其性能

用溶液浇铸法制备含有聚乙烯醇(PVA)/羧甲基纤维素(CMC)聚合物、KOH和水的复合碱性固态聚合物电解质PVA/CMC/KOH/H2O.采用扫描电镜,循环伏安和交流阻抗技术研究PVA/CMC/KOH/H2O的特性.研究结果表明：在室温时,PVA/CMC/KOH/H2O离子电导率最高可达7.1×10-2S·cm-1;在循环伏安曲线上,在0.15,-0.30和-0.70 V时出现明显的氧化还原峰.以PVA/CMC/KOH/H2O为电解质组装的电池,当以1 mA/cm2的电流密度放电时,在1.10～1.40 V有放电平台出现;当以3 mA/cm2电流密度充、放电时,电池经过42次循环后,充、放电效率为88％～95％,表明PVA/CMC/KOH/H2O电解质具有较强的稳定性;电池内阻随着充电过程的进行逐步降低,随着放电过程的进行急剧增大;内阻的增加除了与电极充放电状态有关外,还与外加电场对电解质的影响有关.     

Cu(acac)_2/Ni共同催化的C-S偶联反应研究

Cu(acac)2/Ni共同催化卤代芳烃与硫酚的偶联反应,该反应以DMSO为溶剂,80℃条件下反应6 h,高产率地得到了一系列硫醚衍生物.     

Si_（83）Ge_（17）/Si压应变衬底上HfAlO_x栅介质薄膜微结构、界面反应和介电性能研究

本文研究了射频磁控溅射沉积在p-Si83Ge17/Si（100）压应变衬底上HfAlOx栅介质薄膜的微结构及其界面反应,表征了其各项电学性能,并与相同制备条件下沉积在p-Si（100）衬底上薄膜的电学性能进行了对比研究.高分辨透射电子显微镜观测与X射线光电子能谱深度剖析表明600°C高温退火处理后,HfAlOx薄膜仍保持非晶态,但HfOx纳米微粒从薄膜中分离析出,并与扩散进入膜内的Ge,Si原子发生界面反应生成了富含Ge原子的HfSiOx和HfSix的混合界面层.相比在相同制备条件下沉积在Si（100）衬底上的薄膜样品,Si83Ge17/Si（100）衬底上薄膜的电学性能大幅提高：薄膜累积态电容增加,有效介电常数增大（～17.1）,平带电压减小,？1V栅电压下漏电流密度J减小至1.96×10？5A/cm2,但电容-电压滞后回线有所增大.Si83Ge17应变层抑制了低介电常数SiO2界面层的形成,从而改善了薄膜大部分电学性能;但混合界面层中的缺陷导致薄膜界面捕获电荷有所增加.     

氨基磺酸镍体系电沉积纳米镍的力学性能及热稳定性研究

采用氨基磺酸镍体系镀镍液代替瓦特型镀镍液,应用脉冲电沉积技术,制备了平均晶粒尺寸为16.7 nm的纳米镍.在静拉伸应变速率范围(5×10-5~10-2s-1)内,纳米镍的强度和塑性均随应变速率的增加而增加,断裂形式表现为韧窝韧性断裂,获得的最高断裂强度和最大断裂延伸率分别为1 332MPa和5.31%.在退火温度为100、150和200℃保温1 h后,室温应变速率为10-3s-1时,纳米镍的强度和塑性随退火温度的升高而显著下降,原因为退火过程中晶内硫元素向晶界强烈偏聚引起材料变脆,断裂形式表现为晶间脆性断裂.XRD和TEM的观测结果表明,纳米镍在250℃退火时,晶粒发生显著长大,硬度快速下降.热分析仪测得的放热峰表明,275℃以后,大量的纳米晶粒发生异常长大.     

负载型非晶态合金催化剂（Ni—B／SiO2）与己二腈气固相常压加氢的研究

采用化学还原法合成了负载型Ｎｉ－Ｂ非晶态合金催化剂及其对应的晶态Ｎｉ系催化剂。用电感耦合等离子光谱（ＩＣＰ）、Ｘ－射线衍射（ＸＲＤ）、扫描电子显微镜（ＳＥＭ）、Ｘ－射线光电子能谱（ＸＰＳ）、比表面测定（ＢＥＴ）及氢吸附法对催化剂进行了表征。活性测试结果表明：负载型非晶态合金催化剂（Ｎｉ－Ｂ／ＳｉＯ２）对己二腈气固相常压加氢反应具有很高的活性和选择性,工业应用前景乐观。     

Hillock Sn whiskers growth behaviors in Sn0.3Ag0.7Cu/Cu solder joints during corrosion

Hillock Sn whiskers in Sn0.3Ag0.7Cu solder are investigated in 20 seconds in corrosive climate(95% methanol and 5% nitric acid),and the growth mechanism of hillock Sn whiskers is studied.The results indicate that hillock Sn whiskers are formed near the interface of Sn0.3Ag0.7Cu/Cu solder joints,and small corrosion pits provide conceive sites for Sn whiskers. Moreover,compressive stress induced by IMC reaction and oxidation for the whisker growth may be suggested as the driving force.     

关于固体物理能带论中布里渊区的注记

布里渊区是固体物理学能带论中的一个非常重要的概念,比较抽像,本文主要从布里渊区的描述及其特征等几个方面进行了讨论。     

快淬CoNiCu系列金属条带的巨磁电阻效应

研究了用快淬制备的铸态和退火处理后的颗粒合金膜Co 20NixCu 80-x(0≤x≤20)的结构、磁电阻性能.利用电镜观察到Co-Ni纳米颗粒在Co-Ni-Cu合金薄膜中分布均匀,与Co-Cu合金薄膜有不同.CoNiCu系列样品随Ni成分的增加,其相变过程由形核长大类型向失稳分解类型过渡.而且在室温下有比Co-Cu样品有更大的MR幅度.750 K下退火10 min的Co 20Ni5Cu 75快淬条带在300 K下的ΔR/R≌6.5%.     

三相电极伏安法在液/液界面电化学中的应用

三相电极伏安法是研究液／液界面电荷迁移的一种新方法,它具有简单易操作的特点．回顾了液／液界面电化学的发展历史,介绍了三相电极伏安法的实验原理,并对其在电化学中的应用和研究进展加以总结．     

扩散连接Al／Ni／0Crl8Ni9Ti复合材料的界面组织

选取纯Ni箔作过渡层，采用真空热压扩散工艺，在加热温度480℃、压力10MPa、真空度1．0×10^-21Pa的工艺条件下，制备了变形铝合金2024和不锈钢0Crl8 Ni9Ti双金属复合材料．利用扫描电子显微镜、能谱仪、X射线衍射仪和显微硬度仪等测试分析方法，对双金属复合材料的2个连接界面及基体进行了组织、性能分析．结果表明：不锈钢／纯Ni界面形成了宽约8μm的互扩散区，但其过渡区无金属间化合物生成；Al／Ni界面生成了宽约4μm的扩散过渡区，过渡区的相组成为金属间化合物Al3Ni2、Al3Ni及Al3Ni5．     

Effect of reinforcement content on the adhesive wear behavior of Cu10Sn5Ni/Si_3N_4 composites produced by stir casting

The main objective of this paper was to fabricate Cu_(10)Sn_5Ni alloy and its composites reinforced with various contents of Si_3N_4 particles(5wt%, 10wt%, and 15wt%) and to investigate their dry sliding wear behavior using a pin-on-disk tribometer. Microstructural examinations of the specimens revealed a uniform dispersion of Si_3N_4 particles in the copper matrix. Wear experiments were performed for all combinations of parameters, such as load(10, 20, and 30 N), sliding distance(500, 1000, and 1500 m), and sliding velocity(1, 2, and 3 m/s), for the alloy and the composites. The results revealed that wear rate increased with increasing load and increasing sliding distance, whereas the wear rate decreased and then increased with increasing sliding velocity. The primary wear mechanism encountered at low loads was mild adhesive wear, whereas that at high loads was severe delamination wear. An oxide layer was formed at low velocities, whereas a combination of shear and plastic deformation occurred at high velocities. The mechanism at short sliding distances was ploughing action of Si_3N_4 particles, which act as protrusions; by contrast, at long sliding distances, direct metal–metal contact occurred. Among the investigated samples, the Cu/10wt% Si_3N_4 composite exhibited the best wear resistance at a load of 10 N, a velocity of 2 m/s, and a sliding distance of 500 m.     

Effect of reinforcement content on the adhesive wear behavior of Cu10Sn5Ni/Si3N4 composites produced by stir casting

The main objective of this paper was to fabricate Cu10Sn5Ni alloy and its composites reinforced with various contents of Si3N4 particles (5wt％,10wt％,and 15wt％) and to investigate their dry sliding wear behavior using a pin-on-disk tribometer.Microstructural examinations of the specimens revealed a uniform dispersion of Si3N4 particles in the copper matrix.Wear experiments were performed for all combinations of parameters,such as load (10,20,and 30 N),sliding distance (500,1000,and 1500 m),and sliding velocity (1,2,and 3 m/s),for the alloy and the composites.The results revealed that wear rate increased with increasing load and increasing sliding distance,whereas the wear rate decreased and then increased with increasing sliding velocity.The primary wear mechanism encountered at low loads was mild adhesive wear,whereas that at high loads was severe delamination wear.An oxide layer was formed at low velocities,whereas a combination of shear and plastic deformation occurred at high velocities.The mechanism at short sliding distances was ploughing action of Si3N4 particles,which act as protrusions;by contrast,at long sliding distances,direct metal-metal contact occurred.Among the investigated samples,the Cu/10wt％ Si3N4 composite exhibited the best wear resistance at a load of 10 N,a velocity of 2 m/s,and a sliding distance of 500 m.     

Research on catalysis of sodium-metallochlorophylls in Ni/MH battery

The effects of sodium-metallochlorophylls including sodium-iron chlorophyllin, sodium-copper chlorophyllin and sodium-magnesium chlorophyllin on performance of Ni/MH battery were investigated. The results show that sodium-iron chlorophyllin can effectively activate the gases produced during charge in Ni/MH battery, therefore reducing the reduction potential of oxygen and the oxidation potential of hydrogen, and the increased speed of inner pressure of battery is decreased significantly. With the aid of DMol3 software, the activation process of oxygen and hydrogen by sodiummetallochlorophylls was simulated and analyzed. It was found that the catalysis behavior is in agreement with the experimental results, and the activation process also gets a reasonable explanation from the calculated results.     

Cu/Ni多层膜的电阻与位错

采用电桥及X射线衍射线形分析法研究磁控溅射Cu／Ni多层膜（CLI及Ni单层厚度均为5nm）的室温电阻率及平均位错密度随对层（bilayer）层数的变化规律．结果表明,随层数增加,电阻率及平均位错密度减少;多层膜电阻率大于单层膜电阻率;单层膜电阻率大于同质块状体的电阻率．并对其微观机制进行分析．     

Fe-Ni-O体系中Fe/Ni的还原行为

取电阻炉实验和热重分析等手段,探讨了Fe-Ni-O体系中不同条件下的产物组成及Fe/Ni的还原行为.结果表明:五种样品的还原难度由低到高依次为NiO2O₃+Ni2O₃+NiO2O₄2O₃;Ni元素能够促进铁氧化物还原,其促进作用由Ni元素的初始状态决定,单质Ni>氧化物NiO>NiFe₂O₄中的Ni;NiFe₂O₄的还原过程中各产物由低温到高温依次出现的次序为Fe₃O₄、Ni、（Fe,Ni）、Fe和Fe_0.64Ni_0.36.根据实验结果,对五种氧化物体系的还原过程进行了探讨,并获得了活化能、控速环节等重要参数及相关反应机理.