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1.
为了制备高导热、低热阻的大面积导热界面材料,使用静电植绒法在高电压静电场下垂直取向石墨微鳞片,取向后的石墨微鳞片阵列在平面方向上呈现无规且紧凑的结构。通过微粉灌注法向石墨微鳞片中填充高密度聚乙烯(HDPE)或聚氨酯微粉,或者通过液态刮涂法填充低黏度硅橡胶前驱体,加热固化后,形成大面积高导热界面材料。导热性能测试结果表明:石墨微鳞片阵列(粒径1 000 μm)与柔性聚氨酯微粉复合形成的导热膜在68.95 kPa和689.5 kPa的压力下测得的垂直方向导热率分别为4.3 W/(m·K)和8.7 W/(m·K);与柔性硅橡胶复合形成的导热膜在68.95 kPa和344.75 kPa的压力下测得的垂直方向导热率分别为2.0 W/(m·K)和4.1 W/(m·K);与硬质HDPE微粉复合形成的导热膜由于表面过于粗糙和坚硬,无法测得可靠的导热率。实际散热效果显示,柔性硅橡胶导热膜与石墨纸贴合的散热结构能够将热聚集点的热量快速传递到石墨纸表面,并通过石墨纸层均匀散开。  相似文献   

2.
通过液相还原法制备得到铜纳米线(CuNWs)及铜纳米片(CuNPs),将其与环氧树脂(EP)共混制备得到复合材料,利用导热系数测试、电阻测试和扫描电镜等手段对复合后材料的导热性能、绝缘性能以及微观结构进行了表征,结果表明:填充了CuNWs或CuNPs的EP在显著提升导热性能的同时仍然具有良好的绝缘性;当CuNWs和CuNPs的填充体积分数为11%时,复合材料的导热系数可分别提高至1.09 W/(m·K)和1.26 W/(m·K),相对于树脂基体导热系数分别提升了474%和563%,同时电阻率分别为9.0×1010 Ω·cm和6.2×1010 Ω·cm,保持了较好的绝缘性,显示出这类材料在导热领域有着广阔的应用前景。  相似文献   

3.
Diamond reinforced copper (Cu/diamond) composites were prepared by pressure infiltration for their application in thermal management where both high thermal conductivity and low coefficient of thermal expansion (CTE) are important. They were characterized by the microstructure and thermal properties as a function of boron content, which is used for matrix-alloying to increase the interfacial bonding between the diamond and copper. The obtained composites show high thermal conductivity (>660 W/(m·K)) and low CET (<7.4×10-6 K-1) due to the formation of the B13C2 layer at the diamond-copper interface, which greatly strengthens the interfacial bonding. Thermal property measurements indicate that in the Cu-B/diamond composites, the thermal conductivity and the CTE show a different variation trend as a function of boron content, which is attributed to the thickness and distribution of the interfacial carbide layer. The CTE behavior of the present composites can be well described by Kerner’s model, especially for the composites with 0.5wt% B.  相似文献   

4.
Mica was used as a supporting matrix for composite phase change materials(PCMs)in this work because of its distinctive morphology and structure.Composite PCMs were prepared using the vacuum impregnation method,in which mica served as the supporting material and polyethylene glycol(PEG)served as the PCM.Fourier transform infrared and X-ray diffraction analysis confirmed that the addition of PEG had no effect on the crystal structure of mica.Moreover,no chemical reaction occurred between PEG and mica during the vacuum impregnation process,and no new substance was formed.The maximum load of mica-stabilized PEG was 46.24%,the phase change temperature of M400/PEG was 46.03℃,and the latent heat values of melting and cooling were 77.75 and 77.73 J·g?1,respectively.The thermal conductivity of M400/PEG was 2.4 times that of pure PEG.The thermal infrared images indicated that the thermal response of M400/PEG improved relative to that of pure PEG.The leakage test confirmed that mica could stabilize PEG and that M400/PEG had great form-stabilized property.These results demonstrate that M400/PEG has potential in the field of building energy conservation.  相似文献   

5.
本文用具有环境友好性的甲基三乙氧基硅烷替代甲基三甲氧基硅烷,在水溶剂体系中,利用阳离子表面活性剂制备SiO2气凝胶基体,并以耐高温的聚酰亚胺短切纤维为增强相,制备得到了柔性疏水的SiO2气凝胶复合隔热材料。研究了聚酰亚胺短切纤维含量对复合材料热、力学性能的影响。结果表明:制备得到的SiO2气凝胶复合材料具有纤维状三维骨架结构并且气凝胶基体与增强相之间结合紧密,使得复合材料具有超疏水性,疏水角高达171°;具有良好的隔热保温性能,导热系数在0.021 W/(m·K)~0.0225 W/(m·K)之间,初始热分解高达521℃;具有较好的弹性,压缩20%形变后样品未发生增强相与基体的分离现象,并且卸压后能回弹至12%形变处。随着纤维含量的增加,复合材料里压缩强度(20%形变)逐渐增大,但是回弹率并没有较大的变化。  相似文献   

6.
高导热碳/碳复合材料的制备   总被引:1,自引:0,他引:1       下载免费PDF全文
以中间相沥青和中间相沥青基碳纤维为原料, 采用碳布热压法、液相浸渍法制备了二维和三维高导热碳/碳复合材料, 且所制得复合材料的热导率分别高达443和340 W/(m·K). 依据碳/碳复合材料的热导率模型, 分析了不同结构特征参数对材料热导率的影响. 结果表明, 基体碳热导率、孔隙率以及界面相厚度均会在一定程度上影响材料的导热性能.  相似文献   

7.
Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature (HPHT) infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters (temperature, pressure, and time). The improvement in interfacial bonding strength and the maximum thermal conductivity of 750 W/(m·K) were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.  相似文献   

8.
为了提高电子器件抗热冲击的能力、保证电子器件运行的可靠性和稳定性,以石蜡为相变储能材料、膨胀石墨为支撑材料,采用物理吸附法制备石蜡/膨胀石墨复合相变材料,将其应用于电子器件的热管理中,并通过模拟芯片实验研究了石蜡/膨胀石墨复合相变材料控温电子散热器的性能.结果表明:石蜡质量分数为90%的复合相变材料的导热系数相比于纯石蜡(0.3608 W/(m.K))提高了约4倍;相变材料填充于散热器中,可有效降低模拟芯片的升、降温速率,延长散热器的控温时间;当芯片发热功率为15和20W时,散热器填充复合相变材料后的控温时间较填充前分别提升了59%和20%,可降低电子器件因温度瞬间升高而烧坏的可能性,实现对电子器件的保护.  相似文献   

9.
活性炭/膨胀石墨固化混合吸附剂导热和渗透性能测试   总被引:1,自引:0,他引:1  
为了提高活性炭吸附剂的传热性能,同时不影响其传质特性,选择6种不同粒径的活性炭吸附剂,并按5种比例制备了活性炭/膨胀石墨固化混合吸附剂,采用稳态法,对样品进行了导热系数、渗透率的性能测试.研究表明:在600 kg/m3的密度下,不同粒径活性炭吸附剂导热系数基本维持在0.36 W/(m·K)的恒定值,渗透率随着粒径的增大而增大;活性炭/膨胀石墨固化混合吸附剂的导热系数最高可达2.61 W/(m·K);随着活性炭比例的升高,导热系数逐渐减小,渗透率逐渐增大;当活性炭比例达到最大的71.4 %(2.5∶1.0)时,导热系数为2.08 W/(m·K)、渗透率为51.6 μm2,相比颗粒状活性炭,其导热系数提高了5.6倍.  相似文献   

10.
The SiC honeycomb/Al-Mg-Si composite with interpenetrated microstructure was prepared by spontaneous infiltration of Al-8 wt%Mg-7 wt%Si alloy into directional porous SiC honeycomb served as reinforcement. The microstructure and anisotropic thermophysical properties of this composite were also examined. The results showed that the initial microstructure of the SiC honeycomb can be retained and the as-prepared SiC honeycomb/Al-Mg-Si composite exhibited significantly anisotropic characteristics. Meanwhile, the alloying treatment on the Al matrix can avoid the generation of Al_4C_3 and promote the wettability between Al and SiC.Particularly,the directional porous SiC honeycomb with such a low ceramic content(19 vol.%) made it possible for the composite to have a higher thermal conductivity(138.3 W/(m?K)) in the axial direction and a lower coefficient of thermal expansion(11.40 × 10~(-6)/K) in the radial direction.The influences of the SiC honeycomb reinforcement on the anisotropic thermophysical properties were also studied by the theoretical models in comparing with the experimental results.  相似文献   

11.
石蜡/膨胀石墨复合相变材料的结构与热性能   总被引:15,自引:1,他引:15  
以有机物石蜡为相变材料、膨胀石墨为支撑结构,利用膨胀石墨的多孔吸附特性,制备出了石蜡含量分别为50%(质量分数,下同),60%,70%和80%的石蜡/膨胀石墨复合相变储热材料.采用扫描电镜(SEM)和差示扫描量热分析(DSC)对复合相变储热材料的结构和热性能进行了表征.结果表明:膨胀石墨吸附石蜡后仍然保持了原来疏松多孔的蠕虫状形态,石蜡被膨胀石墨微孔所吸附;复合相变储热材料的相变温度与石蜡相似,其相变潜热与基于复合材料中石蜡含量的潜热计算值相当.储(放)热性能测试结果表明,含80%石蜡的复合相变储热材料其储热时间比石蜡减少69.7%,放热时间减少80.2%.  相似文献   

12.
以长沙市某一实际工程的双U型垂直埋管换热器为研究对象,利用TRNSYS建立了地埋管的仿真模型,通过仿真模型及正交试验设计方法研究夏季影响埋管周围土壤平均温度的因素,并分析了这些因素的影响程度.结果表明:钻井深度、钻井间距、钻井数量及回填材料导热系数对土壤平均温度有不同程度的影响,其中钻井间距的影响尤为明显.最佳钻井间距应为4~5m,回填材料最佳导热系数为1.7~2.1 W/(m·K),钻井最佳深度为60~100m.  相似文献   

13.
以聚乙烯醇(PVA)为基体,选用六方氮化硼纤维(BN fiber)作为导热填料,通过溶液共混的方法制备导热复合材料。结合X射线衍射仪(XRD)、扫描电子显微镜(SEM)以及导热测试结果,探究填料的微观形貌以及与基体的界面相容性对于提升复合材料导热性能的影响。结果表明:BN fiber对于提升复合材料的面内导热率有很好的效果,而且采用过氧化氢(H2O2)溶液进行表面改性,可以有效改善界面相容性;当经过1 400℃热处理再经过表面改性的BN fiber(BN fiber-1400-H2O2)的填充量为5%(质量分数)时,复合材料的面内导热率达到了1.32 W·m-1·K-1,为纯PVA体系的629%,相比于表面改性前提升了60%。  相似文献   

14.
Serving as the only defensive line between pathogens and human body, personal protective equipment (PPE) is increasingly attractive among researchers because of their strong antibacterial and temperature control abilities. However, efficient antibacterial properties and regenerative thermal control simultaneously remain unexplored in PPE. Here, one-dimensional halloysite nanotubes (HNTs) modified by acid etch method, are used to synthesis a multifunctional material of PEG/Cu2O@A-HNTs via in-situ reduction and physical adsorption which serves the above two purposes. PEG/Cu2O@A-HNTs showed rapid bacterial inactivation and achieved 96.3% bacteriostatic rate against E. coli in only 20 ?min. Meanwhile a broad and complete inactivation spectrum included both E. coli and S. aureus following a series of antibacterial mechanisms. Moreover, adsorption of 70 ?wt% PEG by acid etch HNTs is attributed to the nearly 3 times increased specific surface area compared with native HNTs. This enabled PEG/Cu2O@A-HNTs to attain a phase change enthalpy of 108.4 ?J/g. In addition, using PEG/Cu2O@A-HNTs as additives, antibacterial and phase change fiber (APCF) were melt-spun. Their efficiency factor against E. coli and S. aureus was above 99.99%, and retained a temperature control ability for 180s and 272s compared with PA6 fiber in hot and frigid environments respectively.  相似文献   

15.
石墨烯由于具有超高的导热性能,在热管理上有着广阔的应用前景。从修复结构缺陷出发,以氧化石墨烯为原料,有机小分子萘甲醇为修复剂,采用蒸发自组装法制备氧化石墨烯/萘甲醇(GO/NMT)复合薄膜,然后经过高温石墨化得到石墨化–石墨烯/萘甲醇(g-GO/NMT)薄膜。通过SEM、FT-IR、XRD、拉曼对制备的复合薄膜进行结构分析,并对其导热性能进行测试,当NMT的添加量为15%时,薄膜热导率达856.476 W/(m·K ),比石墨化–石墨烯(g-GO)薄膜的热导率提高了35%;通过对商用LED灯芯实际散热进行测试,g-GO膜的表面温度高达33.7 ℃,而g-GO/NMT复合膜的温度较低,仅为31.5 ℃。研究结果表明,g-GO/NMT复合膜具有更好的散热性能和更有效的热管理能力。  相似文献   

16.
The objective of this work is to obtain a multifunctional porous ceramic material at low cost with improved properties and that can be used in many applications like: thermal and acoustic insulation, refractory support and hot gas filtration elements. To that end, a novel facile strategy to fabricate porous ceramics by foaming and pore-forming agent methods using magnesia-aluminum spinel hollow spheres (MASHSs) was reported for the first time, in which calcium aluminate cement (CAC) served as high-temperature binder. The influence of temperature ranging from 1500 ?°C to 1700 ?°C on the thermal conductivity, porosity and mechanical strength were investigated. The results show that, the obtained MASHSs ceramic exhibits high porosity (67.2–71.9%) and thermal conductivity (0.18–0.38 ?W/mK), and compressive strength (6.1–17.1 ?MPa), which is mainly due to the change in crack directions and microstructure optimization with the prolong of firing temperature. The crack directions changed from the surface of MASHSs to the interior MASHSs, which consumes more crack energy, and thus leading to the excellent mechanical performance. What is more, the introduction of MASHSs makes it difficult to lose heat at elevated temperature, and thereby improving the thermal conductivity of materials.  相似文献   

17.
以正硅酸乙酯、乙醇等为原料,采用溶胶-凝胶反应和超临界干燥工艺制备了密度分别为30、80、120、260、320 kg/m3的纤维增强二氧化硅气凝胶复合材料,分别在常压、25℃下以及真空、-130~25℃的条件下测定了所制备的气凝胶复合材料的导热系数,研究了复合材料的密度及组成对于气凝胶材料隔热性能的影响规律。结果表明:在常压、25℃条件下,在不同密度的气凝胶复合材料中,密度为120 kg/m3的气凝胶复合材料的导热系数最小(0.013 W/(m·K));密度为30、80、120 kg/m3的气凝胶复合材料的导热系数随密度增大而减小;密度为120、260、320 kg/m3的气凝胶复合材料的导热系数随密度增大而增大。在真空、-130~25℃的条件下,密度为120 kg/m3的气凝胶复合材料的导热系数最小;密度为30、80、120 kg/m3的气凝胶复合材料的导热系数随密度增大而减小。在130℃时,由于密度为320 kg/m3的气凝胶复...  相似文献   

18.
为研制新型复合材料,将植物结构引入到金属基复合材料的制备中.该文以柳桉木材为模板,先将其转变为多孔碳,再通过铝合金和硅树脂的浸渍,制备了具有木材结构的Al/C、Al/(SiC+C)两种铝基复合材料,并通过扫面电镜、热膨胀仪和导热仪对复合材料的微观结构、热膨胀性能及导热性能进行了研究,建立了导热模型.结果发现该复合材料的结构由所选模板的结构决定,这与以往结构完全由人为控制的金属基复合材料不同;并且其热膨胀系数明显低于铝合金,导热系数(98.2和95.4 W·m~(-1)·K~(-1))远高于由木材转化的多孔碳(2.22 W·m~(-1)·K~(-1)).  相似文献   

19.
A low cost thermal insulating material can be produced by compounding an active xonotlite slurry, fired-perlite, HOMO PAN fibers and glass fibers. The maximum service temperature of the product is 800℃; linear shrinkage after 800℃×16 h firing is 0.9%; the cold crushing strength is 1.56 MPa; the flexural strength at ambient temperature is 0.81 MPa; the thermal conductivity at ambient temperature (25℃) is 0.056 and 0.128 W/(m·K) at 800℃. The production cost of such a composite is only 1/3 of that of the normal xonotlite thermal insulators. It can substitute the normal xonotlite thermal insulators on most occasions with a similar cost to that of normal perlite products.  相似文献   

20.
Phase change microcapsules(PCMs)are prepared with n-hexadecane and n-octadecane as core material,and melamine-formaldehyde resin is used as shell material by in-situ polymerization.Differential scanning calorimetry(DSC)was used to analyze the phase change properties.Thermal conductivity and maximum heat flux of cotton fabric finished with PCMs before and after being washed were also measured.It has been found that melting and crystal enthalpy of the PCMs decrease with decreasing the core/shell ratio,while q...  相似文献   

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