Microstructural evolutions of Cu(Ni)/AuSn/Ni joints during reflow

Interfacial reactions of the Ni/AuSn/Ni and Cu/AuSn/Ni joints are experimentally studied at 330℃for various reflow times.The microstructures and mechanical properties of the as-solidified solder joints are examined.The as-solidified solder matrix of Ni/AuSn/Ni presents a typical eutecticξ-(Au,Ni)_5Sn+δ-(Au,Ni)Sn lamellar microstructure after reflow at 330℃for 30 s.After reflow for 60 s,a thin and flat(Ni,Au)_3Sn_2 intermetallic compound(IMC) layer is formed,and some needle-like(Ni,Au)_3Sn_2 phases grow f...     

Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solder

The microstructural formation and properties of Sn-2.5Bi-xIn-1Zn-0.3Ag (in wt%) alloys and the evolution of soldered interfaces on a Cu substrate were investigated. Apart from the relatively low melting point (about 195℃), which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance the mechanical properties, and the embedded bulk intermetallic compounds (IMCs) (Cu₆Sn₅ and Cu₅Zn₈) and granular Bi particles improve the joint reliability. The addition of In reduces the solubility of Zn in the β-Sn matrix and strongly influences the separation and growth behaviors of the IMCs. The soldered interface of Sn-2.5Bi-xIn-1Zn-0.3Ag/Cu consists of Cu-Zn and Cu-Sn IMC layers.     

Optimization of mechanical properties of Sn-3.8Ag-0.7Cu alloys by the additions of Bi,In and Ti

Bi, In and Ti were added to Sn-3.8Ag-0.7Cu (SAC387) solder alloy to optimize the mechanical performance. The alloying effects of Bi, In and Ti on the microstructure, thermal and mechanical properties of SAC387 based solder alloys were investigated. The results demonstrate that adding 3.5 ?wt % of Bi could refine the microstructure, optimize the thermal properties, and improve the tensile strength. Meanwhile, the ductility of the solder alloys reduced evidently. Adding 2.8 ?wt % of In into SAC387–3.5 ?wt %Bi alloy could increase both the strength and ductility, which is attributed to the beneficial effect of In addition, as adding In could improve the solubility of Bi in the β-Sn matrix. Meanwhile, the melting point was reduced, and the wettability improved with the addition of In. Introducing amounts of Ti into SAC387–3.5 ?wt % Bi-2.8 ?wt % In alloy could further increase the strength. However, the ductility was significantly reduced when 0.8 ?wt % of Ti was added due to the formation of the coarse Ti₂Sn₃ phase. The undercooling was remarkably reduced with the addition of Ti. The nanoindentation tests demonstrate that the hardness increased mainly due to the hardening effect of the Bi addition. Among all the samples prepared, alloy SAC387–3.5 ?wt % Bi exhibited the highest creep resistance at the ambient temperature. Further adding In and Ti into SAC387–3.5 ?wt % Bi alloys reduced the creep resistance of the solder alloys. The mechanism associated with the different mechanical responses is also discussed in this study.     

Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate

The reactive wetting kinetics of a Sn-30Bi-0.5Cu Pb-free solder alloy on a Cu substrate was investigated by the sessile drop method from 493 to 623 K.The triple line frontier,characterized by the drop base radius R was recorded dynamically with a high resolution CCD using different spreading processes in an Ar-H 2 flow.We found a good agreement with the De Gennes model for the relationship between ln(dR/dt) and lnR for the spreading processes at 493 and 523 K.However,a significant deviation from the De Gennes model was found for the spreading processes at 548 and 623 K.Our experimental results show a complicated temperature effect on the spreading kinetics.Intermetallics at the Sn-30Bi-0.5Cu/Cu interface were identified as Cu 6 Sn 5 adjacent to the solder and Cu 3 Sn adjacent to the Cu substrate.The intermetallic compounds effectively enhanced the triple line mobility because of reaction product formation at the diffusion frontier.     

Characterization of Cu3P phase in Sn3.0Ag0.5Cu0.5P/Cu solder joints

This article reports the effects of phosphorus addition on the melting behavior, microstructure, and mechanical properties of Sn3.0Ag0.SCu solder. The melting behavior of the solder alloys was determined by differential scanning calorimetry. The interracial micro- structure and phase composition of solder/Cu joints were studied by scanning electron microscopy and energy dispersive spectrometry. Thermodynamics of Cu-P phase formation at the interface between Sn3.0Ag0.5Cu0.5P solder and the Cu substrate was characterized. The results indicate that P addition into Sn3.0Ag0.5Cu solder can change the microstructure and cause the appearance of rod-like CuaP phase which is distributed randomly in the solder bulk. The Sn3.0Ag0.5Cu0.5P joint shows a mixture of ductile and brittle fracture after shear test- ing. Meanwhile, the solidus temperature of Sn3.0Ag0.5Cu solder is slightly enhanced with P addition.     

温度与镀层对Sn0.7Cu焊料合金润湿性的影响

主要研究了真空状态下,焊接温度为530,560和590 K时,Sn-0.7Cu焊料合金在镀Cu、镀Ni、镀Ni/Ag和镀Ni/Au基板上的润湿性.结果表明:提高钎焊时的焊接温度,有助于降低液态Sn-0.7Cu焊料合金的表面张力,从而增大Sn-0.7Cu焊料合金在焊接基板上的润湿性.在相同的焊接条件下,Sn-0.7Cu焊料合金在镀Ni/Ag和镀Ni/Au基板上的润湿性比其在Cu和镀Ni基板上的润湿性好.     

快速凝固Al-Cu钎料钎焊铝Cu对钎缝组织的影响

研究了快速凝固钎料中Cu元素在铝合金基体中的扩散现象和机制.采用快速凝固的方法制备出了Al-Cu合金的薄带,用差热分析法(DTA)测量了钎料熔点.根据熔点利用真空钎焊用Al-Cu钎料焊接纯铝,然后使用扫描电镜和能谱分析仪分析了焊缝的显微组织,对Cu元素的扩散现象进行观察,并分析了Cu的扩散行为.实验结果表明,由于快冷钎料组织均匀,表面能高,因此熔点比普通钎料低,且熔化区间窄.随着钎焊温度的升高和保温时间的延长,Cu的扩散效果越来越好;在同一温度下钎焊时,快冷钎料中Cu的扩散能力明显强于普通钎料.     

Microstructural characterization of as-cast and homogenized 2D70 aluminum alloy

The microstructure of the as-cast 2D70 aluminum alloy and its evolution during homogenization were investigated by means of optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD), and differential scanning calorimetry (DSC) analysis. The results indicate that the microstructure of the as-cast 2D70 aluminum alloy mainly consists of the dendritic network of aluminum solid solution and intermetallic compounds (Al₂CuMg, Al₂Cu, Al₉FeNi, Cu₂FeAl₇, and Al₇Cu₄Ni). After conventional homogenization, Al/Al₂CuMg eutectic phases are dissolved into the matrix, and a small amount of high melting-point eutectic Al/Al₂Cu phases exist in the matrix, resulting in an increase in the starting melting temperature. Under double homogenization, the high melting point Al/Al₂Cu phases are dissolved, and no obvious change is observed for the size and morphology of Al₉FeNi, Cu₂FeAl₇, and Al₇CuaNi compounds.     

Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints

The growth rule of the interfacial intermetallic compound (IMC) and the degradation of shear strength of Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni (SACBN)/Cu solder joints were investigated in comparison with Sn-3.0Ag-0.5Cu (SAC305)/Cu solder joints aging at 373, 403, and 438 K. The results show that (Cu_1?x,Ni_x)₆Sn₅ phase forms between the SACBN solder and Cu substrate during soldering. The interfacial IMC thickens constantly with the aging time increasing, and the higher the aging temperature, the faster the IMC layer grows. Compared with the SAC305/Cu couple, the SACBN/Cu couple exhibits a lower layer growth coefficient. The activation energies of IMC growth for SACBN/Cu and SAC305/Cu couples are 111.70 and 82.35 kJ/mol, respectively. In general, the shear strength of aged solder joints declines continuously. However, SACBN/Cu solder joints exhibit a better shear strength than SAC305/Cu solder joints.     

Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate

Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as well as its dependence on time and temperature. It was found that the evolution of contact angle at the alloy’s melting point experienced four different stages. Especially, the contact angle was unstable and fluctuant in stage II, and gradually decreased in stage III mainly due to a chemical reaction between Sn-Ag-Cu alloy and Cu substrate. The contact angle decreased with increasing temperature, but increased slightly at 629 K, for another chemical reaction occurred. Interfacial characteristic has been further investigated by examining the sample’s cross section. Intermetallic compounds of Cu6Sn5 and β-Sn phase were found at the interface of Sn-Ag-Cu/Cu.     

SnBi/Cu焊接接头的剪切性能及界面微观组织分析

通过对断口形貌和界面微观组织的观察分析,研究了3种Sn-Bi/Cu焊接接头的剪切断裂机理.结果表明:3种Sn-Bi/Cu焊接接头均在弹性变形阶段断裂,并且均沿Sn-Bi焊料/Cu基板界面处断裂.孔洞降低了3种Sn-Bi/Cu焊接接头的有效连接面积,从而降低了其剪切强度.根据3种Sn-Bi/Cu焊接接头断口形貌,Sn59.9Bi40Cu 0.1/Cu和Sn57.9Bi40Zn2Cu 0.1/Cu焊接接头剪切断裂机制属于准解理、沿晶脆性断裂和韧窝的混合型断裂,而Sn42Bi58/Cu焊接接头剪切断裂机制属于准解理断裂.微观组织分析显示,3种焊料合金焊接接头界面处的金属间化合物层均为连续的Cu₆Sn₅相.     

BGA封装中含Bi,Ni的无铅焊球剪切强度研究

对Sn/3.5Ag/0.7Cu,Sn/3Ag/3Bi/0.5Cu和Sn/3Ag/3Bi/0.5Cu/0.1Ni三种BGA无铅焊球(0.76 mm)经不同热循环后,在FR-4基板上的剪切强度进行了测量.采用SEM和EDX对样品截面进行观察和元素分析.数据表明,Bi的掺入提高了焊料的润湿性及焊接强度,并减缓了IMC的生长速度;焊料中加入微量Ni可有效减小焊点下金属上Ni镀层的耗穿速度,抑制了焊球经热循环后焊接强度的下降.     

低熔点铝基钎料的性能

采用真空感应熔炼炉制备低熔点Al-Si-Cu-Zn-Sn多元合金钎料,以Cu为主要降低钎料熔点的元素,Zn和Sn作为既降低钎料的熔化温度,又提高钎料的润湿性和流动性的元素.通过对钎料的性能测试表明:该钎料液相线温度为528.8℃,可在560℃钎焊6063铝合金,钎焊接头剪切强度达到母材抗拉强度的80%,并且该钎料具有良好的润湿性和流动性,可以用于锻铝及部分硬铝合金的钎焊.     

微量Nd对Sn-9Zn钎料特性及焊点组织与性能的影响

研究Sn-9Zn中添加微量稀土元素Nd对合金显微组织和铺展性能的影响,对比分析Sn-9Zn-xNd(x=0,0.1,0.5)钎料/Cu焊点界面微观特征及力学性能。结果表明:微量Nd元素在Sn-9Zn合金中能够显著细化组织,但添加量为0.5%时合金中形成了"十字状"NdSn3金属间化合物(IMC)。钎焊温度较低或时间较短时,微量Nd添加能够改善Sn-9Zn合金在Cu基板上的铺展性能;但是在温度较高或时间较长的钎焊工艺条件下,由于Nd元素的严重氧化导致钎料铺展性能明显下降。在Sn-9Zn中添加0.1%Nd,在界面处形成了均匀细密分布的"毛绒状"共晶组织,能够提高焊点结合性能;Nd添加量为0.5%时,成分偏聚引起的组织不均匀导致焊点力学性能下降。     

Effect of TRT process on GFA, mechanical properties and microstructure of Zr-based bulk metallic glass

The effect of yttrium addition on the glass-forming ability(GFA) and mechanical properties of the Zr-based (Zr_(0.525)Al_(0.1)Ti_(0.05)Cu_(0.179)Ni_(0.146))_(100-x)Y_x and(Zr_(0.55)Al_(0.15)Ni_(0.1)Cu_(0.2))_(100-x)Y_x(x=0,0.2,0.4 0.6,1,2) alloys was studied.Micro-alloying of 0.6%yttrium enhances the room temperature ductility as well as the GFA of the Zr-based alloys.The mechanism of enhancing the GFA and room temperature ductility was analyzed.It is indicated that proper yttrium addition stabilizes the...     

A novel investigation on the influence of Cu–P modifier on the microstructure,mechanical performance,and melting process of Al–50Si alloys treated by overheating

As an efficient modifier, phosphorus(P) can significantly reduce the size of primary silicon(Si) crystals. However,modifier can aggregate when the P content exceeds a certain proportion, which decreases refining efficiency. In this study, the evolution of microstructures and mechanical properties of Al–50 Si alloy have been studied by combining superheating and modification treatments. After modification, the mean size of the primary Si phase increased with superheating temperature, while the ha...     

Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloy

This article explores the effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was used to characterize the wettability of Sn-9Zn-xP solder alloys to Cu substrates. The oxidation and corrosion behaviors of Sn-9Zn-xP solder alloys were determined by means of weight gaining, and secondary ion mass spectrometry was used to analyze the oxygen content. The role and mechanism of P in the solder alloys were also discussed. It is found that the addition of P can significantly improve the wettability of the solder alloys. Incorporating P into Sn-9Zn solder alloy obviously decreases the oxygen content and enhances the oxidation and corrosion resistance. Microstructure observations show that an appropriate amount of P can greatly refine coarse rod-like Zn-rich phases in Sn-9Zn solder alloy.     

Sn-Bi系低温无Pb焊料的研究现状及发展趋势

低熔点Sn-Bi焊料是比较有发展潜力的低温无Pb焊料.根据Sn-Bi焊料的特性及其应用存在的问题,结合近几年国内外对Sn-Bi系低温无Pb焊料的最新研究成果,综述了Sn-Bi无Pb焊料的温度诱导熔体结构转变现象及其对Sn-Bi焊料凝固组织的影响,介绍了合金元素及稀土元素的添加对Sn-Bi焊料润湿性能的影响及其影响机制,并分类总结了不同元素对Sn-Bi焊料与Cu基体界面化合物生长的促进与抑制作用及其原理,最后综合评述Sn-Bi低温无Pb焊料存在的问题,对Sn-Bi焊料的发展趋势进行了展望.     

Microstructure evolution and reaction behavior of Cu–Ni alloy and B_4C powder system

Microstructure evolution and reaction behavior of Cu–Ni alloy and B_4C power system was studied by in-situ and static experimental investigations along with theoretical calculations. The reaction process was as follows. Firstly,B_4C decomposed into B and C atoms, and then B atoms diffused into Cu–Ni matrix, leading to the formation of Ni_2B particles. Subsequently, Ni atoms diffused into B_4C, forming a loose mixture of Ni_2B and amorphous C at the initial powder boundary. Finally, with the completion of reaction, Ni_2B particles at the powder boundary grew into a monolithic block, and then C substance was excluded out and accumulated at the edge of this monolithic Ni_2B block. It is believed that the formation of Ni_2B phase is caused by the most negative change of Gibbs free energy among all the potential reactions between Ni–B and Ni–B_4C systems.     

Al/Ti对Cu-10Ni合金耐冲刷腐蚀性能的影响

研究微合金化对Cu-10Ni合金耐3.5%NaCl溶液冲刷腐蚀的影响。使用中频真空熔炼炉熔炼Cu-10Ni-1Fe-1Mn-X（X=0.2Al或0.2Ti）合金,使用相同的热处理及冷变形工艺制备样品后与Cu-10Ni合金一起进行冲刷腐蚀实验。通过扫描电子显微镜（scanning electron microscope,SEM）、X射线衍射仪（X-ray diffractometer,XRD）、电化学腐蚀、电化学阻抗谱（electrochemical impedance spectroscopy,EIS）、X射线光电子能谱仪（X-ray photoelectron spectrometer,XPS）、质量损失测试等对样品进行分析表征。结果表明：加入0.2Al/0.2Ti后的Cu-10Ni合金的耐冲刷腐蚀能力得到提高。这是由于在Cu-10Ni-0.2Al合金及Cu-10Ni-0.2Ti合金表面耐腐蚀膜中分别含有Al₂O₃、TiO₂,提高了样品的耐冲刷腐蚀能力;Cu-10Ni-0.2Ti合金耐冲刷腐蚀能力略强于Cu-10Ni-0.2Al合金的,这是因为Cu-10Ni-0.2Al合金在Cl^?富集的环境中易吸收Cl^?,从而导致膜层有一定的裂纹。