Peritectic solidification under high undercooling conditions

The solidification characteristics of highly undercooled Cu-7.77%Co peritectic alloy has been examined by glass fluxing technique. The obtained undercoolings vary from 93 to 203 K(0.14 TL). It is found that the α(Co) phase always nucleates and grows preferentially, which is followed by peritectic transformation. This means that the peritectic phase cannot form directly, even though the alloy melt is undercooled to a temperature far below its peritectic point. The maximum recalescence temperature measured experimentally decreases as undercooling increases , which is lower than the thermodynamic calculation result owing to the actual non-adia-batic nature of recalescence process. The dendritic fragmentation of primary α(Co) phase induced by high undercooling is found to enhance the completion of peritectic transformation. In addition, the LKT/BCT dendrite growth model is modified in order to make it applicable to those binary alloy systems with seriously curved liquidus and solidus lines. The dendrite growth velocities of primary α(Co) phase are subsequently calculated as a function of undercooling on the basis of this model.     

Rapid dendrite growth in quaternary Ni-based alloys

Dendritic growth is one of the most common micro-structural formation mechanisms during crystal growth. Its morphology provides the kinetics information of crystal growth. Therefore, it is valuable to perform the research on rapid dendrite growth in order…     

High undercooling and rapid dendritic growth of Cu-Sb alloy in drop tube

Droplets of Cu-20%Sb hypoeutectic alloy has been rapidly solidified in drop tube within the containerless condition. With the decrease of droplet diameter, undercooling increases and the microstructures of primary copper dendrite refines. Undercooling up to 207 K (0.17 T _L) is obtained in experiment. Theoretic analysis indicated that because of the broad temperature range of solidification, the rapid growth of primary copper dendrite is controlled by the solutal diffusion. Judging from the calculation of T₀ curve in the phase diagram, it is shown that the critical undercooling of segregationless solidification is δT ₀ = 474 K. At the maximum undercooling of 207 K, the growth velocity of primary copper phase exceeds to 37 mm/s, and the distinct solute trapping occurs.     

Primary dendrite growth of Ni<Subscript>3</Subscript>Sn intermetallic compound during rapid solidification of undercooled Ni-Sn-Ge alloy

Liquid Ni-31.7%Sn-2.5%Ge alloy was highly undercooled by up to 238 K(0.17TL) with glass fluxing and drop tube techniques.The dendritic growth velocity of primary Ni3Sn compound shows a power-law relation to undercooling and achieves a maximum velocity of 380 mm/s.The addition of Ge reduces its growth velocity as compared with the binary Ni75Sn25 alloy.A structural transition from coarse dendrites into equiaxed grains occurs once undercooling exceeds a critical value of about 125 K,which is accompanied by both grain refinement and solute trapping.The Ni3Sn intermetallic compound behaves like a normal solid solution phase showing nonfaceted growth during rapid solidification.     

Rapid growth of primary dendrite in highly undercooled copper-antimany alloy

The droplets of Cu-11wt.%Sb hypoeutectic alloy have been rapidly solidified during containerless processing in a 3 m drop tube. The undercooling and cooling rates are estimated, and both play a dominant role in the dendritic growth of primary Cu phase. Undercoolings up to 200 K (0.16TL, where TL is the liquidus temperature) have been obtained in the experiment. With the increase of undercooling, the microstructural evolution of primary Cu phase proceeds from remelted dendrites to the equiaxed grains. A coarse dendritic grain microstructure can form in the undercooling range of 61～102 K and at cooling rates of 1.35×102～2.66×103 K/s. The segregationless solidification of Cu-11wt.%Sb hypoeutectic alloy occurs when undercooling is more than 176 K. The growth of primary Cu phase is mainly controlled by solute diffusion.     

Formation of ζ phase in Cu-Ge peritectic alloys

Rapid growth behavior of ζ phase has been investigated in the undercooling experiments of Cu-14%Ge, Cu-15%Ge, Cu-18.5%Ge and Cu-22%Ge alloys. Alloys of the four compositions obtain the maximum undercoolings of 202 K（0.17TL）, 245 K（0.20TL）, 223 K（0.20TL） and 176 K（0.17TL）, respectively. As the content of Ge increases, the microstructural transition of ＂a（Cu） dendrite ＋ ζ＂ peritectic phase → ζ＂ peritectic phase →, ζ dendrite ＋ （ε＋ζ） eutectic＂ takes place in the alloy at small undercooling, while the microstructural transition of ＂fragmented α （Cu）dendrite ＋ ζ peritectic phase →, ζ peritectic phase →ζ dendrite ＋ ε phase＂ happens in the alloy at large undercooling. EDS analysis of the Ge content in peritectic phase indicates that undercooling enlarges the solid solubility of ζ rdendrite, which leads to a decrease in the Ge content in ζ phase as undercooling increases. In the Cu-18.5%Ge alloy composed of ζ peritectic phase, the Ge content in ζ phase increases when undercooling increases, which is due to the restraint of the Ge enrichment on the grain boundaries by high undercooling effect.     

Microstructural characteristics and electrical resistivity of rapidly solidified Co-Sn alloys

The rapid solidification behavior of Co-Sn alloys was investigated by melt spinning method.The growth morphology of αCo phase in Co-20% Sn hypoeutectic alloy changes senistively with cooling rate.A layer of columnar αCo dendrite forms near the roller side at low colling rates.This region becomes small and disappears as the cooling rate increases and a kind of very fine homogeneous microstructure characterized by the distribution of equiaxed αCo dendrites in γCo3Sn matrix is subsequently produced.For Co-34.2% Sn eutectic alloy,anomalous eutectic forms within the whole range of cooling rates.The increase of cooling rate has two obvious effects on both alloys:one is the microstructure refinement,and the other is that it produces more crystal defects to intensify the seattering of free electrons,leading to a remarkable increase of electrical resistivity,Under the condition that the grain boundary reflection coefficient γ approaches 1,the resistivity of rapidly solidified Co-Sn alloys can be predicted theoretically.     

强磁场下Sn-3Ag-0.5Cu/Cu界面金属间化合物生长行为

研究了3T和8T强磁场作用下Sn-3Ag-0．5Cu／Cu焊接接头界面金属问化合物在170℃时效过程中的生长行为．结果表明：强磁场作用下界面金属问化合物层的厚度随着时效时间的延长而增加,且呈抛物线规律;随着磁场强度的增大,Sn-3Ag-0．5Cu／Cu界面金属闸化合物的生长速度加快．分析认为强磁场的存在加快了原子的运动,提高了原子的扩散系数,从而加快了界面金属间化合物层的生长速度．     

微量元素对CuZnAl形状记忆合金晶粒细化和晶粒生长的影响

研究了添加 Ｚｒ，Ｔｉ，Ｂ和 Ｆｅ元素，对 ＣｕＡｎＡｌ形状记忆合金晶粒细化和 晶粒生长的影响；探讨了合金晶粒细化与晶粒生长的机制。试验结果表明：合 金中添加Ｚｒ，Ｔｉ，Ｂ，Ｆｅ元素，晶粒得到显著细化，晶粒生长受到抑制；晶粒 生长受到抑制最大的添加元素为 Ｚｒ，其余顺序为 Ｂ，Ｔｉ，Ｆｅ；添加 Ｚｒ，Ｔｉ的 合金，在９００℃上发生异常晶粒长大现象，这是由于晶界结构的变化，固溶 Ｚｒ，Ｔｉ原子对晶界的作用在高温时削弱及第二相粒子的溶解。添加 Ｂ的合 金，当ＣＢ＜０．０１（ｗｔ％）时，晶粒尺寸随含Ｂ量增多急剧减小；当ｃＢ＞０．０１ （Ｗｔ％）时，晶粒尺寸变化不大，该合金晶粒细化主要是固溶于基体中的硼的 作用。     

Microstructure simulation of rapidly solidified ASP30 high-speed steel particles by gas atomization

In this study, the microstructure evolution of rapidly solidified ASP30 high-speed steel particles was predicted using a simulation method based on the cellular automaton-finite element (CAFE) model. The dendritic growth kinetics, in view of the characteristics of ASP30 steel, were calculated and combined with macro heat transfer calculations by user-defined functions (UDFs) to simulate the microstructure of gas-atomized particles. The relationship among particle diameter, undercooling, and the convection heat transfer coefficient was also investigated to provide cooling conditions for simulations. The simulated results indicated that a columnar grain microstructure was observed in small particles, whereas an equiaxed microstructure was observed in large particles. In addition, the morphologies and microstructures of gas-atomized ASP30 steel particles were also investigated experimentally using scanning electron microscopy (SEM). The experimental results showed that four major types of microstructures were formed: dendritic, equiaxed, mixed, and multi-droplet microstructures. The simulated results and the available experimental data are in good agreement.     

马氏体时效钢激冷粉末的时效性

利用SEM技术,观察马氏体时效钢冷冷粉末经480℃、3h时效后的表面,发现有大量的白点相,主要分布于结晶组织的晶臂间,经能谱和波谱分析,鉴别其为Ti的化合物。显微硬度的分析表明,激冷粉末的时效硬度远远高于固溶淬火后的时效硬度,并有可能利用激冷组织的特征来提高马氏体时效钢的性能,并调整其成分。     

Rapid solidification of acoustically levitated Al-Cu-Si eutectic alloy under laser irradiation

Al-27%Cu-5.3%Si ternary eutectic alloy was melted using a YAG laser and then solidified while being acoustically levitated. A maximum undercooling to 195 K (0.24 TL) was achieved with a cooling rate of 76 K/s. The solidification microstructure was composed of (Al+θ+Si) ternary eutectics and (Al+θ) pseudobinary eutectics. During acoustic levitation, the (Al+θ+Si) ternary eutectics are refined and the (Al+θ) pseudobinary eutectics have morphological diversity. On the surface of the alloys, surface oscillations and acoustic streaming promote the nucleation of the three eutectic phases and expedite the cooling process. This results in the refinement of the ternary eutectic microstructure. During experiments, the reflector decreases with increasing alloy temperature, and the levitation distance always exceeds the resonant distance. Because of the acoustic radiation pressure, the melted alloy was flattened, and deformation increases with increasing sound pressure. The maximum aspect ratio achieved was 6.64, corresponding to a sound pressure of 1.8×104 Pa.     

945钢组织遗传现象探讨

通过热处理实验，探讨了945钢组织遗传倾向，试验结果表明，945钢晶粒长大倾向较小，为本质细晶粒钢。     

Mg对Zn--11%Al合金镀层凝固组织及合金层生长的影响

将工业纯铁分别在510℃的Zn-11%Al、Zn-11%Al-1.5%Mg、Zn-11%Al-3%Mg和Zn-11%Al-4.5%Mg合金熔池中进行不同时间的热浸镀,使用X射线衍射仪、扫描电子显微镜、能谱仪等仪器设备,研究Mg含量对Zn-11%Al合金镀层凝固组织和镀层中Fe-Al合金层生长的影响.结果表明：Zn-11%Al合金镀层凝固组织由富Al相和Zn/Al二元共晶组成;随着Zn-11%Al-x%Mg合金中Mg含量的增加,合金镀层的凝固组织中逐渐出现Zn/Al/MgZn2三元共晶、块状 MgZn2相和Al/MgZn2二元共晶.四种合金镀层中合金层主要由Fe2 Al5 Znx和FeAl3 Znx相组成,合金层的厚度随浸镀时间的增加而增加,Mg含量的增加使Fe-Al合金层生长速率指数和生长速率降低.在Zn-11%Al合金镀层中Fe-Al合金层形成的初期,可形成致密稳定的Fe-Al化合物层;热浸镀120 s后,扩散通道的移动使Fe-Al化合物层失稳破裂. Zn-11%Al-x%Mg合金中Mg元素可明显推迟液Zn进入镀层中Fe-Al合金层的时间,使Fe-Al合金层更加稳定和致密.     

负温度梯度熔体中晶体生长取向与控制

研究了 6 3～ 2 92K热力学过冷度范围内 ,Cu Ni单相合金的凝固组织演化规律 ,分析了负温度梯度熔体中晶体定向生长的过冷度条件以及晶体生长取向机制与控制方法 .结果表明 :(1)在临界过冷度ΔT (≈ 10 6K)附近 ,晶粒细化过程受溶质扩散控制 ,在临界过冷度ΔT (≈ 2 0 0K)附近 ,晶粒细化过程受热扩散控制 ;(2 )在 6 3～ΔT K范围内 ,晶体的生长方向是 [10 0 ],在 12 7～ΔT K范围内 ,晶体的生长方向可以是 [10 0 ],也可以是 [111].     

枝晶生长的介观尺度三维数值模拟

为预测合金介观组织的形成与演变,提出了改进的三维元胞自动机(CA)模型。该模型采用枝晶形状函数,简化描述介观区域的枝晶生长轮廓;利用基于Euler角的空间坐标转换,描述随机晶向的多晶粒生长;采用Hash表加速算法,耦合了溶质场计算,采用数值算法处理固液界面的溶质再分配。该模型可模拟大范围随机取向的多晶粒生长过程,并具有较高的计算效率。模拟结果表明:不同模拟区域和网格剖分尺寸对晶粒体积的分布规律没有明显影响;较快冷却速度下,存在溶质富集和枝晶偏析。对Al4Cu合金的砂型和金属型试样的显微组织分别进行模拟,结果与实验符合较好。     

球磨中B_2型FeAl的嵌镶碎化和长程有序度

研究了Ｂ２型金属间化合物 ＦｅＡｌ在机械球磨过程中的嵌镶碎块尺寸与长程有序度之间的关系。发现随球磨时间的增长，嵌镶碎块尺寸和长程有序度同时减小。由于嵌镶碎化主要由位错亚晶粒造成，应用Ｃｏｔｔｒｅｌｌ气团模型可建立嵌镶碎块尺寸与长程有序度之间的关系式。所得的这个关系式表明，长程有序度的降低主要是由位错与点阵原子的相互作用引起的。     

快速凝固AlFeVSiNd纳米合金薄带时效过程

采用透射电镜和X射线衍射谱研究了快凝AlFeVSiNd弥散纳米晶合金薄带在时效处理过程中微结构变化,结果表明:快凝AlFeVSiNd纳米晶合金微结构随热处理温度而变化,先是出现元素偏聚现象,而后,Al8Fe4Nd相开始溶解,同时αAl13(Fe,V)3Si相开始析出·测量了时效处理前后样品的力学性能,出现类似传统铝合金时效硬化的现象·     

淤泥质泥土的快速固化试验研究

为了解决南京地区路基加固和工程抢险中淤泥质泥土带来的难题,采用正交试验原理,通过三因素三水平的无侧限抗压试验和三轴抗压试验,得到一种针对南京地区淤泥质泥土的水泥、固化剂、石灰、三乙醇胺的综合快速固化剂,及其固化土的强度发展模型和无侧限抗压应力应变经验关系.试验结果表明,采用此种快速固化剂可以有效提高淤泥质泥土早期抗压强度、抗剪切破坏能力.     

异常晶粒长大的Monte Carlo模拟方法

采用Radhakrishnan等改进后的Monte Carlo方法,模拟了两种能量结构下的异常晶粒长大过程.研究结果发现,在相同参数下用改进算法模拟异常晶粒长大比Srolovitz和Grest等人的模拟所得到的效率高,而且结果比后者与实际符合得更好.在两种能量结构下,异常晶粒长大的趋势相同,随着J1/J2值的增大,晶粒长大指数有所增加,异常晶粒的体积百分比曲线都出现平台阶段.在相同参数下,第二种能量结构的异常晶粒长大的速率比较快.