高能球磨对TiFe合金电极放电性能的影响

研究了球磨对TiFe合金电极放电性能的影响.结果表明,对采用电弧熔炼制备的TiFe合金进行短时间球磨处理可以明显改善其活化性能;采用球磨方法制备的TiFe合金因含有部分TiFe金属间化合物的固溶体,其放电容量高于电弧熔炼制备并经过球磨处理的TiFe晶态合金.     

镁橄榄石合成反应动力学研究

以分析纯氧化镁、高纯熔融石英以及电熔镁砂颗粒为原料,研究了固相法合成镁橄榄石的反应动力学.利用X射线衍射和扫描电子显微镜等手段,研究了合成温度和保温时间对镁橄榄石生成速率的影响,分析了MgO与SiO2的反应机理.根据实验结果,建立了1100~1300℃下MgO与SiO2反应的动力学方程,并求出了表观反应活化能.研究结果表明,随着合成温度的提高和保温时间的延长,镁橄榄石生成率逐渐增加.在反应初期,MgO与SiO2反应生成了镁橄榄石和顽火辉石,在合成反应中后期时Mg2+通过产物层扩散而进一步反应,MgO与SiO2反应合成镁橄榄石的反应过程由Mg2+扩散所控制,反应的表观活化能为(220±20)kJ/mol.     

钎焊接头金属间化合物层形貌对扩散浓度和应力的影响

结合实验结果,建立了芯片封装技术中焊点金属间化合物(IMC)界面模型,采用有限元方法计算了模型中Sn钎料与Cu焊盘形成IMC层时Cu原子的扩散过程以及扩散应力大小与分布.结果表明:IMC层与钎料的界面形貌可显著影响Cu原子扩散浓度及应力行为.凹凸界面形貌会严重阻碍Cu原子的扩散,且靠近界面影响更为显著;扇贝形界面模型比...     

Decarburization rate of RH refining for ultra low carbon steel

The decarburization behaviors of ultra low carbon steel in a 210-t RH vacuum degasser were investigated under practical operating conditions. According to the apparent decarburization rate constant (K_C) calculated by the carbon content in the samples taken from the hot melt in a ladle at an interval of 1–2 min, it is observed that the total decarburization reaction period in RH can be divided into the quick decarburization period and the stagnant decarburization period, which is quite different from the traditional one with three stages. In this study, the average apparent decarburization rate constant during the quick decarburization period is 0.306 min-1, and that of the stagnant period is 0.072 min-1. Increasing the initial carbon content and enhancing the exhausting capacity can increase the apparent decarburization rate constant in the quick decarburization period. The decarburization reaction comes into the stagnant decarburization period when the carbon content in molten steel is less than 14×10-6 after 10 min of decarburization.     

Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints

The growth rule of the interfacial intermetallic compound (IMC) and the degradation of shear strength of Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni (SACBN)/Cu solder joints were investigated in comparison with Sn-3.0Ag-0.5Cu (SAC305)/Cu solder joints aging at 373, 403, and 438 K. The results show that (Cu_1?x,Ni_x)₆Sn₅ phase forms between the SACBN solder and Cu substrate during soldering. The interfacial IMC thickens constantly with the aging time increasing, and the higher the aging temperature, the faster the IMC layer grows. Compared with the SAC305/Cu couple, the SACBN/Cu couple exhibits a lower layer growth coefficient. The activation energies of IMC growth for SACBN/Cu and SAC305/Cu couples are 111.70 and 82.35 kJ/mol, respectively. In general, the shear strength of aged solder joints declines continuously. However, SACBN/Cu solder joints exhibit a better shear strength than SAC305/Cu solder joints.     

Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints

Composite solders were prepared by mechanically dispersing different volumes of nano-sized Ag particles into the Sn-0.7Cu eutectic solder. The effects of Ag particle addition on the microstructure of Sn-0.7Cu solder joints were investigated. Besides, the effects of isothermal aging on the microstructural evolution in the interfacial intermetallic compound (IMC) layer of the Sn-0.7Cu solder and the composite solder reinforced with 1vol% Ag particles were analyzed, respectively. Experimental results indicate that the growth rate of the interfacial IMC layer in the Ag particles reinforced composite solder joint is much lower than that in the Sn-0.7Cu solder joint during isothermal aging. The Ag particles reinforced composite solder joint exhibits much lower layer-growth coefficient for the growth of the IMC layer than the corresponding solder joint.     

SnAg及SnAgCu无铅焊料接头中金属间化合物在时效中的演变

对SnAg共晶合金及SnAgCu共晶合金无铅焊料与Cu或Ni／Cu或Au／Ni／Cu衬底经钎焊方法焊接后,在焊接界面和焊料内部形成的金属间化合物(IMC)的类型、形貌和分布形式,以及焊接接头在随后时效过程中IMC的类型、成分和形貌的演变规律进行综述。分析结果表明,在钎焊过程中,IMC的类型与焊料成分有关,与衬底金属在焊料合金中的溶解度及扩散速度有关;IMC的形貌与加热温度、冷却速度及焊接界面的温度梯度有关;IMC的分布与焊料成分及接头中金属元素的扩散能力有关;焊料接头的断裂机理与接头合金成分、时效温度、时效时间、载荷方式有关;在时效过程中,焊料共晶组织粗化,焊料强度下降,断裂会在焊料内部发生;当IMC厚度增大到临界尺寸时,应力集中严重,多层IMC形成,空穴形成及长大,在IMC界面层断裂;若两者强度接近,则断裂部分发生在焊料,部分发生在界面IMC处。     

Kinetic study on the direct nitridation of silicon powders diluted with α-Si3N4 at normal pressure

Silicon nitride (Si₃N₄) powders were prepared by the direct nitridation of silicon powders diluted with α-Si₃N₄ at normal pressure. Silicon powders of 2.2 μm in average diameter were used as the raw materials. The nitriding temperature was from 1623 to 1823 K, and the reaction time ranged from 0 to 20 min. The phase compositions and morphologies of the products were analyzed by X-ray diffraction and scanning electron microscopy, respectively. The effects of nitriding temperature and reaction time on the conversion rate of silicon were determined. Based on the shrinking core model as well as the relationship between the conversion rate of silicon and the reaction time at different temperatures, a simple model was derived to describe the reaction between silicon and nitrogen. The model revealed an asymptotic exponential trend of the silicon conversion rate with time. Three kinetic parameters of silicon nitridation at atmospheric pressure were calculated, including the pre-exponential factor (2.27 cm·s^?1) in the Arrhenius equation, activation energy (114 kJ·mol^?1), and effective diffusion coefficient (6.2×10^?8 cm²·s^?1). A formula was also derived to calculate the reaction rate constant.     

铜／钢液固相复合界面冶金行为的研究

以液固相复合法生产的铜包钢线为研究对象,利用光学显微镜和扫描电镜的能谱等手段分析了铜／钢界面区的组织形态和成分组成。结果表明：在界面区发生了互扩散,形成了Fe、Cu固溶体,无脆性的金属间化合物产生,这使得该复合材料具有较好的微观结合力。     

硫酸钛催化酯化反应动力学研究

根据硫酸钛催化合成乙酸正丁酯反应的特点导出非等温变体积条件下的反应速率方程,并导出用于计算动力学参数的理论公式。在此基础上对不同实验条件下的多组实验数据进行动力学处理,结果表明该反应服从二级反应动力学模型,表观活化能为１９７．９４ｋＪ·ｍｏｌ－１,指前因子为４．２６５１×１０２５ｄｍ３·ｍｏｌ－１·ｍｉｎ－１．     

淀粉水热还原铬酸钠过程动力学研究

为避免传统氧化铬工艺所产生的含铬副产物对环境的污染,本文提出了用淀粉水热还原铬酸钠生产氧化铬的新工艺。在对水热还原过程的反应规律及反应机理进行分析的基础上,对淀粉水热还原铬酸钠过程的动力学进行了研究,调查了影响六价铬还原转化率的因素。结果表明,反应温度、反应物浓度和反应时间是主要因素。选择等温、恒容、不可逆反应动力学模型来描述其反应过程,其动力学方程为：r=-d［Cr(Ⅵ)］/dt=1.367×10¹³e^{-100.566×1000/RT}［Cr(Ⅵ)］［St］,即指前因子、表观活化能和总反应级数分别为1.367×10¹³L/(mol·h)、100.566kJ/mol和二级或拟二级。该反应属化学反应控制,对Cr（Ⅵ）和淀粉均表现为一级或拟一级。     

SnAgNi钎料钎焊Ni镀层SiCp/Al复合材料的接头微观结构及剪切性能

采用Sn-2·5Ag-2·0Ni焊料钎焊了具有Ni(P)/Ni(B)和Ni(P)/Ni两种双镀层结构的SiCp/Al复合材料.结果表明,SnAgNi/Ni(B)/Ni(P)和SnAgNi/Ni/Ni(P)两种接头均生成唯一的金属间化合物Ni3Sn4.SnAgNi焊料与Ni(B)镀层之间的快速反应速度使Ni3Sn4金属间化合物具有高的生长速度.时效初期的SnAgNi/Ni/Ni(P)接头的剪切强度高于SnAgNi/Ni(B)/Ni(P)接头,但在250h时效后其剪切强度剧烈下降,低于SnAgNi/Ni(B)/Ni(P)接头.金属间化合物的生长及裂纹的形成是SnAgNi/Ni/Ni(P)接头失效的主要原因,而SnAgNi/Ni(B)/Ni(P)接头失效的主要原因是Ni(P)镀层中Ni原子的定向扩散使SiCp/Al复合材料与Ni(P)处产生孔洞.     

重铬酸钠电催化合成中阳极液在电极上的电化学研究

报道了一种电催化合成重铬酸纳的绿色新技术.用循环伏安法研究了电催化合成过程阳极液铬酸钠溶液在电极上的电化学性能.确定了不同温度下电荷传递系数、扩散系数、电极反应速率常数,初步讨论了温度的影响.求得了电极反应活化能.表明了该电极具有很稳定的电化学性能,电极反应是主要受扩散控制的不可逆反应.     

Synthesis of meso-tetra-(2-chloro-4-sulfophenyl) prophyrin and spectrophotometric determination of trace amounts of cadmium

Synthesis of a new high sensitive water soluble chromogenic reagent meso-tetra-(2-chloro-4-sulfophenyl) prophyrin and the conditions for the reaction of this reagent with cadmium (I) were studied. The apparent molar absorption coefficient at 434 nm is 5.20×10⁵ L·mol⁻¹·cm⁻¹. The method has been applied to the determination of 5.0×10⁻⁹ (content by weight) Cadmium (I) in honey. Supported by the National Natural Science Foundatyion of China Xiao Ling: born in Oct. 1962, Ph.D gradute student     

Microstructural evolutions of Cu(Ni)/AuSn/Ni joints during reflow

Interfacial reactions of the Ni/AuSn/Ni and Cu/AuSn/Ni joints are experimentally studied at 330℃for various reflow times.The microstructures and mechanical properties of the as-solidified solder joints are examined.The as-solidified solder matrix of Ni/AuSn/Ni presents a typical eutecticξ-(Au,Ni)_5Sn+δ-(Au,Ni)Sn lamellar microstructure after reflow at 330℃for 30 s.After reflow for 60 s,a thin and flat(Ni,Au)_3Sn_2 intermetallic compound(IMC) layer is formed,and some needle-like(Ni,Au)_3Sn_2 phases grow f...     

Experimental and theoretical investigation of zinc diffusion in N-GaSb

Zinc diffusion process in N-GaSb was studied with excessive, appropriate and insufficient quantity of diffusion source (zinc pellets). Kink-and-tail type zinc concentration profiles obtained with appropriate zinc pellets quantity were successfully simulated using the assumption that the vacancy mechanism mediated by V⁰_Ga and kick-out mechanism mediated by I⁺_Ga take effect at the same time. It is found out that for diffusion temperature from 460°C to 500°C, the zinc surface concentration of the diffused samples has nearly no change and the logarithmic value of the zinc surface diffusion coefficient is linear with the reciprocal value of diffusion temperature; when the diffusion temperature is constant, both the zinc surface concentration and diffusion coefficient do not change with diffusion time.     

Mechanism and kinetics for scavenging superoxide anion by progesterone

The chemical reaction of progesterone with superoxide anion O^.-₂ in 0.1 mol/L NaHCO₃ medium is studied by polarography. Differing from the indirect inhibition of O^.-₂ generation by synthesized glucocorticoids in mechanism, the function that progesterone scavenges O^.-₂ is ascribed to that O^.-₂ directly oxidizes the C == C double bond conjugated with the carbonyl moiety of progesterone molecule to a free radical, and then is reduced to H₂O₂. The result obtained in this work gives new evidence for biomedical research. The equation of rate constant of the oxidization reaction is deduced, and the apparent rate constant obtained is 308 L·mol^-1·s^-1.     

碳包埋固相法制备LiFePO4及其电化学性能研究

用石墨粉包埋取代保护性气氛,一步固相法制备LiFePO4.采用XRD,FTIR,SEM和恒电流充放电等方法对材料结构、形貌和电化学性能进行了表征.利用循环伏安法研究了Li+在LiFePO4中的嵌/脱过程.结果表明,这种改进的固相法可以合成亚微米级纯相橄榄石结构LiFePO4,所得材料具有良好的倍率性能和循环稳定性,在0.1C和1C倍率首次放电比容量分别为148.3和131.9mAh.g-1,1C和5C倍率下循环50次容量保持率分别为96%和90%.由循环伏安法计算得到阳极峰和阴极峰处Li+的表观扩散系数分别为1.64×10-13和1.94×10-13cm2.s-1.     

Sn-Zn-Cu/Cu界面反应及剪切强度

为探讨Cu的加入对Sn-Zn钎料性能的影响,研究了Sn-Zn-xCu与Cu箔钎焊界面处金属间化合物(IM C)成分、形貌及剪切强度.试验结果表明,含0~1%Cu时,Sn-Zn-xCu钎料与Cu母材钎焊界面处IM C主要为层状Cu5Zn8相;在含2%~6%Cu时,为Cu6Sn5相和Cu5Zn8相共同组成;在含8%Cu时,为Cu6Sn5相.这是由于合金基体中生成的Cu-Zn化合物阻碍了Zn向Cu界面处扩散,进而使得界面处IM C由层状Cu5Zn8逐渐向扇贝状Cu6Sn5转变.另外,随着Sn-Zn钎料中Cu含量的增加,Sn-Zn-xCu/Cu接头剪切强度因界面IM C类型的变化以及钎料合金自身强度的提高而使得钎焊接头剪切强度明显提高.     

锂离子在LiVOPO4中的扩散系数的测定

采用简单的恒电流法测定了锂离子在LiVOPO₄中的扩散系数.结果表明,充、放电过程中锂离子在LiVOPO₄电极中的扩散系数分别为4.78×10^-11和3.27×10^-11 cm²/s.