硅片不同表面钝化工艺的稳定性研究

研究分析了热氧化钝化,用PECVD双面沉积SiNx:H膜钝化以及碘酒钝化三种表面钝化工艺的稳定性,通过WT-2000少子寿命测试仪对采用这三种钝化工艺的单晶硅片,多晶硅片以及物理提纯硅片在暗条件不同储存时间的少子寿命进行测量,分析得到三种表面钝化工艺的效果以及稳定性。研究结果表明:碘酒钝化效果好,用PECVD双面沉积SiNx:H膜钝化和热氧化钝化稳定性好。     

H+ passivation of poly-si solar cells processed by different annealing processes

The effects of different annealing processes on the photovoltaic (PV) properties and the spectral response as well as minority carrier lifetime in the bulk of unanalyzed PF₅ ion implantation poly-Si solar cells were investigated. The different hydrogen passivation effects of defects in poly-Si induced by three heat treatment processes are reported. We used RTA-rapid thermal annealing, YAG pulse laser annealing and CTSA-classical three-step annealing for this study. The results show that cells processed by RTA (800°C, 4 sec) achieved the best PV properties and spectral response among all annealed samples. Under this precess condition, no or few defects were induced in bulk. While RTA (>-850°C for 4 sec), CTSA as well as YAG laser processes induced defects of different nature and concentration in the bulk of cells. It is further shown that hydrogen ion implantation significantly improved, the performances of poly-Si cells. It is able to efficiently remove the YAG laser induced defects in bulk. However, it cannot completely passivate the defects induced by CTSA and RTA processes. Biography: LI Jin-chai (1946-), male, Associate professor. Research direction: studies of ion beam modification of materials and films of new functionail materials.     

均匀化处理温度对6082铝合金组织和性能的影响

采用硬度、电导率测试、金相显微镜、X线衍射、扫描电镜、透射电镜和能谱分析技术,研究均匀化温度对合金组织和性能的影响.研究结果表明:铸态合金由α-Al固溶体和非平衡共晶相组成;490～510℃均匀化,Mg2Si相从过饱和固溶体中析出,在510℃以上均匀化,随着温度的升高,Mg2Si又逐步回溶到基体中,560℃均匀化,Mg2Si相和过剩单质Si完全溶解;随着均匀化温度的升高,非平衡析出物鱼骨状共晶形态逐渐消失,针状β-AlMnFeSi溶解、断裂,转变为具有更高(Mn+Fe)/Si比值颗粒状α-Al(MnFe)Si相,析出相在高温均匀化过程中聚集、球化;560℃均匀化,析出物的连续网状结构转变成链状结构,析出物演化为等轴粒状α-Al(MnFe)Si相.均匀化过程中合金中析出弥散α-Al(MnFe)Si相;在490～560℃保温6h均匀化处理,温度升高,合金的硬度和电导率分别升高和降低.     

NaOH溶液浓度对激光刻蚀多晶硅片表面织构的影响

利用扫描电镜表征硅片样品的表面形貌,用光谱仪测试硅片的反射率,并且用少子寿命测试系统测试硅片电学性能,研究了在进行多晶硅太阳能电池表面织构过程中NaOH溶液浓度对其的影响,结果表明:NaOH溶液浓度选择10%时,有效清除多晶硅片表面缺陷的同时,硅片表面织构减反射效果显著,并能兼顾硅片电学性能。     

射频共溅射SiC薄膜的制备和特性研究

用射频共射复合靶技术和Ｎ２气保护下高温退火的后处理方法,在Ｓｉ衬底上制备出了碳化硅薄膜,通过傅里叶变换红外光谱、室温光致发光谱、电阻率－温度关系谱、Ｘ射线光电子谱等测量手段,研究了淀积膜和不同温度退火薄膜的结构、电学和光致发光等性质。     

锗/硅量子点形貌随退火温度的变化与电学特性研究

研究了锗(Ge)量子点薄膜表面形貌随退火温度的变化及其相应的电学特性。以锗烷为主要反应气体,应用等离子增强化学气相沉积法(PECVD)在300℃温度、p-硅(100)基片上沉积了锗量子点薄膜,然后分别在400℃、500℃、600℃温度下退火。应用原子力显微镜(AFM)系统地观察了锗量子点薄膜的二维、三维图像,发现原位生长的锗量子点尺寸起伏大、薄膜表面比较粗糙。退火后,锗量子点分布趋于均匀,并且随退火温度的升高,量子点呈一定的取向排列,表面变得平整。通过电流-电压(I-V)和电容-电压(C-V)测试,发现锗量子点薄膜具有良好的电学特性。随退火温度的升高,电流、电容显著增大,漏电流减小,说明退火后,锗量子点薄膜晶界和粗糙度减小,使样品的表面、界面特性更好。     

Mev^28Si^＋注入GaAs的退火行为

报导 MeV 硅离子注入半绝缘 GaAs 的快退火行为,根据缺陷作用原理分析了硅的不均匀激活和载流子分布特征.指出应按载流子浓度、迁移率、埋层电阻和击穿等特性综合评价深埋层和近表面层的品质,优化注入和退火参数.     

Influence of surface passivation on the minority carrier lifetime,Fe-B pair density and recombination center concentration

Three kinds of methods (0.08 mol/L iodine in ethanol, SiNx:H, and 40% HF) are used to passivate solar-grade Czochralski (Cz) silicon wafers. Thereafter, minority carrier lifetime and Fe-B pair density of the wafers are measured using the microwave pho-to-conductance decay (μ-PCD) technique. Based on the measured minority carrier lifetime, it is found that the passivation quality achieved by 0.08 mol/L iodine in ethanol is the best, while that by 40% HF solution is the worst. For the identical wafer, the density distribution of Fe-B pairs is different when different passivation methods are used. When the wafers are passivated by SiNx:H, there exists a close correlation between the distribution of minority carrier lifetime and the concentration distribution of Fe-B pairs. Furthermore, for wafers with high-quality passivation, there is a strong correlation between the recombination center concentration and the Fe-B pair density. All the analyses verify that the surface passivation quality of wafers influences the measurement results of minority carrier lifetime, Fe-B pair density and recombination center concentration.     

室温下Ba0.67Sr0.33TiO3薄膜的射频磁控溅射法制备及其电学性能研究

采用磁控溅射技术在室温下制备Ba0.67Sr0.33TiO3薄膜,通过引入LaNiO3作为缓冲层以及对退火工艺的研究,采用两步法快速退火工艺与常规退火工艺结合的方式获得了致密并具有良好电学性能的钛酸锶钡薄膜.X线衍射分析表明室温情况下获得的薄膜是非晶态,需要通过后续的退火处理才能获得晶化的薄膜,采用快速退火与常规退火相结合工艺,即以40℃/s的升温速率,先升温到850℃,再降温到450℃保温180s,然后再在500℃常规退火3h,可使室温下溅射的呈非晶态的BST薄膜晶化形成具有完全钙钛矿结构的BST薄膜,薄膜致密,晶粒大小均匀.室温下所制备的BST薄膜在100Hz时的介电常数约为300,介电损耗约为0.03,具有铁电性.     

纳米硅的拉曼散射和可见光致发光

我们用射频共溅射技术和后退火处理,获得在石英、Si和Ge衬底上的纳米晶Si(nc-Si) Raman测量清楚地显示出nc-Si的类Lo模(～518cm-1)和类To模(～814cm-1),Raman峰的半高宽(FWHM)和积分强度也显示随退火温度Ta增加的变化,这一结果同nc-Ge/SiO2的情况类同,退火温度Ta=650℃时,nc-Si的平均尺寸为4.9nm 我们用514.5nm的Ar+激光激发,得到了室温可见PL,结果表明:PL谱在2.2eV处有一强的发光峰,与nc-Ge/SiO2相比,SiO2中nc-Si的PL峰更强,峰值能量较大,相应的Ta也较高,当Ta>800℃和Ta<600℃时,PL峰很弱 通过地研究膜中nc-Si的含量与PL峰之间的关系,表明nc-Si的含量对PL峰的积分强度有重要影响,对峰位影响不大,当Si/SiO2靶面积比为1∶1时,PL峰最强     

半导体材料特性和参数研究

提出超晶格(AlAs/GaAs)和应变超晶格（Gex-Si,InxGa1-xAs/GaAs)光伏效应的机理,测量了不同温度下的光伏谱,光伏曲线反映了台阶二维状态密度分布并观察到跃迁峰。计算了导带和价带子带的位置和带宽,根据宇称守恒确定光路迁选择定则,对路迁峰进行指认。研究了光伏随温度变化、激子谱峰半高宽随温度和阱宽的变化,讨论谱峰展宽机制中的声子关联,混晶组分起伏及界面不平整对线宽的影响。测量了元素和化合物半导体单晶材料的室温、低温下的表面光电压谱,推导了有关计算公式,计算得出电学参数（L、n0 、μ、S、W）、深能级和表面能级位置、带隙和化合物组分;分析了电学参数的温度关系;由双能级复合理论,研究了少子扩散长度与深能级关系,计算了深能级浓度和参数。在不同条件下研制了二氧化锡/多孔硅/硅（SnO2/PS/Si)和二氧化锡/硅（SnO2/Si),测量了它们的光伏谱,分析表明它们存在着异质结。当样品吸附还原性气体（H2、CO、液化石油气）时,光电压有明显变化,因此可做为一种新的敏感元件。分析了它们的吸附机理,计算了有关参数。     

在中等阻值范围内NiCr-O系及Cr-Si系电阻薄膜的应用比较

合金成分、沉积条件以及热处理工艺是影响薄膜性能极其重要的因素,为便于电阻薄膜的合理选材,分析了应用于中阻值范围内的NiCr-O系及Cr-Si系溅射薄膜的膜层结构,对比了它们在热处理前后的电性能变化情况,并通过短期试验考核它们在应用中劣化的可能性.实验结果表明,经退火处理后,Cr-Si系溅射薄膜的膜层构成主要为非晶态基体及SiOx氧化物包围纳米级硅化物相,而NiCr-O系溅射薄膜的膜层主要由Cr2O3和原子范围短程有序的金属相组成;Cr-Si系电阻薄膜比NiCr-O系电阻薄膜致密稳定,前者在电性能方面具有抗电压击穿、耐潮湿等优点.     

PECVD氮化硅薄膜的沉积和退火特性

利用等离子增强化学气相沉积(PECVD)方法沉积了氮化硅薄膜,反应气体为氨气和硅烷.这些薄膜在不同条件(温度、时间和气氛)下进行了炉温或快速退火.对太阳电池而言,氮化硅薄膜不仅是有效的减反射层而且也有表面钝化和体钝化作用.利用椭圆偏振光谱、反射谱、红外吸收谱和准稳态光电导(QSSPC)分析了氮化硅薄膜的特性.实验发现随着退火温度的增加,氮化硅薄膜的厚度下降而折射率增加,可以归因于在退火过程中,薄膜愈加致密.红外吸收谱的研究发现,氮化硅中氢的含量在退火过程中有明显的下降,而QSSPC测量的样品寿命有同样的变化.这些结果显示氮化硅的钝化作用与其中的氢含量有关.     

超薄MoN扩散阻挡层的扩散阻挡性能分析

采用磁控溅射法,制备了超薄MoN扩散阻挡层,并对Cu/MoN/Si体系进行真空退火。用四点探针(FPP)、X射线衍射(XRD)、场发射扫描电子显微镜(FESEM)进行薄膜电性能和微结构表征。分析结果表明,MoN作为Cu扩散阻挡层结构具有良好的热稳定性,失效温度达到600℃,明显优于Mo扩散阻挡层。     

退火温度对溅射Al膜微结构及光学常数的影响

用直流溅射镀膜工艺在室温Si基片上制备了250nm厚的Al膜,并用X射线衍射及反射式椭偏光谱技术,对薄膜的微结构和光学常数在不同退火温度下的变化进行了测试分析。结构分析表明:退火后的Al膜均呈多晶状态,晶体结构仍为面心立方;随着退火温度由室温20℃左右升高到400℃,薄膜的平均晶粒尺寸由22.8nm增加到25.1nm;平均晶格常数(4.047)略比标准值4.04960小。椭偏光谱测量结果表明:2600～8300光频范围内,退火温度对折射率n影响较小,对吸收系数k的影响较为明显。     

退火温度对ZnO薄膜晶体管电特性的影响

针对非晶硅和有机薄膜晶体管的低迁移率问题,以高纯Zn为靶材,反应磁控溅射沉积、且在不同温度下退火的ZnO薄膜作为半导体活性层,成功地制备出基于ZnO材料的薄膜晶体管(ZnO-TFT),研究了退火温度对ZnO -TFT电特性的影响.结果表明:ZnO- TFT的载流子迁移率随退火温度的升高而明显增大,700℃退火的样品迁移...     

Characterization of ultrathin SiO 2/Si interface grown by low temperature plasma oxidation

Ultrathin SiO 2 layers on Si (100) wafers were prepared by plasma oxidation at a low temperature (250℃). The analyses of X-ray photoelectron spectroscopy (XPS) and TEM reveal that the chemical composition of the oxide layer is stoichiometric SiO 2 and the SiO 2/Si interface is abrupt. The thickness of the ultrathin oxide layer obtained from XPS, capacitance-voltage (C-V) and ellipsometry measurements indicate a nonlinear time dependence. The high frequency C-V characterization of MOS structure shows that the fixed charge density in SiO 2 film is about 10 11 cm -2 . It is also shown that the strength of breakdown electrical field of SiO 2 film with 6 nm thickness is of the order of 10 6 Vcm -1 . These properties of the ultrathin SiO 2 layer ensure its application in silicon quantum devices.     

HV/CVD Grown Relaxed SiGe Buffer Layers for SiGe HMOSFETs

High-vacuum/chemical-vapor deposition (HV/CVD) system was used to grow relaxed SiGe buffer layers on Si substrates. Several methods were then used to analyze the quality of the SiGe films. X-ray diffraction and Raman spectroscopy showed that the upper layer was almost fully relaxed. Second ion mass spectroscopy showed that the Ge compositions were step-graded. Transmission electron microscopy showed that the misfit dislocations were restrained to the graded SiGe layers. Tests of the electrical properties of tensile-strained Si on relaxed SiGe buffer layers showed that their transconductances were higher than that of Si devices. These results verify the high quality of the relaxed SiGe buffer layer. The calculated critical layer thicknesses of the graded Si1-xGex layer on Si substrate and a Si layer on the relaxed SiGe buffer layer agree well with experimental results.     

退火温度对单向纤维晶纯铜线材组织性能影响

对退火前后单向纤维晶纯铜线材组织进行了观察，测试了其力学与导电性能，结果表明：在300℃以下退火时，线材的金相显微组织与退火前相比没有明显变化，仍然保持为连续纤维晶，其抗拉强度有所下降，延伸率有所增加；在400℃退火时，线材发生完全再结晶，且有孪晶生成；500％退火时，再结晶晶粒长大；在400℃以上退火时，抗拉强度大幅度下降，延伸率显著增加；在200～400℃的范围退火时，电导率增加，但增幅较小。     

Effect of solidification rate on the coarsening behavior of precipitate in rapidly solidified Al-Si alloy

The gas-atomized Al-Si alloy powder with different particle sizes was subjected to isothermal annealing for understanding the effect of solidification rate on precipitation and growth Si crystals. The results show that Si precipitates grew more quickly in the small samples with a large solidification rate due to high interfacial energy. Moreover, these Si crystals had a tendency to form a quasi-spherical shape after annealing at a low temperature or for a short holding time. Coarsening of the Si precipitates during annealing was examined using a LSW equation. Thermal stability of the rapidly solidified alloy was significantly influenced by its original microstructure as a result of high solidification rate. Furthermore, more serious clustering of Si-Si phase was also observed in the small samples, attributed to the rapid coarsening of the Si phases.