Surface roughness and removal rate in magnetorheological finishing of a subsurface damage free surface

Based on computer-controlled optical surfacing, a new technique called magnetorheological finishing (MRF), is presented. The new technique combines the features of conventional loose abrasive machining with a wheel shaped polishing tool. The tool incorporates a host of features and has unprecedented fabricating versatility. The pre-polishing and fine polishing processes can be performed only by adjusting different parameters. The material removal function is studied theoretically and the results of simulation present a Gaussian distribution feature. Based on the established theoretical model, material removal rate experiments involving a parabolic mirror are designed and carried out to determine the effect of controllable parameters on size of the gap between the workpiece and the polishing wheel, rotating speed of the polishing wheel, concentration of volume fraction of non-magnetic particles and polishing time. Further experiments are carried out on the surface microstructure of the workpiece, the final surface roughness with an initial value of 10.98 nm reaches 1.22 nm root mean square (RMS) after 20 min of polishing. The subsurface damage experiment and the atomic force microscopy (AFM) measurement on the polished surface can also verify the feasibility of the MRF technique.     

超声振动辅助抛光BK7过程中聚氨酯抛光垫磨损行为

抛光光学玻璃等硬脆材料时常选用聚氨酯抛光垫,其微观形貌和磨损直接影响抛光精度和效率.本文对不同抛光时长下聚氨酯抛光垫微观形貌和磨损行为及其对材料去除率和表面粗糙度的影响进行了实验研究.结果表明：当主轴转速为8 000 r/min,进给速度为0.015 0 mm/s,轴向超声振幅为5μm时,材料去除率和表面粗糙度分别为0.977μm/min和153.67 nm.聚氨酯抛光垫在30 min内磨损量较小,随着抛光时长的增加,抛光垫表面孔隙逐渐被磨粒和玻璃碎屑填充,破坏抛光垫表面的疏松多孔结构,导致抛光垫表面硬化,失去弹性.同时,侵入抛光垫表面的磨粒会阻止抛光接触区域内的磨粒更新,导致抛光质量降低.     

Surface roughness and removal rate in magnetorheological finishing of a subsurface damage free surface

Asphericalopticalcomponentsareimportantin modernopticalsystems[1].Thereexistmanytypesof aspheres.Thecommonlyusedonesincludeparabola,ellipsoid,etc.[2]Recently,increasingrequirements forasphericalopticalcomponents(e.g.forlithogra phy)togetherwithgrowingfieldsoftheirapplication(e.g.conformalandfreeformoptics)resultina strongneedforopticalfinishingmethodsthatcanbe appliedlocallytopolishcomplexshapedaspheresin brittlematerials(e.g.glass)[3].However,making high precisionaspheresisstillprimarilyanard…     

TC4钛合金磁流变抛光的磁感应强度分布及参数

使用磁流变抛光技术对钛合金进行抛光,为了获得更好的表面质量,分别对磁感应强度分布、磁流变液和抛光参数进行了研究。首先,优化了加工区域的磁感应强度分布,通过在加工区域添加两块铁板,磁感应强度分布变得均匀,从而提高抛光后钛合金工件的表面质量。其次,分析了磁流变液的组成,即基液、磨粒类型以及磁性粒子和磨粒的质量占比对工件表面粗糙度的影响。随后,研究了四个基本抛光参数,即磨粒目数、工件转速、磁感应强度和抛光时间,找出这些参数对表面质量的影响规律。采用响应面法获得了工件表面粗糙度变化率的模型,并进行了方差分析以检查模型的显著性。最后,找出最优的抛光参数并对其进行了实验验证。     

磁性液体研磨加工小型零件

介绍了几种磁性液体研磨的装置及工作原理,指出磁性液体的研磨是利用磁性液体的流动性和磁性来保持磨料与工件之间产生相对运动,从而达到研磨光整工件的精加工方法.     

电流变抛光液中固相粒子间结合模型研究

电流变抛光液中的固相极化后形成复杂的微观结构并改变其流变性能。通过超景深三维显微系统观察了电流变抛光液在外加电场作用下形成的微观结构。根据粒子介电极化模型和抛光液中固相粒子间的作用力,建立了混有不同粒度磨料颗粒的电流变抛光液中固相粒子的结合模型,分析了颗粒粒度和粒子间作用力等因素对粒子结合模型的影响。     

可控电解珩磨准稳态加工去除规律模型参数的确定

可控电解珩磨的本质就是实时变化电场控制的电化学机械复合加工方法,以微机实时控制电解珩磨过程中工件表面的电解电场强度,从而调控各点金属去除速度,获得工件要求几何形状精度。针对建立的准稳态加工条件下去除规律的基本模型,通过实际加工中去除实验的分析与综合,利用最小二乘拟合方程确定基本模型中的相应参数,建立了一定加工条件下去除规律的实用数学模型。     

基于软性磨料流的Preston方程kp参数的修正与测定

通过将流体磨料充满圆孔工件中,用活塞推动磨料在圆孔中流动,活塞挤压一个行程为一个循环。同一工件用同一种流体磨料循环加工,对同一点可测试其直径的变化量;并将此测量点的直径变化量代入修正过的基于软性磨料流加工微孔的Preston方程的k_p参数公式;并对不同质量分数下的软性磨料流基于Preston方程的k_p参数进行了测定与计算。通过分析不同质量分数下的软性磨料流的k_p参数,得出:随着磨料质量分数的提高,软性磨料Preston方程的k_p参数也随之不断增加,表现为对微孔表面的材料去除能力也越来越强。随着磨料质量分数的提高,软性磨粒流的材料去除率越大。     

碳化硅零件氧化辅助抛光超精密加工的研究现状

通过等离子体氧化、热氧化、电化学氧化在碳化硅基材上获得软质氧化层,利用软磨粒抛光实现氧化物的快速去除,有利于提高材料去除效率、提升加工表面质量。研究发现,通过等离子体氧化辅助抛光,表面粗糙度RMS和Ra分别达到0.626nm和0.480nm;通过热氧化辅助抛光,表面粗糙度RMS和Ra分别达到0.920nm和0.726nm;在电化学氧化中,基于Deal-Grove模型计算得到的氧化速度为5.3nm/s,电化学氧化辅助抛光后的表面粗糙度RMS和Ra分别是4.428nm和3.453nm。氧化辅助抛光有助于烧结碳化硅加工工艺水平的提升,促进碳化硅零件在光学、陶瓷等领域的应用。     

磨粒几何排列对 Inconel 718 磨抛的有限元仿真研究

目的 为了提高砂带磨抛镍基合金 Inconel 718 的表面精度,避免砂带上磨屑堆积等问题,针对砂带表面磨粒 的顶端结构以及排列方式进行了分析,通过三维动力学仿真方法,研究磨抛过程中磨削力和磨屑的变化情况。 方法 开展三种尖端类型磨粒和排列间距、倾角对 Inconel 718 的磨削机理研究,先分析尖端为点型、线型、面型的磨粒磨 削过程,对比不同尖端类型磨粒的切屑形态与磨削力的大小,根据挑选出的点型尖端磨粒建立正四面体磨粒,利用 该类型磨粒建立有序与无序的金刚石多磨粒模型,通过有限元软件分析磨粒水平和竖直方向上的间隙大小以及磨 粒排布线倾角变化对磨削力和工件表面质量的影响。 结果 发现点型尖端磨粒产生的切屑呈碎屑状,更容易在多磨 粒间排出,不易堵塞砂带,且在磨削过程中所受的磨削力更小;分析发现有序排列的磨粒类型具有很大的优势,能 够提高工件表面精度,在工件表面产生大小均匀的沟槽,同时降低砂带受到的磨抛力小;发现磨削力大小会随着排 布线倾角的增加呈现先增大后减小趋势。 通过与实验对比,发现磨屑的形状会随着水平方向间隙的增大而变化, 呈现出由块状至带状到细长条状的变化规律,细长条状的磨屑更易从间隙中排出,从而达到降低磨抛力的效果。 结论 采用点型尖端磨粒和合适的磨粒排布规律能够有效提高磨抛后的工件表面精度和促进磨屑的排出,为砂带 的制造生产提供新的思路。     

工程陶瓷镜面加工的研磨与抛光技术

应用高速研磨和抛光新技术进行工程陶瓷镜面加工，大量实验表明，将散粒磨料改为固结磨料研磨可提高生产率、降低加工成本并改善表面质量，此外，还探讨了高速抛光的机理。     

Viscosity behavior of magnetic suspensions in fluid-assisted finishing

Magnetic fluid-assisted finishing has been verified both theoretically and experimentally as an effective fabrication technology for optical mirrors and lenses. The purpose of this paper is to introduce a novel design of polishing tool and demonstrate the possible applications of this technology. The work includes studying the viscosity of the magnetic suspensions of micrometer-sized Carbonyl iron particles under the influence of a magnetic field. Both the cases of magnetizable suspension with and without abrasive cerium oxide particles are studied for their ensuing polishing effectiveness. Determination of material removal function is conducted using a Wyko Nat1100 interferometer. Experiments to reduce surface roughness with the proposed tool are also performed using a K9 mirror as the work-piece. Results show that the surface accuracy is improved over three times to less than 0.5 nm after two cycles of polishing.     

Viscosity behavior of magnetic suspensions in fluid-assisted finishing

Magnetic fluid-assisted finishing has been verified both theoretically and experimentally as an effective fabrication technology for optical mirrors and lenses. The purpose of this paper is to introduce a novel design of polishing tool and demonstrate the possible applications of this technology. The work includes studying the viscosity of the magnetic suspensions of micrometer-sized Carbonyl iron particles under the influence of a magnetic field. Both the cases of magnetizable suspension with and without abrasive cerium oxide particles are studied for their ensuing polishing effectiveness. Determination of material removal function is conducted using a Wyko Nat1100 interferometer. Experiments to reduce surface roughness with the proposed tool are also performed using a K9 mirror as the work-piece. Results show that the surface accuracy is improved over three times to less than 0.5 nm after two cycles of polishing.     

氮化镓晶片的化学机械抛光工艺

研究了抛光工艺参数对氮化镓(GaN)化学机械抛光(CMP)表面形貌和材料去除率的影响。通过精密分析天平和原子力显微镜对其材料去除率和表面形貌进行分析,采用单因素及正交实验法探究压力、抛光盘转速和氧化剂浓度对GaN材料去除率和表面形貌的影响。结果表明:在下压力为14.1×10~4 Pa、抛光盘转速为75 r/min、H_2O_2浓度为0.8%、SiO_2磨粒为30%、抛光液流量为20 mL/min、抛光时间为15 min的条件下,GaN晶片表面材料去除率最大达到103.98 nm/h,表面粗糙度最低为0.334 nm。可见,在优化后的工艺参数下采用化学机械抛光,可同时获得较高的材料去除率和高质量的GaN表面。     

基于单分子层去除机理的芯片化学机械抛光材料去除模型

基于单分子层材料的去除机理,应用微观接触力学和概率统计方法建立了化学机械抛光(CMP)及材料去除的数学物理模型.模型揭示了材料的去除率和磨粒的大小、浓度呈非线性关系,而且模型预测结果与已有的试验数据相吻合,为进一步研究磨粒对CMP材料去除的影响提供了新的研究视角.     

玻璃钢复合材料砂带磨削实验分析

采用3种磨料不同粒度的砂带对玻璃钢复合材料进行砂带磨削实验,分析了磨料与工件间的交互作用机理。通过大量试验以及试验数据获得了玻璃钢复合材料砂带磨削过程中材料切除率以及砂带寿命的主要影响因素,并首次采用专业图像分析软件Image-ProPlus分析了砂带堵塞程度及堵塞的主要原因。实验结果表明:玻璃钢复合材料砂带磨削过程中,材料切除率受磨削压力、砂带线速度、磨料种类及粒度的影响很大,其中陶瓷磨料磨削时获得的材料切除率最高;影响砂带堵塞程度的最主要因素是磨削压力;磨平磨钝是砂带磨粒最主要的磨损形式,其中堆积磨料砂带的寿命最长,陶瓷磨料砂带次之。     

砂轮约束磨粒喷射精密光整加工表面形貌的创成机理

针对磨削加工存在表面缺陷层,重要零件需要在磨削后进行以去除表面缺陷层、降低粗糙度和波纹度等光整加工的实际,提出了砂轮约束磨粒喷射光整加工新工艺,将磨削与磨粒喷射精密光整加工一体化·阐述了表面光整加工的主要方法,研究了砂轮约束磨粒喷射精密光整加工材料去除机理和微观表面形貌的创成机理,在楔形区游离磨粒获得能量对工件进行抛磨、滑擦、微耕犁和微切削是材料去除机理的核心因素,磨料流体侧向挤出是均化和降低表面波纹度的主要因素·试验表明,该方法能明显去除磨削加工过度塑性变形、降低表面粗糙度和均化波纹度,对丰富精密光整加工工艺和理论具有重要意义,并对工业生产有实用价值·     

磨削加工的计算机分布式控制系统

研究了对钻石，水晶，金属玻璃等的磨削加工处理方法。研制开发了由单片微机构成的X－Y－Z三轴同步控制的智能加工装置，组成了由中心加工服务器，多台智能磨削控制装置通过RS485串行总线的构成的分布式控制系统，解决了由CAD设计到磨削加工NC指令的自动转换和数据传输，该系统已投入实际生产运用。     

Compound machining of silicon carbide ceramics by high speed end electrical discharge milling and mechanical grinding

A compound process that integrates end electrical discharge (ED) milling and mechanical grinding to machine silicon carbide (SiC) ceramics is developed in this paper. The process employs a turntable with several uniformly-distributed cylindrical copper electrodes and abrasive sticks as the tool, and uses a water-based emulsion as the machining fluid. End electrical discharge milling and mechanical grinding happen alternately and are mutually beneficial, so the process is able to effectively machine a large surface area on SiC ceramic with a good surface quality. The machining principle and characteristics of the technique are introduced. The effects of polarity, pulse duration, pulse interval, open-circuit voltage, discharge current, diamond grit size, emulsion concentration, emulsion flux, milling depth and tool stick number on performance parameters such as the material removal rate, tool wear ratio, and surface roughness have been investigated. In addition, the microstructure of the machined surface under different machining conditions is examined with a scanning electron microscope and an energy dispersive spectrometer. The SiC ceramic was mainly removed by end ED milling during the initial rough machining mode, whereas it is mainly removed by mechanical grinding during the later finer machining mode; moreover, the tool material can transfer to the workpiece surface during the compound process.     

磨粒和抛光垫对铝合金化学机械抛光性能

磨粒和抛光垫为化学机械抛光(CMP)提供了重要的机械磨削作用。为了探讨磨粒和抛光垫对铝合金化学机械抛光的磨削作用,研究了不同种类磨粒和抛光垫对材料去除率和表面形貌的影响。结果表明：在pH=12-13时,氧化铝抛光液去除率(MRR)为910nm/min,远大于二氧化硅与氧化铈抛光液,且获得较为理想光滑表面。3种不同抛光垫抛光后的铝合金表面,呢子抛光垫表面将不会出现划痕与腐蚀点,表面粗糙度较低为10.9nm。随着氧化铝浓度的增加,材料去除率(MRR)和表面粗糙度(Ra)均增加。当氧化铝含量为4wt%时,抛光垫使用呢子抛光垫适宜铝合金化学机械抛光,在获得高去除率的同时铝合金表面精度高。