化学镀Ni-Cu-P合金的研究

研究了化学镀 Ni-Cu-P 合金的工艺,对镀液的稳定性和镀层的性能进行分析研究.获得含 Ni83.31%、Cu4.08%、P8.59%均匀无针孔的镀层;镀层的结合力、耐蚀性良好;经热处理后镀层的硬镀达到993.4HV.     

稀土元素化学镀镍工艺及防腐性能研究

研究了在稀土元素存在条件下，钢铁表面进行化学镀Ni—P合金时其镀液成分对镀层的影响，检验了镀层的耐腐蚀性。结果表明：用最佳工艺镀得的镀层较厚，耐腐蚀性能较好，镀层光亮、致密。     

稀土元素化学镀镍工艺及防腐性能研究

研究了在稀土元素存在条件下 ,钢铁表面进行化学镀Ni-P合金时其镀液成分对镀层的影响 ,检验了镀层的耐腐蚀性。结果表明 :用最佳工艺镀得的镀层较厚 ,耐腐蚀性能较好 ,镀层光亮、致密     

Ni—P合金化学镀组分的确定

通过实验确定了Ni-P合金化学镀液的最佳配比．实验结果表明，利用所得镀液制成的合金镀层有良好的物理化学性能，可在金属防腐领域得到广泛应用。     

NdFeB磁性材料化学镀Ni-W-P合金的耐腐蚀性能研究

采用化学镀方法在NdFeB磁性材料表面施镀Ni-W-P合金,利用扫描电子显微镜、X射线衍射仪对Ni-W-P合金镀层的组织形貌、结构进行了分析,并采用腐蚀失重法对合金镀层的耐腐蚀性能进行了测试.结果表明：随着P含量的逐渐增多,镀层结构由晶态结构逐渐转变为非晶结构,非晶态Ni-W-P合金镀层的抗腐蚀性能明显好于晶态镀层.     

复合稀土化学镀镍工艺及性能研究

研究了在复合稀土元素存在条件下,钢铁表面化学镀Ni P合金的工艺条件及镀层的耐腐蚀性能.结果表明,用最佳工艺镀得的镀层较厚,表面光亮、致密,耐腐蚀性能较好.     

钢铁表面Cu—Sn—P／Ni—Sn—P合金复合镀层的结构和性能

钢铁表面浸镀Cu-Sn-P合金，得到金黄色仿金镀层．在金黄色镀层上化学镀法Ni—Sn—P合金，形成Cu-Sn-P／Ni-Sn-P合金复合镀层，确定了镀液的最佳组成和工艺，用盐水浸泡测定复合镀层的防腐蚀性，用SEM，XPS和AES谱分析镀层的表面形貌、组成、结构和性能．结果表明，合金复合镀层使钢铁耐腐蚀性得以改善，Cu—Sn—P镀层可表示为Cu—Sn—P／CuxOy／SnxOy；Ni—Sn—P镀层可表示为Ni—Sn—P／NixOy／SnxOy，各元素的相对原子百分浓度分别为Ni52．2％，O6．9％，Sn18．7％，P12．9％，Fe9．3％．     

化学镀Ni-P-PTFE(聚四氟乙稀)的研究

在电镀液、化学镀液中加入非水溶性的固体颗粒使其与金属离子共沉积在镀件上,对改善镀层的使用性能具有特殊意义.PTFE对提高镀层的润滑性与耐磨性起重要作用[1、2].文章就化学镀Ni-P-PTFE镀液性质;镀液中PTFE含量对镀层的沉积速度,镀层中PTFE含量的影响,镀液的温度对沉积速度及镀层中PTFE含量的影响进行研究;对镀层的性能:孔隙率、成分、密度、硬度、镀层晶化温度、电化学特征参数等进行了测定,从而为实际应用提供了依据.     

化学镀Ni-P-ZrO_2工艺及性能

以NiSO4 为施镀主盐 ,次亚磷酸钠为还原剂研究了化学镀法在工件表面获得良好性能的Ni P ZrO2 镀层的工艺 .用正交试验法确定了镀液的最佳成分 ,考察了施镀温度、搅拌速度、ZrO2 微粒的添加量对镀层形成的影响 ,并用X射线衍射和电子探针对镀层的结构进行了分析 .结果表明 ,镀液的最佳组成为 :NiSO4 30g·L-1,配合剂 18g·L-1,稳定剂 2g·L-1,次亚磷酸钠 2 0g·L-1,促进剂 15g·L-1;施镀工艺条件为 :施镀温度 85～ 90℃ ,ZrO2 微粒加入量 10～ 2 0g·L-1,在施镀过程中采用间歇式搅拌法 ;经过 30 0℃以下的热处理后镀层结构仍为非晶态结构 ,经过 30 0℃以上的热处理后 ,则变为晶体结构 ;用以上方法获得的镀层为高磷镀层 .此外 ,用浓度为 10 % (质量分数 )的盐酸检验镀层的耐蚀性 ,结果表明ZrO2 微粒的加入不会影响Ni P基质层的抗蚀性 .因此 ,采用本工艺能获得性能优良的Ni P ZrO2 合金镀层 ,且性能比Ni P镀层有显著提高     

NdFeB磁性材料化学镀非晶态Ni—W—P合金及其相转变行为

采用化学镀方法在NdFeB磁性材料表面施镀非晶态Ni—W—P合金,利用扫描电子显微镜（SEM）及X射线衍射仪对Ni—WP合金镀层的组织形貌、结构及其相转变行为进行了分析．结果表明,非晶态Ni—W—P合金镀层是由大量不同尺寸的颗粒状或胞状突起组成,随着热处理温度逐渐升高,镀层结构由非晶结构逐渐转变为晶态结构,非晶态Ni—W—P合金镀层的晶化转变温度范围为350～380℃．     

Kinetics of electroless Ni-Cu-P deposits on silicon in a basic hypophosphite-type bath

Electroless Ni-Cu-P deposits were deposited on the Si substrate in a basic hypophosphite-type plating bath. The effects of pH value and the metal source composition, Ni and Cu, in the plating bath on the kinetics of the Ni-Cu-P deposition were studied. The electroless Ni-Cu-P deposits were characterized by a scanning electron microscope, a transmission electron microscope, an energy dispersive X-ray spectroscope, and an X-ray diffractometer. The results showed that the pH value of the plating bath had no obvious effect on the morphology and composition of electroless Ni-Cu-P deposits. However, the composition of the metal source, Ni and Cu, in the plating bath had great effect on the kinetics of electroless Ni-Cu-P deposition.     

化学镀Ni-Mo-P纳米晶镀层腐蚀性能研究

通过化学镀获得了混晶(非晶+微晶)和纳米晶态两种结构的Ni-Mo-P合金镀层,并将混晶态镀层进行晶化处理得到一种单相和一种双相的纳米晶镀层。通过阳极极化曲线分析了各镀层在5%H2SO4溶液的耐蚀性能并与Ni-P镀层进行对比,结果发现,镀态Ni-Mo-P纳米晶镀层的耐蚀性能优于镀态Ni-P纳米晶镀层;经退火处理后获得的两种纳米晶镀层的耐蚀性能比镀态混晶和纳米晶镀层均要好;同时还发现退火处理获得的Ni-Mo-P双相（Ni+Ni3P）纳米晶镀层与退火处理后获得的Ni-Mo-P单相(Ni)纳米晶镀层的耐蚀性能相当。     

非稀土金属及合金化合物改性烧结NdFeB磁体的研究进展

研究发现,烧结钕铁硼(NdFeB)磁体的矫顽力(H_C)、腐蚀性与晶界相成分、微观结构息息相关.传统熔炼添加重稀土元素虽可改善晶界相提高磁体的H_C及抗蚀性,但同时也使添加物均匀地分布于主相,引起稀磁效应并使成本增加.通过晶界添加非稀土物质调控磁体晶界相,可优化晶界相微观结构,提高其电极电位及润湿性,从而在磁体H_C和耐蚀性得以改善的同时,降低磁体中重稀土元素的用量及成本.对近些年晶界添加非稀土金属及合金化合物调控烧结NdFeB晶界相成分、微观结构及其对磁体H_C、抗蚀性影响的部分研究进行了归纳.     

化学镀非晶态Ni-P及Ni-Sn-P镀层在弱酸性介质中耐蚀性研究

以紫铜为基体,采用化学镀制备了非晶态Ni-P,Ni-Sn-P镀层.采用X射线衍射(XRD)、扫描电子显微镜(SEM)和X射线能谱(EDS)等对镀层的结构、微观形貌及元素组成进行分析.通过Tafel极化曲线、电化学阻抗谱(EIS)、开路电位监测及室内加速腐蚀试验,研究两种镀层在pH=5.5,w_(NaCl)=3.5%,以及pH=5.5,wS=20%的土壤介质中的耐蚀性能.结果表明,化学镀非晶态Ni-P及Ni-Sn-P镀层的自腐蚀电流密度是裸铜的4.5%和1.2%,两种镀层在酸性腐蚀介质中具有比金属铜更好的耐蚀性,并且化学镀Ni-Sn-P镀层耐蚀性优于Ni-P镀层.两种镀层的自腐蚀电位均负于铜.     

无电镀镍浸金处理电路板在 NaHSO3溶液中的腐蚀电化学行为与失效机制

采用交流阻抗谱研究了无电镀镍浸金处理电路板在模拟电解质溶液(0.1 mol·L-1 NaHSO3)中的电化学腐蚀行为,并结合体视学显微镜、扫描电镜、X射线能谱分析等手段分析了试样表面腐蚀产物形貌、组成和镀层失效机制.无电镀镍浸金处理电路板在NaHSO3溶液中的耐蚀性较差,浸泡12 h试样表面局部即发生变色,伴随有微裂纹的产生.电解液能够通过裂纹直接侵蚀Cu基底,并在微裂纹周围生成较多的枝晶状结晶产物,其主要组分为Cu2 S.该结晶腐蚀产物的不断生成使局部区域中间Ni过渡层与Cu基底结合部位存在较大的横向剪切应力,最终造成Ni镀层的脱离与鼓泡现象.     

化学沉积Ni—Cu—P合金镀层的组织结构

利用DSC和XRD研究了化学沉积Ni-Cu-P合金镀层的组织结构和晶化过程。结果表明：随着镀层中Cu含量的升高,Ni-Cu-P合金镀层向亚稳中间相Ni5P2及Ni12P5转变和亚稳中间相Ni5P2及Ni12P5向热力学稳定的Ni3P相转变的温度均逐渐升高;非晶态结构的合金镀层（质量分数）Ni-8.47%Cu-15.39%P、Ni-15.35%Cu-13.90%P及Ni-19.71%Cu-12.83%P在300℃加热后仍保持非晶态,而在363.39℃、363.69℃及370.04℃,这3种合金镀层分别转变为亚稳中间相Ni5P2及Ni12P5,随着温度的升高在428.20℃、442.54℃及453.96℃,合金镀层中的亚稳中间相Ni5P2及Ni12P5又进而转变为稳定相Ni3P;对于晶态结构（质量分数）Ni-56.49%Cu-6.01%P合金镀层,在170-330℃,镀层中Ni-Cu晶粒粗化、磷元素向晶界偏聚,在397.80℃镀层中的非晶相转变为亚稳中间相Ni5P2,在464.89℃亚稳中间相Ni5P2转变为稳定相Ni3P。     

Effect of benzaldehyde on the electrodeposition and corrosion properties of Ni–W alloys

The effect of different concentrations of benzaldehyde on the electrodeposition of Ni–W alloy coatings on a mild steel substrate from a citrate electrolyte was investigated in this study. The electrolytic alkaline bath (pH 8.0) contained stoichiometric amounts of nickel sulfate, sodium tungstate, and trisodium citrate as precursors. The corrosion resistance of the Ni–W-alloy-coated specimens in 0.2 mol/L H₂SO₄ was studied using various electrochemical techniques. Tafel polarization studies reveal that the alloy coatings obtained from the bath containing 50 ppm benzaldehyde exhibit a protection efficiency of 95.33%. The corrosion rate also decreases by 21.5 times compared with that of the blank. A higher charge-transfer resistance of 1159.40 Ω·cm2 and a lower double-layer capacitance of 29.4 μF·cm-2 further confirm the better corrosion resistance of the alloy coating. X-ray diffraction studies reveal that the deposits on the mild steel surface are consisted of nanocrystals. A lower surface roughness value (R_max) of the deposits is confirmed by atomic force microscopy.     

Effect of heating rate on the densification of NdFeB alloys sintered by an electric field

This study introduces a novel method of electric field sintering for preparing NdFeB magnets. NdFeB alloy compacts were all sintered by electric fields for 8 min at 1000℃ with different preset heating rates. The characteristics of electric field sintering and the effects of heating rate on the sintering densification of NdFeB alloys were also studied. It is found that electric field sintering is a new non-pressure rapid sintering method for preparing NdFeB magnets with fine grains at a relatively lower sintering temperature and in a shorter sintering time. Using this method, the sintering temperature and process of the compacts can be controlled accurately. When the preset heating rate increasing from 5 to 2000℃/s the densification of NdFeB sintered compacts gradually improves. As the preset heating rate is 2000℃/s, Nd-rich phases are small, dispersed and uniformly distributed in the sintered compact, and the magnet has a better microstructure than that made by conventional vacuum sintering. Also, the maximum energy product of the sintered magnet reaches 95% of conventionally vacuum sintered magnets.