AlGaN/GaN异质结中极化效应的模拟

提出了一种将极化效应引入GaN基异质结器件模拟中的方法. 在传统器件模拟软件中, 通过在异质结界面插入d掺杂层, 利用其离化的施主或受主充当极化产生的固定电荷从而引入极化效应. 模拟了Ga面生长和N面生长的AlGaN/GaN单异质结, 结果显示只有前者在异质结界面有载流子限制效应, 而后者没有; Ga面生长的AlGaN/GaN异质结界面处自由电子面密度随Al组分以及AlGaN的厚度增加而增加. 以上模拟结果与其他报道中的实验以及计算结果一致, 说明该方法可有效地将极化效应引入GaN基异质结器件的模拟中.     

包含Kink效应的改进型GaN HEMTs模型

提出了一种GaN高电子迁移率晶体管（HEMTs）建模方法.该模型以ADS（advanced design system）中的符号定义器件SDD（symbolically defined device）为基础,结合宽带S-参数与脉冲直流测试数据,对GaN器件进行精确建模.本文所用晶体管为双指AlGaN/GaN HEMT器件,其栅长为90 nm,单指栅宽为40 μm.数据测试采用在片测试方法,在常规S参数测试和直流测试基础上,增加了脉冲直流测试,并针对测试数据体现的Kink效应和阈值电压漂移现象进行建模.研究结果表明,该模型可以准确拟合器件0~110 GHz S参数及直流特性,谐波平衡仿真显示该模型具有良好的收敛特性,可用于GaN HEMTs器件电路仿真.      

短沟道AlGaN/GaN高电子迁移率晶体管的Ⅰ-Ⅴ特性研究

考虑栅电压、漏电压和沟长调制效应影响下,在长沟道高电子迁移率晶体管(HEMT)的Ⅰ-Ⅴ输出特性基础上,引入有效迁移率和有效沟道长度,推导了短沟道AlGaN/GaN HEMT的电流-电压(Ⅰ-Ⅴ)输出特性模型.通过比较栅长为105nm时模型计算结果与实际器件的输出特性,表明推导的短沟道AlGaN/GaN HEMT的Ⅰ-Ⅴ模型与实验结果基本相符,误差小于5%.     

非均匀电场中电子在H2/CH4混合气体中运动的数值模拟

用Monte Carlo数值模拟方法研究了辉光等离子体辅助化学气相沉积法(GPCVD)低温合成金刚石的过程中,电子在H2/CH4混合气体中的运动.本文在数值模拟中,采用非匀强电场,并考虑了电子的雪崩过程,实现了对须跟踪的粒子数不断增长的系统的Monte Carlo模拟,给出了电子的能量分布及角分布.     

非均匀电场中电子在H2/CH4混合气体中运动的数值模拟

用Monte Carlo数值模拟方法研究了辉光等离子体辅助化学气相沉积法(GPCVD)低温合成金刚石的过程中,电子在H2/CH4混合气体中的运动.本文在数值模拟中,采用非匀强电场,并考虑了电子的雪崩过程,实现了对须跟踪的粒子数不断增长的系统的Monte Carlo模拟,给出了电子的能量分布及角分布.     

SiC基HEMTs器件的沟道温度热仿真

GaN作为第三代半导体材料,具有大的禁带宽度,高的饱和速度以及非常高的漏电流密度,导致了AlGaN/GaN HEMTs器件在高温,高功率应用方面脱颖而出.本文通过使用有限元法,实现了在稳态条件下对高电子迁移率晶体管(HEMTs)的温度分布,得到了沟道温度随着沟道位置的不同而不同的变化图.通过仿真得到,在中心沟道处的温度最高,以及随着远离沟道中心,沟道温度将会减小的结论.     

Ti与Al比例及退火温度对AlGaN/GaN HEMT欧姆接触影响

利用热蒸发方法制备了Ti/Al金属双层结构的AlGaN/GaN高电子迁移率晶体管(HEMT)欧姆接触,Ti与Al比例分别为1∶2(20 nm/40 nm)、1∶5(20 nm/100 nm)和1∶8(20 nm/160 nm).采用相同退火时间、不同退火温度对不同的Ti与Al比的AlGaN/GaN HEMT结构进行退火.通过XRD对电极结构进行了分析,利用金相显微镜观察了电极的表面形貌.实验结果显示,相同退火时间条件下,退火温度在800℃, Ti与Al比为1∶5的AlGaN/GaN HEMT结构形成了较好的欧姆接触.     

Pd/Pt修饰的AlGaN/GaN HEMT器件氢传感特性研究

制备了Pd/Pt修饰的AlGaN/GaN高电子迁移率晶体管(HEMT)器件.对器件的氢传感特性测试表明,Pd/Pt合金修饰的器件的氢响应和响应(恢复)速率要优于Pd和Pt单独修饰的器件,Pd和Pt质量比为2 mg∶1 mg的氢传感器具有最佳的氢传感性能.对吸附平衡的稳态分析进一步证实了这一结论.室温下氢体积分数为0.1%,氢气通入流速为200 mL/min时,Pd/Pt(2 mg∶1 mg)样品的电流变化为0.249 mA,响应时间和恢复时间分别为41 s和42 s.此外,测试温度增加到55℃也进一步提高了器件对氢气的响应和响应速率.     

nSi/pSi0.8Ge0.2/nSi与nSi/pSi/nSi晶体管直流特性的比较

采用一维有限差分方法,对生长在Si(001)衬底上的Si0.8Ge0.2应变基区异质结双极晶体管(HBT)与Si同质结双极晶体管(BJT)的直流特性进行了数值分析;给出了高斯掺杂情形下,基区中Ge含量为0.2的Si0.8Ge0.2HBT与Si同质双极结晶体管(BJT)的共射极电流放大系数图、Gummel图、平衡能带图和基区少子分布图,对比结果表明基区中Ge的引入有效地改善了晶体管的直流放大性能;其次对Si0.8Ge0.2HBT与SiBJT的大电流特性进行了比较,证实了在大电流下异质结基区少子向集电区扩展引起的异质结势垒效应,使Si0.8Ge0.2HBT的直流放大系数比SiBJT的放大系数下降更快这一实验结果.     

砷化镓HBT的VBIC模型研究

利用国际先进的2μm InGaP/GaAs HBT工艺加工生产线进行了晶体管芯片的加工,并在器件测试的基础上开展了模型参数的提取.所研究的模型主要是针对异质结双极晶体管器件HBT特别是砷化镓异质结双极晶体管器件,在对常用的几种器件模型,如EM模型、GP模型和VBIC模型的特点做比较的基础上,详细介绍了一种基于IC-CAP系统的准确提取VBIC模型的方法.利用提取的VBIC模型对所制备器件进行了模拟仿真,仿真结果与测试结果相比较二者可以很好吻合至20GHz.     

AlGaN/GaN heterostructure field transistor for label-free detection of DNA hybridization

This paper demonstrates electrical detection of single strand deoxyribonucleic acid (ssDNA) conjugation by AlGaN/GaN hetero-structure field effect transistor (HFET) biological sensors. The probe ssDNA molecules are modified by thiol groups. The immobilization of probe molecules is achieved by S-Au bonding on a thin layer of gold film in the sensing area. The immobilization and hybridization process are firstly implemented on Si surfaces and checked by fluorescent and atomic force microscopy (AFM) imaging. The hybridization process is monitored on AlGaN/GaN HFETs. Time-dependent current change is observed when a matched ssDNA solution is applied, while no response is observed for a mismatched ssDNA sequence. The DNA hybridization process is dominated by the conjugation between matched ssDNA sequences in the first few tens of seconds. After that, the hybridization process is dominated by mass transfer processes and saturation of the immobilized probe ssDNA molecules.     

表面态对AlGaN／GaN异质结构2DEG影响的模拟分析

利用模拟软件研究施主表面态特性与AlGaN/GaN异质结构中二维电子气（2 dimensional electron gas,2DEG）形成之间的关系,分析施主表面态电离过程以及表面态能级位置、表面态密度的影响。结果表明：施主表面态为2DEG的电子来源;Al-GaN能带分布及2DEG密度随AlGaN厚度、施主表面态能级位置、施主表面态密度的改变而改变。     

Pulsed metal organic chemical vapor deposition of InAlN-based heterostructures and its application in electronic devices

As a promising group III-nitride semiconductor material, InAlN ternary alloy has been attracted increasing interest and widespread research efforts for optoelectronic and electronic applications in the last 5 years. Following a literature survey of current status and progress of InAlN- related studies, this paper provides a brief review of some recent developments in InAlN-related III-nitride research in Xidian University, which focuses on innovation of the material growth approach and device structure for electronic applications. A novel pulsed metal organic chemical vapor deposition （PMOCVD） was first adopted to epitaxy of InAlN-related heterostructures, and excellent crystalline and electrical properties were obtained. Furthermore, the first domestic InAlN-based high-electron mobility transistor （HEMT） was fabricated. Relying on the PMOCVD in combination with special GaN channel growth approach, high-quality InAlN/GaN double-channel HEMTs were successfully achieved for the first time. Additionally, other potentiality regarding to AlGaN channel was demonstrated through the successful realization of nearly lattice-matched InAlN/AlGaN heterostructures suitable for high-voltage switching applications. Finally, some advanced device structures and technologies including excellent work from several research groups around the world are summarized based on recent publications, showing the promising prospect of InAlN alloy to push group III-nitride electronic device performance even further.     

低In组分量子阱垒层AlGaN对GaN基双蓝光波长发光二极管性能的影响

采用数值分析方法对含有低In组分AlGaN垒层InGaN/GaN混合多量子阱双蓝光波长发光二极管进行模拟分析. 结果表明，这种AlGaN量子阱垒层能有效改善电子和空穴在混合多量子阱活性层中的分布均匀性及减少电子溢出，实现电子空穴在各个量子阱中的平衡辐射，从而减弱了双蓝光波长发光二极管的效率衰减. 此外，通过改变AlGaN量子阱垒层的Al组分，可以调控双蓝光波长发光二极管发射光谱的稳定性:当Al组分为0.08时，双蓝光波长发光二极管的光谱在小电流和大电流下都比较稳定，而Al组分为0.09时，光谱只在40~100 mA电流范围内比较稳定.     

闪锌矿GaN/AlGaN量子阱中激子态及带间光跃迁

基于有效质量近似,运用变分方法研究闪锌矿GaN/AlGaN量子阱中的激子态及带间光跃迁随闪锌矿GaN/AlGaN量子阱结构参数的变化关系,考虑电子与空穴在其量子阱中的有限势效应.数值计算结果显示出当量子阱的尺寸增加时,基态激子结合能和带间光跃迁能降低,而当闪锌矿GaN/AlGaN量子阱中垒层材料AlGaN中Al含量增加时,基态激子结合能和带间光跃迁能增加.     

Layered boron nitride as a release layer for mechanical transfer of GaN-based devices

Nitride semiconductors are the materials of choice for a variety of device applications, notably optoelectronics and high-frequency/high-power electronics. One important practical goal is to realize such devices on large, flexible and affordable substrates, on which direct growth of nitride semiconductors of sufficient quality is problematic. Several techniques--such as laser lift-off--have been investigated to enable the transfer of nitride devices from one substrate to another, but existing methods still have some important disadvantages. Here we demonstrate that hexagonal boron nitride (h-BN) can form a release layer that enables the mechanical transfer of gallium nitride (GaN)-based device structures onto foreign substrates. The h-BN layer serves two purposes: it acts as a buffer layer for the growth of high-quality GaN-based semiconductors, and provides a shear plane that makes it straightforward to release the resulting devices. We illustrate the potential versatility of this approach by using h-BN-buffered sapphire substrates to grow an AlGaN/GaN heterostructure with electron mobility of 1,100?cm(2)?V(-1)?s(-1), an InGaN/GaN multiple-quantum-well structure, and a multiple-quantum-well light-emitting diode. These device structures, ranging in area from five millimetres square to two centimetres square, are then mechanically released from the sapphire substrates and successfully transferred onto other substrates.     

磁控溅射生长AlN钝化层的研究

测得AlN和Si3N4介质钝化后的AlGaN/GaN异质结的高频C-V（电容-电压）曲线,由此计算钝化层与AlGaN势垒层界面电荷面密度,发现AlN钝化层与势垒层界面的电荷面密度较Si3N4更大,同时AlN钝化层薄膜含有的可移动离子数目更多.根据I-V（电流-电压）曲线讨论了用磁控溅射技术生长的AlN钝化薄膜质量,发现AlN薄膜绝缘性不够好,可能是在室温磁控溅射生长过程中从靶材溅射出的Al原子未能与N2充分反应,导致沉积的AlN薄膜不够致密,含有的电子隧穿通道多.因此可改善反应条件以提高AlN薄膜质量.     

采用高分辨XRD确定AlxGa1-xN／GaN异质结的应变状态

利用高分辨X射线衍射方法,分析了采用金属有机物汽相沉积生长的AlxGa1-xN／GaN薄膜的晶体结构和应变状态。通过（002）和（105）面的倒易空间映射,分析获得AlxGa1-xN／GaN外延层的应变程度,并且计算了不同A1组分的AlxGa1-xN／GaN在倒易空间图上的弛豫方向;同时利用Vegard原理,推导了在双轴应变下A1组分的计算方程式,得出完全应变情况下A1组分为30％,与卢瑟福背散射实验结果比较符合。     

AlGaN/InGaN/GaN双异质结构中2DEG的数值模拟

由于InGaN的物理性质,在传统AlGaN／GaN单异质结中嵌入一定厚度的InGaN层,会使二维电子气的密度提高为原来的近两倍。正是从导带差、极化效应两个方面分析了这种现象的原因,并且通过自洽求解泊松方程和薛定谔方程分别作出了AlGaN／InGaN／GaN双异质结和AlGaN／GaN单异质结的能级图以及2DEG的电子能量图,进一步解释了该现象。