作者单位: | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;Shandong Provincial Key Laboratory of Special Welding Technology, Harbin Institute of Technology (Weihai), Weihai 264209, China;Shandong Provincial Key Laboratory of Special Welding Technology, Harbin Institute of Technology (Weihai), Weihai 264209, China;Research Center for Intelligent Chips, Zhejiang Lab, Hangzhou 311121, China |