| 硫脲加速和稳定化学沉积镍的机理 |
| |
| 引用本文： | 韩克平,方景礼.硫脲加速和稳定化学沉积镍的机理[J].应用科学学报,1997,15(2):229-233. |
| |
| 作者姓名： | 韩克平 方景礼 |
| |
| 作者单位： | 南京大学 |
| |
| 摘 要： | 测定了硫脲对化学沉积镍的速度，析氢量，极化曲线和稳定电位的影响，并结合对沉积镍层的Ｘ射线光电子能谱分析探讨了硫脲对化学沉积镍过程的加速和稳定机理。
|
| 关 键 词： | 化学沉积 镍 硫脲 耐蚀性 耐磨性 |
ACCELERATION AND STABLIZATION MECHANISM OF ELECTROLESS NICKEL DEPOSITION BY THIOUREA |
| |
| HAN KEPING, FANG JINGLI.ACCELERATION AND STABLIZATION MECHANISM OF ELECTROLESS NICKEL DEPOSITION BY THIOUREA[J].Journal of Applied Sciences,1997,15(2):229-233. |
| |
| Authors: | HAN KEPING FANG JINGLI |
| |
| Abstract: | Influences of thiourea on electroless nickel deposition rate, hydrogen evolution, polarization curves and stationary potential wore determined. Together with the X-ray photoelectron spectroscopy (XPS) analysis of the deposit. the mechanism for acceleration and stabilization of electroless nickel deposition by thio-urea has been discussed. |
| |
| Keywords: | eleotroless nickel deposition acceleration stabilization mechanism thiourea |
| 本文献已被 CNKI 维普 等数据库收录！ |
