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SiO2化学机械抛光浆料的制备与性能研究
引用本文:王相田,刘伟.SiO2化学机械抛光浆料的制备与性能研究[J].华东理工大学学报(自然科学版),1998,24(6):681-685.
作者姓名:王相田  刘伟
作者单位:华东理工大学技术化学物理研究所
摘    要:研究了SiO2化学机械抛光(CMP)浆料制备过程中水溶液pH值,分散时间,搅拌转速,母液浓度,分散工艺等因素对制备及浆料性能的影响,讨论了母液法,直接法分散机理。

关 键 词:化学机械抛光  分散  二氧化硅  胶体  浆料  制备

Preparation of SiO 2 CMP Slurry and Its Properties
Wang Xiangtian ,Liu Wei,Jin Yuyao and Cheng Guangwei.Preparation of SiO 2 CMP Slurry and Its Properties[J].Journal of East China University of Science and Technology,1998,24(6):681-685.
Authors:Wang Xiangtian  Liu Wei  Jin Yuyao and Cheng Guangwei
Institution:Wang Xiangtian *,Liu Wei,Jin Yuyao and Cheng Guangwei
Abstract:It was studied that the aqueous solution's pH, the disperse time, the agitation rate, the raw slurry's concentration, the disperse process, et al. affect the preparation of silica slurry for chemical mechanical polishing and the properties of the obtained slurry. The mechanics of the direct method and the indirect method process were discussed.
Keywords:chemical  mechanical polishing  dispersion  silica  colloid  rheology  
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