High undercooling and rapid dendritic growth of Cu-Sb alloy in drop tube |
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Authors: | Yao Wenjing Xiujun Han Bingbo Wei |
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Institution: | (1) Laboratory of Materials Science in Space, Department of Applied Physics, Northwestern Polytechnical University, 710072 Xi’an, China |
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Abstract: | Droplets of Cu-20%Sb hypoeutectic alloy has been rapidly solidified in drop tube within the containerless condition. With
the decrease of droplet diameter, undercooling increases and the microstructures of primary copper dendrite refines. Undercooling
up to 207 K (0.17 T
L) is obtained in experiment. Theoretic analysis indicated that because of the broad temperature range of solidification, the
rapid growth of primary copper dendrite is controlled by the solutal diffusion. Judging from the calculation of T0 curve in the phase diagram, it is shown that the critical undercooling of segregationless solidification is δT
0 = 474 K. At the maximum undercooling of 207 K, the growth velocity of primary copper phase exceeds to 37 mm/s, and the distinct
solute trapping occurs. |
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Keywords: | drop tube rapid solidification dendritic growth high undercooling |
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