| Electroless Plating of Thin Silver Films on Porous Al2O3 Substrate and the Study of Deposition Kinetics |
| |
| 作者姓名： | Fang Mei Donglu Shi |
| |
| 作者单位： | Department of Chemical and Materials Engineering, University of Cincinnati, Cincinnati, OH 45221-0012, USA |
| |
| 摘 要： | A novel concept has been developed to coat the inner pore surfaces of reticulated alumina with a thin silver film by an electroless-plating method. As a result of coating, the porous alumina sample exhibits a sharp transition from insulating to conducting due to a thin silver layer on the inner pore surfaces. Systematic studies have been carried out to investigate the coating kinetics by employment of scanning electron microscope （SEM）, X-ray diffraction （XRD）, and computer simulation. Both coating procedures and effects of processing parameters on the quality of films are reported. Also, this paper presents the film bonding strength to the substrate, effects of sintering, and conduction mechanism of coated composite. The fundamental silver electroless-plating mechanism has been identified based on computer modeling. The simulation results indicate an excellent agreement between the silver deposition behavior and the physical model applied.
|
| 关 键 词： | 化学镀 银膜 沉积动力学 三氧化二铝基层 多孔渗水性 |
| 收稿时间： | 2005-03-16 |
| 修稿时间： | 2005-03-16 |
Electroless Plating of Thin Silver Films on Porous Al2O3 Substrate and the Study of Deposition Kinetics |
| |
| Fang Mei Donglu Shi.Electroless Plating of Thin Silver Films on Porous Al2O3 Substrate and the Study of Deposition Kinetics[J].Tsinghua Science and Technology,2005,10(6):680-689. |
| |
| Authors: | Fang Mei Donglu Shi |
| |
| Institution: | Department of Chemical and Materials Engineering, University of Cincinnati, Cincinnati, OH 45221-0012, USA |
| |
| Abstract: | A novel concept has been developed to coat the inner pore surfaces of reticulated alumina with a thin silver film by an electroless-plating method. As a result of coating, the porous alumina sample exhibits a sharp transition from insulating to conducting due to a thin silver layer on the inner pore surfaces. System- atic studies have been carried out to investigate the coating kinetics by employment of scanning electron microscope (SEM), X-ray diffraction (XRD), and computer simulation. Both coating procedures and effects of processing parameters on the quality of films are reported. Also, this paper presents the film bonding strength to the substrate, effects of sintering, and conduction mechanism of coated composite. The funda- mental silver electroless-plating mechanism has been identified based on computer modeling. The simula- tion results indicate an excellent agreement between the silver deposition behavior and the physical model applied. |
| |
| Keywords: | electroless plating thin silver films deposition kinetics |
| 本文献已被 CNKI 维普 万方数据 ScienceDirect 等数据库收录！ |
