| 低温化学镀镍的研究及其应用 |
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| 引用本文： | 章兆兰,张博,张溆,何地平.低温化学镀镍的研究及其应用[J].陕西师范大学学报,1998(4). |
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| 作者姓名： | 章兆兰 张博 张溆 何地平 |
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| 作者单位： | 陕西师范大学化学系 |
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| 摘 要： | 对低温化学镀镍溶液进行了研究，探讨了镀液主要组分和ｐＨ值对沉积速度的影响．通过溶液的调整、补充及再生，低温化学镀镍溶液可以稳定的使用．此项研究技术已用于电力电容器绝缘瓷套表面金属化的实际生产中．
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| 关 键 词： | 化学镀镍 低温 绝缘瓷套 |
Electroless nickel plating in low temperature |
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| Zhang Zhaolan,Zhang Bo,Zhang Xu,He Diping.Electroless nickel plating in low temperature[J].Journal of Shaanxi Normal University: Nat Sci Ed,1998(4). |
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| Authors: | Zhang Zhaolan Zhang Bo Zhang Xu He Diping |
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| Abstract: | The low temperature nickel plating solution is studied. The main composition of plating solution and the effect of pH on deposit speed are discussed. Through solution of adjustment, supply and revival, the electroless nickel plating solution can be used stably. The technology applied successfully in the production of the metallization for insulated porcelain sleeve on the surface of the power capacitor. |
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| Keywords: | electroless nickel plating low temperature insulated porcelain sleeve |
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