| BGA焊点空洞缺陷的数学形态学分析 |
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| 引用本文： | 张俊生,王明泉 郭晋秦 楼国红.BGA焊点空洞缺陷的数学形态学分析[J].科学技术与工程,2018,18(2). |
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| 作者姓名： | 张俊生 王明泉 郭晋秦 楼国红 |
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| 作者单位： | 中北大学信息与通信工程学院,中北大学信息与通信工程学院 |
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| 基金项目： | 国家重大科学仪器设备开发专项(2013YQ240803) 山西省科技攻关项目(20140321010-02,201603D121040-1) 山西省高等学校科技创新项目(2013163) |
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| 摘 要： | BGA焊点焊接过程中容易产生气泡,形成空洞缺陷,检测时如何自动分析一直是个难题。提出使用Otsu算法分割焊球,使用数学形态学中的开闭运算、顶帽变换提取空洞缺陷的技术方案,实现每个焊点空洞缺陷的准确提取和自动分析。实验结果表明,提出的技术方案鲁棒性强,可应用于BGA焊点的空洞缺陷检测。
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| 关 键 词： | BGA 空洞缺陷 Otsu算法 数学形态学 |
| 收稿时间： | 2017/5/2 0:00:00 |
| 修稿时间： | 2017/6/13 0:00:00 |
Analysis of Void Defects in BGA Solder Joints with Mathematical Morphology |
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| Institution: | School of Information and Communication Engineering, North University of China, |
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| Abstract: | In the welding process of BGA solder joints,it is easy to produce bubbles and form void defects which are difficult to analysis automatically during testing.A technique solution is proposed that the solder balls are separated by OTSU algorithm,the void defects are segmented by the open and close operations and the top-hat transform of mathematical morphology.The solution can be used to achieve the seamless extraction of void defects and automatic analysis in each solder ball.The experimental results show that the proposed scheme is robust and can be applied to detection of void defects in BGA solder joints. |
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| Keywords: | BGA void defect OTSU algorithm mathematical morphology |
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