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基于E型圆膜片的复合差动谐振式敏感元件
引用本文:樊尚春,乔少杰.基于E型圆膜片的复合差动谐振式敏感元件[J].科学技术与工程,2005,5(5):313-315.
作者姓名:樊尚春  乔少杰
作者单位:北京航空航天大学仪器学院,测控与信息技术系,北京,100083
基金项目:国家自然科学基金(50275009)和航空科学基金(02I51018)资助
摘    要:对以E型圆膜片为一次敏感元件、一对对称的硅梁谐振子为二次敏感元件的复合差动敏感元件的力学特性进行了分析。给出了其敏感压力、差压、集中力与加速度时,梁谐振子固有频率随被测量变化的解析计算模型。

关 键 词:E型圆膜片  硅微传感器  谐振式传感器  差动检测
文章编号:1671-1815(2005)05-0313-03
修稿时间:2004年11月12

The Thermally Excited Resonant Silicon Micro Structural Pressure Sensor
FAN Shangchun,QIAO Shaojie.The Thermally Excited Resonant Silicon Micro Structural Pressure Sensor[J].Science Technology and Engineering,2005,5(5):313-315.
Authors:FAN Shangchun  QIAO Shaojie
Abstract:Based on a novel resonant sensitive micro structure, whose preliminary sensing component is an E-type round diaphragm and the final sensing component is a pair of beam resonators which are located at the inner and outer edges of the E-type round diaphragm, respectively. The unique advantage of this sensing structure is that the differential measuring mechanism can be realized and some measurands, such as absolute pressure, differential pressure, concentrated force and the acceleration. The relationship between the natural frequencies of the beam resonators and the measurands are presented.
Keywords:E-type round diaphragm silicon micro sensor resonant sensor differential measure
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