| 谷物颗粒干燥过程中胀裂成因分析 |
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| 引用本文： | 曹伟,刘嘉智.谷物颗粒干燥过程中胀裂成因分析[J].天津大学学报(自然科学与工程技术版),1996,29(6):901-906. |
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| 作者姓名： | 曹伟 刘嘉智 |
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| 基金项目： | 国家自然科学基金,天津市科委基金 |
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| 摘 要： | 利用弹性力学理论针对典型谷物颗粒玉米在干燥过程中由于温度变化产生的温度应力进行了研究，确立了颗粒内部温度应力分布，并进而对胀缩与胀裂的成因加以分析。
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| 关 键 词： | 温度应力 胀裂 玉米 干燥 禾谷类作物 |
INVESTIGATION OF THERMAL STRESS WITHIN KERNEL DURING CORN DRYING |
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| Cao Wei,Liu Jiazhi, Meng Xianling,Feng Shuli, Chu Zhide.INVESTIGATION OF THERMAL STRESS WITHIN KERNEL DURING CORN DRYING[J].Journal of Tianjin University(Science and Technology),1996,29(6):901-906. |
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| Authors: | Cao Wei Liu Jiazhi Meng Xianling Feng Shuli Chu Zhide |
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| Institution: | Dept.of the Thermal Energy |
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| Abstract: | y using the elasticity method we studied the thermal stress caused by temperature changing within the corn henal during corn drying.We determined the thermal stress distribution and analyzed the cause of the cracking within the corn kernel. |
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| Keywords: | thermal-stress crack corn |
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