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退火温度对Ag-MgF2 颗粒膜结构和内应力的影响
引用本文:李爱侠,孙大明,孙兆奇,宋学萍,刘艳美,赵宗彦,杨坤堂.退火温度对Ag-MgF2 颗粒膜结构和内应力的影响[J].安徽大学学报(自然科学版),2002,26(4):40-45.
作者姓名:李爱侠  孙大明  孙兆奇  宋学萍  刘艳美  赵宗彦  杨坤堂
作者单位:安徽大学,物理系,安徽,合肥,230039
基金项目:国家自然科学基金;59972001;
摘    要:报道用电子薄膜应力分布测试仪测量退火温度对Ag-MgF2复合颗粒薄膜内应力的影响,结果表明,退火温度在400℃,薄膜平均应力最小,应力分布比较均匀.XRD分析表明,Ag-MgF2复合颗粒薄膜的内应力主要来自Ag晶粒的生长过程,当Ag的晶格常数接近块体时(400℃温度退火60分钟),Ag-MgF2薄膜内应力最小.

关 键 词:Ag-MgF2复合颗粒薄膜  应力  退火温度  微结构
文章编号:1000-2162(2002)04-0040-06

Effect of anealing temperature on microstructure and residual stress in Ag-MgF2 complex grain films
LI Ai-xia,SUN Da-ming,SUN Zhao-qi,SONG Xue-ping,LIU Yan-mei,ZHAO Zong-yan,YANG Kun-tang.Effect of anealing temperature on microstructure and residual stress in Ag-MgF2 complex grain films[J].Journal of Anhui University(Natural Sciences),2002,26(4):40-45.
Authors:LI Ai-xia  SUN Da-ming  SUN Zhao-qi  SONG Xue-ping  LIU Yan-mei  ZHAO Zong-yan  YANG Kun-tang
Abstract:This paper has investigated the effect of anealing on the residual stress and microstructure of Ag-MgF 2 complex grain films prepared by vapor deposition. X-ray diffraction (XRD) technique was employed to study the microstructure of the films. The results show that the average stress comes from growth of Ag grain, when the crystal lattice constants of Ag approach to the bulk values,the average stress of film is the least at 400℃ anealing temperature.
Keywords:Ag-MgF  2 complex grain film  stress  anealing temperature  microstructure
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