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薄膜X射线应力分析技术的研究
引用本文:杨于兴,胡赓祥.薄膜X射线应力分析技术的研究[J].上海交通大学学报,1994,28(6):52-58.
作者姓名:杨于兴  胡赓祥
摘    要:由于X射线薄膜衍射几何的特点,致使薄膜X射线应力分析的精度很难达到常规应力分析水平,本研究采用真空光,内标校正的途径来提高薄膜X射线应力分析的精度,同时,为了测定薄膜生长过程中的生长应力,文中还介绍了高温薄膜应力分析的技术。

关 键 词:薄膜  X射线衍射  生长应力  氧化膜

The Study of Thin Film X-ray Stress Analysis
Yang Yuxing,Hu Gengxiang.The Study of Thin Film X-ray Stress Analysis[J].Journal of Shanghai Jiaotong University,1994,28(6):52-58.
Authors:Yang Yuxing  Hu Gengxiang
Institution:Yang Yuxing;Hu Gengxiang
Abstract:It is difficult to get the same precision of thin film X-ray stress analysis(TFXSA)as the conventional stress analysis, due to the characteristic of thin film X-ray diffraction geometry.The preci of TFXSA may be improved by vacuum slit and internal standard calibration described in this article. At the same time,the stress analysis of high temperature oxide scales is introduced briefly in the paper, in order to determining the growth stresses in growing oxide scales.
Keywords:thin film  X-ray diffraction  growth stress  oxide scales
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