| 多芯片组件中带裂缝电源/接地板同步开关噪声分析 |
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| 引用本文： | 王德东,李征帆.多芯片组件中带裂缝电源/接地板同步开关噪声分析[J].上海交通大学学报,2002,36(12):1785-1787. |
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| 作者姓名： | 王德东 李征帆 |
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| 作者单位： | 上海交通大学,电子工程系,上海,200030 |
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| 基金项目： | 国家自然科学基金资助项目 (6993 10 2 0 ) |
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| 摘 要： | 电源接地板上的同步开关噪声是制约高速电路发展的瓶颈，而目前同步开关噪声分析集中于规则电源接地板，与实际电路有一定差距。文中基于部分等效元方法分析多芯片组件中带裂缝的电源/接地板上的同步开关噪声；对不同尺寸位置的裂缝引起的同步开关噪声进行相应的时域模拟，得出了多芯片组件中电源/接地板上裂缝对同步开关噪声的影响。
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| 关 键 词： | 裂缝 电源／接地板 多芯片组件 同步开关噪声 部分等效元法 时域模拟 集成电路 |
| 文章编号： | 1006-2467(2002)12-1785-03 |
Analysis of the Voltage Bounce on Power/Ground Planes with Aperture and Slit |
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| WANG De-dong,LI Zheng-fan.Analysis of the Voltage Bounce on Power/Ground Planes with Aperture and Slit[J].Journal of Shanghai Jiaotong University,2002,36(12):1785-1787. |
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| Authors: | WANG De-dong LI Zheng-fan |
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| Abstract: | With the increase of ICs speed, the power/ground voltage bounces on the power gound planes pair of the multi chip module becomes the bottleneck of the development of high speed ICs. The current study of the power/ground voltage bounces is focused on the regular planes. In this paper, the effect of the apertures on MCM's power/ground planes was analyzed, it mainly increases the voltage bounces on the power/ground planes of MCMs, this effect is evaluated by using the PEEC model of such power/ground system. |
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| Keywords: | multi chip module (MCM) power/ground voltage bounces partial-element equivalent circuit (PEEC) |
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