| 革命性的框架封装解决方案 |
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| 引用本文： | 朱琪.革命性的框架封装解决方案[J].中国西部科技,2012(12):8-9. |
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| 作者姓名： | 朱琪 |
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| 作者单位： | 江苏长电科技股份有限公司,江苏江阴214437 |
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| 摘 要： | MIS框架是基于电镀堆积和预塑封技术的框架制作工艺,基于预塑封料的底部支撑和电镀掩膜的密间距和延伸特性,决定了其对于Chip On Lead和Flip Chip等产品具有独特的优势,并已对QFN/QFP/BGA等传统封装方式形成了强而有力的竞争。
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| 关 键 词： | MIS 预塑封 Chip On Lead FAN-IN RE-ROUTE |
The Introduction of Molded Interconnected System |
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| ZHU Qi.The Introduction of Molded Interconnected System[J].Science and Technology of West China,2012(12):8-9. |
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| Authors: | ZHU Qi |
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| Abstract: | MIS is a LF manufacturing solution based on pre-mold and plating stack up technology. Solid supported by pre-mold compound and fine pitch film flexibility demonstrated unique advantage over COL and FC semiconductors. MIS package has formed a strong market competition to traditional QFN/QFP/BGA packages. |
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| Keywords: | MIS Pre-molding Chip On Lead Fan-IN RE-ROUTE |
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