电子器件灌封材料的现状及发展趋势

介绍了电子器件灌封材料的种类,阐述了环氧、有机硅灌封材料的组成、特性、应用现状、存在的问题及其性能优化改性的方法。分析了传统灌封材料的缺陷,指出了研制绝缘导热灌封材料的作用。采用对有机硅进行接枝改性并用AlN作为无机填料制成复合灌封材料的方案,指出了电子器件灌封材料的发展趋势。

Present Situation and Development Trend of Potting Materials Using in Electron Device

This paper introduces the kinds of potting materials for electron devices.It elaborates the component,properties,application status,existing problems and method to improve the properties of epoxy potting materials and organic-silicon potting materials.One analyzes the defects of the traditional potting materials and points out the goal and meaning to investigate the insulating heat conduction materials.It uses organic-silicon and inorganic filling AlN powders to fabricate the compound materials.One points out the development trend of potting materials for electron device.