| 硅片的抗弯强度及其与高温抗形变能力的关系 |
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| 引用本文： | 谢书银,石志仪,余思明.硅片的抗弯强度及其与高温抗形变能力的关系[J].中南大学学报(自然科学版),1995(2). |
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| 作者姓名： | 谢书银 石志仪 余思明 |
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| 作者单位： | 中南工业大学应用物理与热能工程系 |
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| 基金项目： | 国家教委硅材料国家重点实验室基金 |
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| 摘 要： | 通过实验系统地研究了硅中氧、氮、碳含量和状态以及硅片表面损伤对室温下硅片抗弯强度的影响规律，讨论了室温抗弯强度与高温抗形变能力之间的内在联系，提出了室温抗弯强度大小可以反映硅片高温抗形变能力的观点。
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| 关 键 词： | 硅，抗弯强度，形变 |
THE FLEXURE STRENGTH OF SILICON AFER AND THE RELATION BETWEEN IT AND ANTI-DEFORMATION ABLITY AT HIGH TEMPERATURE |
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| Xie Shuyin ,Shi Zhiyi,She Siming.THE FLEXURE STRENGTH OF SILICON AFER AND THE RELATION BETWEEN IT AND ANTI-DEFORMATION ABLITY AT HIGH TEMPERATURE[J].Journal of Central South University:Science and Technology,1995(2). |
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| Authors: | Xie Shuyin Shi Zhiyi She Siming |
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| Abstract: | The effects of oxygen,nitrogen,carbon content and their configuration and surfacedamage on flexure strength of silcon wafer at room-temperature have been investigatedthrough experiments. The inherent relations between the flexure strength and ability of anti-deformation at high temperature of silicon wafer have been discussed.From these results webelieve that the flexure strength of silicon wafer may reflects its alility of anti-deformation athigh temperature to a certain degree. |
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| Keywords: | silicon flexure strength deformation |
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