| Relative damage stress and its application in the case of temperature cycling load |
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| 作者姓名： | MA Xin QIAN Yiyu YOSHIDA F. |
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| 作者单位： | State Key Laboratory of Welding, Harbin Institute of Technology, Harbin 150001, China,State Key Laboratory of Welding, Harbin Institute of Technology, Harbin 150001, China,Department of Mechanical Engineering, Hiroshima University, Higashi-Hiroshima 739, Japan |
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| 基金项目： | Currently with the State Key Laboratory of Reliability Physics of Electronic Products, Guangzhou 510610, China |
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| 摘 要： | Void damage is the main failure characteristics of constrained ductile metal foil. In order to evaluate the mechanical response of ductile metal under different temperatures, the concept of equivalent damage stress proposed by Lemaitre is modified by temperature normalization. A new concept of relative damage stress is advanced, and in the light of this concept, a reasonable explanation is given to the thermal fatigue life data of solder joints under temperature cycling.
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| 关 键 词： | damage stress temperature cycling load solder joint |
Relative damage stress and its application in the case of temperature cycling load |
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| MA Xin,QIAN Yiyu,YOSHIDA F..Relative damage stress and its application in the case of temperature cycling load[J].Progress in Natural Science,2001,11(2):156-160. |
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| Authors: | MA Xin Qian Yiyu YOSHIDA F |
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| Institution: | 1. State Key Laboratory of Welding, Harbin Institute of Technology, Harbin 150001, China
2. Department of Mechanical Engineering, Hiroshima University, Higashi-Hiroshima 739, Japan |
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| Abstract: | Void damage is the main failure characteristics of constrained ductile metal foil. In order to evaluate the mechanical response of ductile metal under different temperatures, the concept of equivalent damage stress proposed by Lemaitre is modified by temperature normalization. A new concept of relative damage stress is advanced, and in the light of this concept, a reasonable explanation is given to the thermal fatigue life data of solder joints under temperature cycling. |
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| Keywords: | damage stress temperature cycling load solder joint |
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