| 基于TOPSIS法的电路板拆卸元器件加热方法评价 |
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| 引用本文： | 宋守许,刘伟国,刘光复,刘志峰.基于TOPSIS法的电路板拆卸元器件加热方法评价[J].合肥工业大学学报(自然科学版),2009,32(7). |
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| 作者姓名： | 宋守许 刘伟国 刘光复 刘志峰 |
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| 作者单位： | 合肥工业大学,机械与汽车工程学院,安徽,合肥,230009 |
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| 基金项目： | 国家科技支撑计划子课题 |
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| 摘 要： | 拆卸电路板上元器件所用的加热方法有热风加热、红外线加热、液体加热和激光加热.文章利用TOPSIS法比较了这几种加热方法,建立了指标评价体系和评价模型,运用三标度法确定评价指标权重,最后对这几种方案进行优先排序,结果为:液体加热>红外线加热>激光加热>空气加热.
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| 关 键 词： | 电路板 指标评价体系 TOPSIS法 三标度法 |
Study of heating methods for disassembling components on PCBs based on TOPSIS |
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| SONG Shou-xu,LIU Wei-guo,LIU Guang-fu,LIU Zhi-feng.Study of heating methods for disassembling components on PCBs based on TOPSIS[J].Journal of Hefei University of Technology(Natural Science),2009,32(7). |
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| Authors: | SONG Shou-xu LIU Wei-guo LIU Guang-fu LIU Zhi-feng |
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| Abstract: | In order to disassemble components on PCBs, four methods of heating PCBs are introduced,including the hot-air way,the infrared way,the hot-liquid way, and the laser way. This paper adopts the TOPSIS method to compare these different ways. An evaluation index system and an evaluation model are set up. The three-scale method is used to decide the indicators' weight. A priority order of the four methods is given as follows: hot-liquid> infrared> laser> hot-air. |
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| Keywords: | printed circuit board(PCB) evaluation index system TOPSIS method three-scale method |
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