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填充型高分子复合材料导热性能研究
引用本文:张雷,李冬光.填充型高分子复合材料导热性能研究[J].郑州大学学报(理学版),2006,38(1):105-109.
作者姓名:张雷  李冬光
作者单位:河南工业大学化学化工学院,郑州,450005
基金项目:河南省科技攻关项目,编号0324260107
摘    要:分析了填充型高分子复合材料的导热机理,并预测复合材料导热系数的数学模型.指出当前高分子导热复合材料研究中存在的问题,提出未来导热高分子复合材料的开发方向,即开发具有高导热系数的纳米填充物,利用纳米复合技术提高其综合性能;改进表面处理方法,对填充物表面进行改性.

关 键 词:复合材料  导热系数  导热机理  导热模型
文章编号:1671-6841(2006)01-0105-05
收稿时间:11 3 2005 12:00AM
修稿时间:2005年11月3日

Thermal Conductivity of Filled Polymer Composites
ZHANG Lei,LI Dong-guang.Thermal Conductivity of Filled Polymer Composites[J].Journal of Zhengzhou University:Natural Science Edition,2006,38(1):105-109.
Authors:ZHANG Lei  LI Dong-guang
Institution:School of Chemistry and Chemical Engineering, Henan University of Technology , Zhengzhou 450005,China
Abstract:Thermally conductive mechanism and models that can predict the thermal conductivity of filled polymer composites are introduced.According to the current conditions,the future study and development of filled polymer composites are also analyzed.Nanometer composites with high coefficient of thermal conductivity could be used to improve the combination properties of the filled polymer composites,and the surface treatment method of filling materials should be improved.
Keywords:composite  thermal conductivity  thermally conductive mechanism  thermally conductive model
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