| CBGA组件热变形的2D-Plane 42模型有限元分析 |
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| 引用本文： | 耿照新,杨玉萍.CBGA组件热变形的2D-Plane 42模型有限元分析[J].首都师范大学学报(自然科学版),2003,24(2):29-32. |
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| 作者姓名： | 耿照新 杨玉萍 |
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| 作者单位： | 1. 首都师范大学物理系,北京,100037
2. 中国科学院物理所,北京,100080 |
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| 摘 要： | 本文介绍有限元中的 2D Plane4 2模型在CBGA组件热变形中的应用 ,利用有限元的模拟CBGA组件的应变、应力的分布 ,通过模拟表明有限元法是研究微电子封装中BGA焊点、CBGA组件的可靠性的方法
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| 关 键 词： | CBGA 热变形 应变 应力 有限元 |
| 修稿时间： | 2002年11月5日 |
2-D PLANE42 Model of Finite Element Simulation Analysis in Thermal Deformation of CBGA Assembly |
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| Geng Zhaoxin.2-D PLANE42 Model of Finite Element Simulation Analysis in Thermal Deformation of CBGA Assembly[J].Journal of Capital Normal University(Natural Science Edition),2003,24(2):29-32. |
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| Authors: | Geng Zhaoxin |
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| Abstract: | In this paper, 2 D PLANE42 model of finite element simulation analysis is used in thermal deformation of ceramic ball grid array(CBGA), the finite element method is employed to simulate distribution of strain and stress of CBGA the simulation indicate the finite element simulation analysis is a reliability method in studying the solder joint of ball grid array (BGA) and CBGA Assembly of microelectronics package. |
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| Keywords: | CBGA Thermal deformation strain stress finite element simulation |
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